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| Number | Title | Issue Date |
| RE40218 | Electro-chemical deposition system and method of electroplating on substrates The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto metal seede... | 04/08/2008 |
| 7325294 | Method of making electromagnetic wave shielded write and read wires on a support for a magnetic media drive A method of making electromagnetic wave shielded read and write wires is provided. The method includes forming a bottom insulation layer on a bottom shield layer formed on a substrate. Then, forming electrically conductive wire material into openings in a first form... | 02/05/2008 |
| 7323094 | Process for depositing a layer of material on a substrate An electroplating system (30) and process makes electrical current density across a semiconductor device substrate (20) surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. The electrical curr... | 01/29/2008 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7285202 | Method for electroplating a cylindrical inside surface of a work-piece-extending substantially over a semi-circle A method is described for electroplating a cylindrical inside surface (4) of a work-piece (3) extending substantially over a semi-circle, with an electrolyte being conveyed from a bath (8) in a circulation through a gap (9) between the in... | 10/23/2007 |
| 7215014 | Solderable metal finish for integrated circuit package leads and method for forming A packaged integrated circuit includes a die surrounded by an encapsulant in which leads are used to electrically connect the die, which is internal to the encapsulant, externally. The leads have a primary metal that is used for electrical conduction and physical su... | 05/08/2007 |
| 7208073 | Media for use in plating electronic components Improvements in methods for plating metal on substrates are obtained by providing media in the plating solution in sizes that are less than 60% to 80% smaller than the average dimension of the substrates to be plated. It is also advantageous for the substrates and m... | 04/24/2007 |
| 7070688 | Electroplating tool and method for selective plating A tool for electroplating a portion of the surface of each of a plurality of pieces includes a first plate having a plurality of holes, and a second plate having a plurality of retaining elements. Each of the holes is configured to receive a piece that is to be elec... | 07/04/2006 |
| 6979239 | Plating of brazed RF connectors for T/R modules Slots or apertures are formed in the connector shroud of a T/R module in a plane perpendicular to the axis of the connector so as to allow plating solution to flow freely through the entire inner portion of the connector, particularly the rear portion, during fabric... | 12/27/2005 |
| 6911128 | Device for decontamination of water The invention relates to a device for the decontamination of water, particularly of heavy metals and/or arsenic and/or their compounds, by means of electrolysis, wherein the water to be purified is fed through a receptacle and passes by electrodes of different polar... | 06/28/2005 |
| 6896783 | Method for producing material libraries by means of electrochemical deposition The invention relates to a method for combinatorially producing a library of materials by means of an electrochemical deposition in an array. The inventive library is made from an array of containers that consist of an electroconductive material, are open to the top... | 05/24/2005 |
| 6841191 | Varistor and fabricating method of zinc phosphate insulation for the same A fabricating method and apparatus of an zinc phosphate coating for a varistor has a insulation formed on a surface of a body which does not include two opposite ends of the body formed two outer terminals. The insulation has anti-etch feature for the electrolyte, s... | 01/11/2005 |
| 6599412 | In-situ cleaning processes for semiconductor electroplating electrodes Methods and apparatuses for in-situ cleaning of semiconductor electroplating electrodes to remove plating metal without requiring !the manual removal of the electrodes from the semiconductor plating equipment. The electrode is placed into the plating liqu... | 07/29/2003 |
| 6527935 | Process for electroplating pins of an integrated circuit package An apparatus and process for electroplating a pin grid array device having a plurality of pins, the pins having a side surface and an extremity. The apparatus comprises a contact plate defining a plane and having a plurality of electrically conductive fle... | 03/04/2003 |
| 6500324 | Process for depositing a layer of material on a substrate An electroplating system (30) and process makes electrical current density across, a semiconductor device substrate (20) surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. The electrical curren... | 12/31/2002 |
| 6475368 | Method of aqueous anodizing aluminum substrates of solid capacitors A method of anodizing an aluminum substrate comprising heating the substrate to a first temperature of 200° C. to about 380° C.; suspending the substrate into a first electrolyte and applying a first anodizing current to the first electrolyte; rinsing t... | 11/05/2002 |
| 6399153 | Method and apparatus for air masking portion of component during plating or coating A method and an apparatus for restricting the areas of contact between components to be plated or coated and liquid solutions containing plating or coating agents, without the use of masking tape. Components made of electrically conductive material are su... | 06/04/2002 |
| 6322684 | Apparatus and method for electroplating or electroetching a substrate An apparatus is disclosed having at least one cathode adapted to maintain a line of contact with at least one substrate surface during relative movement therebetween. There is at least one anode located in a spaced relationship to the cathode and an elect... | 11/27/2001 |
| 6287444 | Method for producing very small metal ball An efficient method for producing a high-precision, very small metal ball, such as a Cu ball having an outer diameter not greater than 1 mm, comprising the steps of: cutting metal wire having a diameter not greater than 0.3 mm into a predetermined length;... | 09/11/2001 |
| 6261433 | Electro-chemical deposition system and method of electroplating on substrates The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto ... | 07/17/2001 |
| 6176995 | Method and apparatus for electrolytically metallizing or etching material The current density with which the process is used is of essential importance for the economy of a method of electrolytically treating materials. Normally only low or medium current densities are used, as the speed of replacement of consumed materials in ... | 01/23/2001 |
| 6149791 | Process and apparatus for the selective electroplating of electrical contact elements A process and apparatus for the selective electroplating of electrical coct elements, used for coating at least one contact surface of a metal base for the contact elements with an electrolyte, containing a material with a higher conductivity as compared... | 11/21/2000 |
| 6036837 | Process and machine for partially plating test probes A method and two-part plating apparatus for plating groups of elongated objects. The plating apparatus includes a fixture and a fixture support. The fixture is configured to loosely retain a group of elongated articles in a generally vertical orientation ... | 03/14/2000 |
| 5935407 | Method for producing abrasive tips for gas turbine blades A process is provided for producing an abrasive coating on a substrate surface by applying a bond coat by low pressure plasma spraying and anchoring to the bond coat abrasive particles by electroplating and embedding the particles into an oxidation resist... | 08/10/1999 |
| 5914022 | Method and apparatus for monitoring and controlling electrodeposition of paint A method and apparatus for monitoring electrodes for the electrodeposition of paint onto metallic workpieces includes detecting current from the electrodes and displaying a plot of current versus time. A method and apparatus for controlling electrodeposit... | 06/22/1999 |
| 5865977 | Process for the electrochemical treatment of flow channels in metal workpieces A process for electrochemical treating flow channels of metal workpieces uses a tool extending into the workpieces and an electrolyte flow between the tool and the flow channel. Either volume flow of the electrolyte, or pressure of the electrolyte, or bot... | 02/02/1999 |
| 5863816 | Fabrication method for chip size semiconductor package A fabrication method for a chip size semiconductor package includes the steps of bonding conductive wires on bonding pads formed on an upper surface of a semiconductor chip, putting the semiconductor chip including the bonded conductive wires in an electr... | 01/26/1999 |
| 5863408 | Method and device for surface treatment A method and apparatus for performing high speed chemical treatment of v type cylinder blocks. First the cylinder bores of one bank are treated. Then those of the other bank are treated. This permits a simple but compact treating plant.... | 01/26/1999 |
| 5714051 | Method for depositing cathode material on a wire cathode A method and apparatus for depositing emitter material (3) on a wire cathode by means of electrodeposition. An amount (13) of a suspension comprising an alkaline-earth compound is transferred by a drop holder (11) which is positioned around the wire (2), ... | 02/03/1998 |
| 5702583 | Method for selectively electroplating apertured metal or metallized products The invention relates to a method and an apparatus for selectively electroplating apertured products. The products are masked in accordance with the intended plating and subsequently exposed to an electrolyte in order to electroplate the products. For mas... | 12/30/1997 |
| 5702574 | Jig for coating rotor blades A method of and apparatus for producing abrasive tips on compressor or turbine rotor blades by electrolytic or electroless deposition in which the blades are mounted in a hollow jig with the tips of the blades extending through sealed openings in the jig ... | 12/30/1997 |
| 5681443 | Method for forming printed circuits An electrolytic cell comprised of a tank for holding electrolytic solution, and a drum rotatable about a horizontal axis having a non-conductive cylindrical outer surface disposed within the tank, and a plurality of elongated, like anodes arranged about t... | 10/28/1997 |
| 5665217 | Method for abrasive tipping of integrally bladed rotors The present invention relates to a method and apparatus for forming abrasive surfaces on the tips of a plurality of workpieces such as the tips of gas turbine airfoil blades. The method broadly comprises the steps of providing a mechanical masking device ... | 09/09/1997 |
| 5567295 | Method and apparatus for making staggered blade edge connectors An inexpensive method for fabricating a staggered edge connector for a circuit board. The method is cost effective and includes numerous advantages over the prior art, including allowing more area for signal routing and removing the problems associated wi... | 10/22/1996 |
| 5558757 | Process for improving the coating of electrolytically treated work pieces, and arrngement for carrying out the process The invention starts with a process for improving the electrolytic coating of work pieces (3) that are arranged one after the other as a row at a distance from each other on cathode rails (1) or on cathode frames in a bath, whereby the cathode treatment c... | 09/24/1996 |
| 5487824 | Electroplating apparatus and electroplating method of small articles An electroplating apparatus of small articles comprising: a horizontal circular bottom disk fixed on a top of a vertical drive shaft concentrically, a cover having a bottom fixing flange extending outwardly, upper opening and forming between the bottom di... | 01/30/1996 |
| 5486281 | Method for CBN tipping of HPC integrally bladed rotors The present invention relates to a method and apparatus for forming abrasive surfaces on the tips of a plurality of workpieces such as the tips of gas turbine airfoil blades. The method broadly comprises the steps of providing a mechanical masking device ... | 01/23/1996 |
| 5486377 | Method for manufacturing chip-like electronic parts Electronic parts are stuck into holes provided in an elongated retainer sheet and thereby retained. The retainer sheet as a transfer medium for the electronic parts is made to pass through a plating bath, a cleaning and drying section, an electrical chara... | 01/23/1996 |
| 5454929 | Process for preparing solderable integrated circuit lead frames by plating with tin and palladium A process for preparing a solderable lead frame from a copper base lead frame is disclosed using plating of tin or tin alloys followed by plating of palladium. Preferably, the tin plating is a spot plating to deposit tin only on the external leads and the... | 10/03/1995 |
| 5429738 | Method for forming printed circuits by elctroplating A method and apparatus for continuously forming primed circuits, the apparatus including a cylindrical drum rotatable about a generally vertical axis and a tank for holding an electrolytic plating solution. The tank is dimensioned to surround a lower port... | 07/04/1995 |
