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| Number | Title | Issue Date |
| 8048282 | Apparatus and method for plating a substrate A plating apparatus and method bubbles generated at the plating surfaces easily removed and the uniformity of the thickness of the plated film within the plated surface can be improved. The plating apparatus has a cassette table for loading a cassette in which a sub... | 11/01/2011 |
| 8048283 | Method and apparatus for plating semiconductor wafers First and second electrodes are disposed at first and second locations, respectively, proximate to a periphery of a wafer support, wherein the first and second location are substantially opposed to each other relative to the wafer support. Each of the first and seco... | 11/01/2011 |
| 7955486 | Electrochemical deposition platform for nanostructure fabrication Probe-based methods are provided for formation of one or more nano-sized or micro-sized elongated structures such as wires or tubes. The structures extend at least partially upwards from the surface of a substrate, and may extend fully upward from the substrate surf... | 06/07/2011 |
| 7713398 | Selective plating apparatus and selective plating method A selective plating apparatus for applying selective electrolytic plating to a metal member includes: a mask member having a recess portion so that a space is formed to which predetermined parts of a surface of the metal member are exposed when the mask member is at... | 05/11/2010 |
| 7615141 | Electrochemical micromanufacturing system and method An electrochemical printing system (100, 200) and method are disclosed having a printer head (130, 230) that expels a small jet of electrolyte (112) towards a conductive substrate (92) to facilitate electrodeposition or removal of materia... | 11/10/2009 |
| 7425256 | Selective shield/material flow mechanism An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the w... | 09/16/2008 |
| 7396439 | Method and apparatus for an anodic treatment A method and apparatus for anodizing a component. The component is placed in a container having first and second seal members that seal an annular surface of the component to be anodized. The first and second seal members, the annular surface of the component, and a... | 07/08/2008 |
| 7387717 | Method of performing electrolytic treatment on a conductive layer of a substrate A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surfac... | 06/17/2008 |
| 7288179 | Method for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing A method and apparatus for transmitting electrical signals and fluids to and/or from a microelectronic workpiece. An apparatus in accordance with one embodiment of the invention includes a shaft rotatable about a shaft axis and having a first end with a first electr... | 10/30/2007 |
| 7288177 | Selective shield/material flow mechanism An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the w... | 10/30/2007 |
| 7285202 | Method for electroplating a cylindrical inside surface of a work-piece-extending substantially over a semi-circle A method is described for electroplating a cylindrical inside surface (4) of a work-piece (3) extending substantially over a semi-circle, with an electrolyte being conveyed from a bath (8) in a circulation through a gap (9) between the in... | 10/23/2007 |
| 7247563 | Filling high aspect ratio openings by enhanced electrochemical deposition (ECD) One embodiment of the invention is a method for void-free filling with a metal or an alloy inside openings by electrochemical deposition (ECD), said method including steps of: (a) providing a substrate with at least one opening and a field surrounding the at least o... | 07/24/2007 |
| 7244347 | Method and system to provide electrical contacts for electrotreating processes Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented. ... | 07/17/2007 |
| 7239747 | Method and system for locating position in printed texts and delivering multimedia information Apparatus and methods are disclosed for processing printed material to provide an index of locations within the printed material that can be associated with external actions such as displaying a graphical image, providing an audio or video output, or providing a mul... | 07/03/2007 |
| 7211174 | Method and system to provide electrical contacts for electrotreating processes Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented. ... | 05/01/2007 |
| 7211186 | Method and system to provide electrical contacts for electrotreating processes Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented. ... | 05/01/2007 |
| 7204917 | Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same The present invention is directed to a top surface of a workpiece surface influencing device and a method of using the same. The top surface of the workpiece surface influencing device is adapted for use in an electrochemical mechanical processing apparatus in which... | 04/17/2007 |
| 7201828 | Planar plating apparatus An apparatus for performing an electrochemical process on a surface of a workpiece comprises a platen assembly comprising a support platen, an electrolyte distribution plate, and a first conductive layer intermediate the support platen and distribution plate and con... | 04/10/2007 |
| 7144489 | Photochemical reduction of Fe(III) for electroless or electrodeposition of iron alloys A method of photochemically reducing iron(III) species in an iron or iron alloy plating solution by adding an additive to the electroplating solution; contacting the additive with iron(III) species to form an iron(III)-additive species; and irradiating the electropl... | 12/05/2006 |
| 7122105 | Use of siderophores to increase the current efficiency of iron plating solutions A method of electroplating iron or an iron alloy with a solution containing an iron-chelating agent to catalytically cycle the undesirable Fe(III) species back to Fe(II) for electroplating. The iron-chelating agents may be siderophores, specifically, for example, de... | 10/17/2006 |
| 7090750 | Plating An apparatus and method for treating a substrate to deposit, clean or etch material on a substrate using a first horizontal chuck to which a plurality of substrates is attached and electrically charged. Spaced closely to the first horizontal chuck is a coextensive h... | 08/15/2006 |
| 7041401 | Magnetically modified electrodes containing at least one catalyst component that mediates a subatomic particle transfer process Disclosed are magnetically modified electrodes containing at least one catalyst component that mediates a subatomic particle transfer process. Also disclosed are magnetically modified electrodes containing metalloproteins (metalloenzymes). ... | 05/09/2006 |
| 7029567 | Electrochemical edge and bevel cleaning process and system An edge cleaning system and method is disclosed in which a directed stream of a mild etching solution is supplied to an edge area of a rotating workpiece, including the front surface edge and bevel, while a potential difference between the workpiece and the directed... | 04/18/2006 |
| 7001498 | Electroplating apparatus and four mask TFT array process with electroplated metal An electroplating apparatus, in accordance with the present invention, includes a plurality of chambers. A first chamber includes an anode therein. The first chamber has an opening for delivering an electrolytic solution containing metal ions onto a surface to be el... | 02/21/2006 |
| 6991717 | Web processing method and apparatus The present invention relates to a web handling apparatus and process ideally suited for applications involving wet chemistry. The invention involves the horizontal processing of webs in processing containers. The web is redirected into the processing container by i... | 01/31/2006 |
| 6984302 | Electroplating cell based upon rotational plating solution flow The invention discloses a method of electroplating a material onto a semiconductor substrate. A substrate is placed in a cylindrical processing chamber enclosure. A nozzle for spraying a liquid electroplating solution opposes the top surface of the substrate. The el... | 01/10/2006 |
| 6942780 | Method and apparatus for processing a substrate with minimal edge exclusion An apparatus for processing a material on a wafer surface includes a cavity defined by a peripheral wall and configured to direct a process solution and direct it to the surface to to a first wafer surface region without being directed to a second wafer surface regi... | 09/13/2005 |
| 6926817 | Solution processing apparatus and solution processing method A plating apparatus includes a plating solution tank which stores a plating solution, a holder including an inner space to house a wafer and an opening for the wafer to be in contact with the plating solution, and a nitrogen supplying mechanism to supply nitrogen to... | 08/09/2005 |
| 6916413 | Electro-plating apparatus and method Electroplating station S has a head 1 with anode 2, to one side of which there is located an electrically neutral wall 3. The width of anode 2 is provided to accommodate the width of web 6. Serrations 9 are provided on the a... | 07/12/2005 |
| 6909350 | Inductor and method for producing the same A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a c... | 06/21/2005 |
| 6896786 | Method and device for producing wear resisting surfaces A process for the production of wear-resistant, coated surfaces includes the use of at least two electrodes connected to a voltages source which are mounted in, or border, a reaction space through which an electrolyte flows in which the surface to be coated is locat... | 05/24/2005 |
| 6869515 | Enhanced electrochemical deposition (ECD) filling of high aspect ratio openings Embodiments of the present invention provide methods for enhancing void-free metallic filling of narrow openings by electrochemical deposition (ECD). The methods provide enhanced replenishment of plating inhibitor at the field, while depleting the inhibitor inside n... | 03/22/2005 |
| 6833063 | Electrochemical edge and bevel cleaning process and system The present invention provides an edge cleaning system and method in which a directed stream of a mild etching solution is supplied to an edge area of a rotating workpiece, including the front surface edge and bevel, while a potential difference between the workpiec... | 12/21/2004 |
| 6818115 | System and method for electrolytic plating The present invention includes an electrolytic plating system with an elecrolytic plating bath, means for positioning the printed circuit boards in the bath, and means to alternately generate a laminar flow of electrolyte on each side of the printed circuit boards. ... | 11/16/2004 |
| 6814851 | Method and apparatus for an anodic treatment A method and apparatus for anodizing a component. The component is placed in a container having a supply port, a drain port and a supply passage. The supply passage faced on a surface of the component to be anodized. A reaction medium is supplied from the supply por... | 11/09/2004 |
| 6800187 | Clamshell apparatus for electrochemically treating wafers An apparatus for engaging a work piece during plating facilitates electrolyte flow during a plating operation. The apparatus helps to control the plating solution fluid dynamics and electric field shape to keep the wafer's local plating environment uniform and bubbl... | 10/05/2004 |
| 6780302 | Process for electrochemical treatment of a continuous web A process for use in a continuous electrochemical treating line for electrochemically treating at least one surface of a continuous web moving through an electrolyte solution contained within a tank. The process includes the steps of providing at least one electrode... | 08/24/2004 |
| 6776885 | Integrated plating and planarization apparatus having a variable-diameter counterelectrode An apparatus for plating and planarizing metal on a substrate includes a plurality of dispensing segments, each having at least one hole for dispensing electroplating solution onto the substrate. The dispensing segments form a circular counterelectrode and are movab... | 08/17/2004 |
| 6746578 | Selective shield/material flow mechanism An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the w... | 06/08/2004 |
| 6685815 | Electroplating of semiconductor wafers An electro-chemical deposition apparatus and method are generally provided. In one embodiment of the invention, an electro-chemical deposition apparatus includes a housing having a substrate support disposed therein and adapted to rotate a substrate. One ... | 02/03/2004 |
