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| Number | Title | Issue Date |
| 7666292 | Method of manufacturing printed circuit board using imprinting process The present invention relates to a method of manufacturing a printed circuit board using an imprinting process, in which a pattern having a large area can be uniformly formed using a plurality of molds, and the plurality of molds is sequentially removed, thereby sol... | 02/23/2010 |
| 7399399 | Method for manufacturing semiconductor package substrate A method for manufacturing a semiconductor package is proposed. A circuit board with a circuit layer on at least one surface thereof is provided. The circuit board has at least one free area, and the circuit layer has a plurality of electrically connecting pads dist... | 07/15/2008 |
| 7370415 | Manufacturing method of ink-jet head A method for manufacturing an inkjet print head with ink channels formed on a member including a piezoelectric body, and where ink is jetted from each of the ink channels by applying a voltage to electrodes provided on the piezoelectric body for each of the ink chan... | 05/13/2008 |
| 7347949 | Method of manufacturing a wiring board by utilizing electro plating A method of manufacturing a wiring board by utilizing electro plating characterized in that: when a wiring pattern is formed on the board by utilizing electro plating, an unnecessary portion does not remain on the wiring pattern. The method comprises: first electrol... | 03/25/2008 |
| 7320936 | Plating of multi-layer structures An insulating layer (5) and a conductive seed layer (6) are applied to a substrate (1) in a simple process. A photo resist with palladium chloride are provided in a bath for electrophoretic deposition onto the substrate. The photo resist is an i... | 01/22/2008 |
| 7279268 | Conductive lithographic polymer and method of making devices using same A conductive photolithographic film and method of forming a device using the conductive photolithographic film. The method includes depositing a conductive photolithographic film on a top surface of a substrate; and patterning the conductive photolithographic film t... | 10/09/2007 |
| 7239025 | Selective deposition of solder ball contacts Methods of forming solder ball contacts having dimensions of approximately 2.5 microns in diameter for use in C4-type connections. The methods form solder ball contacts using selective deposition of solder on metal contact pads of a device. The metal contact pads ha... | 07/03/2007 |
| 7219627 | Electrical bandage protector A flexible electric bandage protector for use on a bandage or an animal. The protector comprising a flexible thin battery and a conductive layer disposed on one side of the battery. The conductive layer is in the form of two sets of conductive traces, the conductive... | 05/22/2007 |
| 7202790 | Techniques for tuning an antenna to different operating frequencies Techniques for tuning an antenna to different operating frequencies are described. An apparatus includes a security tag with a substrate having a surface, a lead frame to mount on the surface and connect to an antenna, and an integrated circuit to connect to the lea... | 04/10/2007 |
| 7192804 | Semiconductor device and method for fabricating the same A wafer on which semiconductor elements, a multilevel interconnect layer, a bonding pad, a passivation film, and the like are formed is coated with a buffer coat film. Thereafter, the buffer coat film is patterned by exposure and development so that parts of the buf... | 03/20/2007 |
| 7163835 | Method for producing thin semiconductor films by deposition from solution A method is described for producing thin semiconductor films on a substrate by contacting a substrate with a solution containing a metal salt, a source of a Group VIa element, and chelating agent, and a noble metal in its elemental form. The resulting semiconductor ... | 01/16/2007 |
| 7148085 | Gold spot plated leadframes for semiconductor devices and method of fabrication A leadframe for use with integrated circuit chips comprising a plated layer of gold selectively covering areas of said leadframe intended for solder attachment; and said gold layer providing a visual distinction to said areas. ... | 12/12/2006 |
| 7133124 | Security element structure for documents, devices for checking documents with such security elements, method of the use thereof A structure of a security element for documents provided with a combination of differently reacting or responding security features and functional designs, including conductive, magnetic and diffractive ones, which render it difficult or impossible for counterfeiter... | 11/07/2006 |
| 7112882 | Structures and methods for heat dissipation of semiconductor integrated circuits Structures and methods for semiconductor integrated circuits with respect to heat dissipation are provided. The structure comprises a die having a first surface and a second surface. The first surface has an opening in it, and the second surface has a contact pad fo... | 09/26/2006 |
| 7113131 | Metalized dielectric substrates for EAS tags A metallized substrate, such as used to make a resonant circuit tag with inductive and capacitive elements in series, has a thin inorganic or polymeric dielectric layer formed on a metal layer. The inorganic layer may be formed by anodizing a surface of the metal la... | 09/26/2006 |
| 7111271 | Inductive filters and methods of fabrication thereof A series of plated through hole (PTH) vias are interconnected by traces that alternate between a top surface and a bottom surface of a dielectric board. The PTH vias in the series can be positioned to create a collinear inductive filter, a coil-type inductive filter... | 09/19/2006 |
| 7087104 | Preparation of electroless deposition solutions A system and method for storing a solution containing a subset of a group consisting of a metal ion, a complexing agent, an ammonium salt, and a strong base and then nearer to a time of use in an electroless deposition process, using the solution to form an electrol... | 08/08/2006 |
| 7084059 | CMP system for metal deposition A system for dished metal redevelopment by providing a metal deposition solution at an interface between a moving semiconductor wafer and a moving polishing pad, which deposits metal onto dished metal in trenches in a layer of an interlayer dielectric; and by polish... | 08/01/2006 |
| 7067172 | Component formation via plating technology Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typica... | 06/27/2006 |
| 7052288 | Two piece mid-plane A mid-plane is disclosed. The mid-plane includes a first printed circuit board having a plurality of plated vias adapted to receive tails attached to a first connector and having a plurality of unplated clearance holes adapted to receive tails attached to a second c... | 05/30/2006 |
| 7032512 | Edge treatment of flexographic printing elements A method is provided for reducing UV exposure to edges of a printing plate which occurs when the printing plate is subjected to UV illumination. The method involves a spray head comprising one or more spray nozzles for spraying edge masking material toward the print... | 04/25/2006 |
| 7033463 | Substrate plating method and apparatus A method and apparatus plate a substrate to form wiring by efficiently filling a fine recess formed in a semiconductor substrate with plating metal without a void or contamination. The plating of the substrate to fill a wiring recess formed in the semiconductor subs... | 04/25/2006 |
| 7034688 | Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith A method for selectively removing metal from a metallized substrate (e.g., a metallized polymer film) and the formation fo devices thereby are provided. The method involves selectively exposing the metallized surface to a demetallizing (i.e., an oxidizing) chemical ... | 04/25/2006 |
| 7029529 | Method and apparatus for metallization of large area substrates A system and method for processing large area substrates. In one embodiment, a system for processing large area substrates includes prep station, a stamping station and a stamp that is automatically moved between the stamping station and the prep station. The stampi... | 04/18/2006 |
| 6977130 | Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit A method of manufacturing an electronic circuit satisfying demands for cost reduction, diversified small-quantity production, and a shorter cycle of design, manufacture, evaluation, correction, and so on is provided. The method includes at least forming a first patt... | 12/20/2005 |
| 6967162 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface laye... | 11/22/2005 |
| 6930255 | Printed circuit boards and method of producing the same A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at... | 08/16/2005 |
| 6921018 | Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array A multi-chip stack structure and method of fabrication are provided utilizing self-aligning electrical contact arrays. Two or more arrays of interconnection contacts are provided, with one array being a rough aligned contact array, and a second array being a high ba... | 07/26/2005 |
| 6910260 | Integrated circuit inductors The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloy... | 06/28/2005 |
| 6863936 | Method of forming selective electroless plating on polymer surfaces A method of plating an aromatic polymer substrate comprises: applying a strippable coating of a non-aromatic polymer to a substrate surface to be plated; selectively illuminating the coated substrate surface with laser light to ablate a selected area of the strippab... | 03/08/2005 |
| 6821324 | Cobalt tungsten phosphorus electroless deposition process and materials Materials and methods are described for electroless deposition of cobalt phosphorus and cobalt tungsten phosphorus, employing tungsten trioxide or tungsten phosphoric acid as a source of tungsten. Electolessly deposited metals produced are substantially devoi... | 11/23/2004 |
| 6767445 | Method for the manufacture of printed circuit boards with integral plated resistors The present invention is a process for manufacturing resistors integral with the printed circuit board by plating the resistors onto the insulative substrate. The invention uses a mask during the activation step so as to selectively activate only selected portions o... | 07/27/2004 |
| 6740222 | Method of manufacturing a printed wiring board having a discontinuous plating layer The present invention provides a method of plating an electrical contact on an integrated circuit (IC) substrate manufactured from a rigid double-sided or multi-layered printed wiring board core with dielectric layers on both sides of the core. The method may includ... | 05/25/2004 |
| 6740425 | Method for manufacturing copper-resin composite material A method for forming copper-resin composite materials is disclosed. This method affixes a palladium or palladium-tin catalyst onto resin substrate, and then subjects the catalyst-containing resin to an electroless copper plating bath without performing a catalyst ac... | 05/25/2004 |
| 6582581 | Sequential build circuit board plating process A method for manufacture of a circuit method board which comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.... | 06/24/2003 |
| 6569491 | Platable dielectric materials for microvia technology A dielectric coating for a circuit board which is adherent to electroless copper. The coating is an epoxy dielectric including an amount of a solubilized nitrile-free butadiene or isoprene agent for promoting adhesion of an electroless copper coating. A m... | 05/27/2003 |
| 6517894 | Method for plating a first layer on a substrate and a second layer on the first layer A method and apparatus for plating a substrate is provided, wherein fine pits formed in the substrate, such as fine channels for wiring, are filled with a copper, copper alloy, or other material with low electrical resistance. The method is performed on a... | 02/11/2003 |
| 6495019 | Device comprising micromagnetic components for power applications and process for forming device The process is provided involving formation of multilayer components in which a photoresist-type material is used not only as a conventional patterning material, but also as an insulating and/or planarizing material between magnetic or electrically conduc... | 12/17/2002 |
| 6495394 | Chip package and method for manufacturing the same In a chip package, when a Ni/Au layer is formed by electroless plating, there is no problem with density increasing of interconnections and the like, since leads for plating and tie bars are not formed. However, the adhesive strength of solder balls to ba... | 12/17/2002 |
| 6461678 | Process for metallization of a substrate by curing a catalyst applied thereto An improved additive process for metallization of substrates is described whereby a catalyst solution is applied to a surface of a substrate. Metallic catalytic clusters can be formed in the catalyst solution on the substrate surface by heating the substr... | 10/08/2002 |
