Bizarre Patents
Hands free towel carrying system
A hands free towel carrying system for coupling a towel to a user to prevent loss, theft or contamination.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8070932 | Circuit board with identifiable information and method for fabricating the same A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of th... | 12/06/2011 |
| 8066862 | Manufacturing method of wiring board A manufacturing method of a wiring board includes a sticking layer forming step; a resist film forming step of forming a resist film on an upper surface of the sticking layer, the resist film having an opening exposing the upper surface of the sticking layer; a meta... | 11/29/2011 |
| 8007649 | Hydrophilic treatment method and wiring pattern forming method A plasma treatment is performed on the surface of one side of a polyimide film made of a resin. When wettability is imparted to the surface of the one side of the polyimide film, the plasma treatment is performed on the surface of the one side of the polyimide film ... | 08/30/2011 |
| 8002959 | Manufacturing method of double-sided wiring glass substrate To improve thermal resistance of a double-sided wiring glass substrate. A through-hole is filled with a copper post composed of metallic copper to thereby electrically connect the front and rear surfaces of the double-sided wiring glass substrate. The filling with t... | 08/23/2011 |
| 7993509 | Manufacturing method of double-sided wiring glass substrate To improve thermal resistance of a double-sided wiring glass substrate. A through-hole is filled with a copper film layer composed of metallic copper for electrically connecting the front and rear surfaces of the double-sided wiring glass substrate. The copper film ... | 08/09/2011 |
| 7955485 | Planar laminate substrate and method for fabricating organic laminate substrate PCBS, semiconductors, semiconductor wafers and semiconductor devices having miniaturized electrical pathways The present invention is a method of manufacturing miniaturized organic laminate substrate PCB, semiconductors, semiconductor wafers and semiconductor devices that have a 50% reduction in physical dimensions with respect to prior art existing organic laminate substr... | 06/07/2011 |
| 7892412 | Manufacturing process of embedded type flexible or rigid printed circuit board A manufacturing process of an embedded type flexible or rigid printed circuit board includes multiple steps. First, a layer of dry film is applied to a layer of copper foil. Then a circuit pattern is formed on the copper foil through photolithography processes. An e... | 02/22/2011 |
| 7807034 | Manufacturing method of non-etched circuit board A manufacturing method of a non-etched circuit board is disclosed herein, which employs a metal substrate having a metal barrier layer and an electroplated copper layer to transmit an electrical current to form a circuit layer. A patterned photoresist layer is forme... | 10/05/2010 |
| 7776199 | Printed wiring board and production method thereof The present invention provides a printed wiring board free from undercuts, which can be formed by an additive method without a dry treatment and a dry treatment apparatus, and a production method thereof. A printed wiring board of the present invention has a conduct... | 08/17/2010 |
| 7674362 | Method for fabrication of a conductive bump structure of a circuit board A method for fabricating a conductive bump structure of a circuit board is disclosed. The circuit board with a plurality of electrical connection pads is provided. An insulating protective layer and a resist layer are successively applied on the circuit board, where... | 03/09/2010 |
| 7429400 | Method of using ultrasonics to plate silver A method of reducing solder mask interface attack in a process of fabricating printed circuit boards. The method comprises the steps of providing a printed circuit board with a solder mask applied thereon and treating the printed circuit board with an immersion plat... | 09/30/2008 |
| 7405146 | Electroplating method by transmitting electric current from a ball side An electroplating method by transmitting electric current from a ball side is provided. In the electroplating method, the circuit layer is firstly formed on the bump side of the IC board, and the electric current is transmitted to the portion of the circuit layer un... | 07/29/2008 |
| 7393473 | Method for producing a composite plated product There is provided a composite plated product wherein a coating of a composite material containing carbon particles in a silver layer is formed on a substrate, the composite plated product having a large content of carbon and a large quantity of carbon particles on t... | 07/01/2008 |
| 7387717 | Method of performing electrolytic treatment on a conductive layer of a substrate A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surfac... | 06/17/2008 |
| 7374652 | Plating method Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a polyepoxide compound containing an ether linkage that deposit copper on the sur... | 05/20/2008 |
| 7370406 | Method of manufacturing a thin film structure A thin film magnetic head is described, the magnetic head having an insulating layer and a protrusion which has an upper portion and a base portion, and the upper portion has an extended portion. The insulating layer is present under the extending part. A method of ... | 05/13/2008 |
| 7371975 | Electronic packages and components thereof formed by substrate-imprinting A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on one or more layers. Conductor features of different geometries may b... | 05/13/2008 |
| 7365006 | Semiconductor package and substrate having multi-level vias fabrication method A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ... | 04/29/2008 |
| 7354354 | Article comprising a fine-grained metallic material and a polymeric material Lightweight articles comprising a polymeric material at least partially coated with a fine-grained metallic material are disclosed. The fine-grained metallic material has an average grain size of 2 nm to 5,000 nm, a thickness between 25 micron and 5 cm, and a hardne... | 04/08/2008 |
| 7355282 | Post passivation interconnection process and structures A system and method for forming post passivation metal structures is described. Metal interconnections and high quality electrical components, such as inductors, transformers, capacitors, or resistors are formed on a layer of passivation, or on a thick layer of poly... | 04/08/2008 |
| 7353595 | Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon A tape substrate includes IC lands electrically connected to pins of a driver IC (integrated circuit), circuit board terminal lands electrically connected to an external circuit board, test lands for testing the driver IC mounted on the tape substrate, and a plating... | 04/08/2008 |
| 7355516 | Method and apparatus for protecting culinary products A microwave-resistant and waterproof security tag for use with food products, especially meat products. The security tag includes a pair of single, open loop conductive traces in between which is disposed a similarly-shaped dielectric layer. This combination is enca... | 04/08/2008 |
| 7354675 | Apparatus and method for maintaining compression of the active area in an electrochemical cell An electrochemical cell includes a first electrode, a second electrode, a proton exchange membrane disposed between and in intimate contact with the electrodes, and a pressure pad disposed in electrical communication with the first electrode. The pressure pad is an ... | 04/08/2008 |
| 7350294 | Method of electroplating a plurality of conductive fingers A method of electroplating may include placing a pair of conductive fingers in proximity to an edge of a circuit board, where the pair are coupled to be electrically isolated, and where the pair are substantially longitudinally oriented away from the edge. A trace e... | 04/01/2008 |
| 7347920 | Production, refining and recycling of lightweight and reactive metals in ionic liquids Lightweight and reactive metals can be produced from ore, refined from alloy, and recycled from metal matrix composites using electrolysis in electrolytes including an ionic liquid containing a metal chloride at or near room temperature. Low electric energy consumpt... | 03/25/2008 |
| 7339260 | Wiring board providing impedance matching A wiring board comprising: a plate core having a first main surface and a second main surface; conductor layers including a conductor line; dielectric layers laminated alternately with said conductor layers on at least one of said first and second main surfaces; via... | 03/04/2008 |
| 7334326 | Method for making an integrated circuit substrate having embedded passive components A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures f... | 02/26/2008 |
| 7334325 | Apparatus and method for improving coupling across plane discontinuities on circuit boards The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the dis... | 02/26/2008 |
| 7323093 | Producing method of flexible wired circuit board A producing method of a flexible wired circuit board that can prevent the formation of a gap between an elongate substrate and a stiffener sheet bonded thereto to prevent contamination of the flexible wired circuit board obtained. In the process subsequent to the pr... | 01/29/2008 |
| 7319265 | Semiconductor chip assembly with precision-formed metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal ... | 01/15/2008 |
| 7316783 | Method of wiring formation and method for manufacturing electronic components A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film partially overlaps the feeder film, forming a plated wiring on the platin... | 01/08/2008 |
| 7312515 | Semiconductor apparatus including a thin-metal-film resistor element and a method of manufacturing the same A semiconductor apparatus includes a wiring pattern, an insulating film, and a thin-metal-film resistor element. The insulating film is formed on the wiring pattern having connection holes vertically penetrating there-through to expose part of the wiring pattern at ... | 12/25/2007 |
| 7312103 | Method for making an integrated circuit substrate having laser-embedded conductive patterns A method for making an integrated circuit substrate having laser-embedded conductive patterns provides a high-density mounting and interconnect structure for integrated circuits. A dielectric material is injection-molded or laminated over a metal layer that is punch... | 12/25/2007 |
| 7312142 | Method for making cable with a conductive bump array, and method for connecting the cable to a task object A cable with conductive bumps is fabricated by forming a photoresist layer with multiple openings on a cable substrate, coating a conductive layer on the photoresist layer whereby the conductive layer in the openings forms the bumps at circuits on the cable substrat... | 12/25/2007 |
| 7307022 | Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof A method of treating a conductive layer to assure enhanced adhesion of the layer to selected dielectric layers used to form a circuitized substrate. The conductive layer includes at least one surface with the appropriate roughness to enable such adhesion and also go... | 12/11/2007 |
| 7294389 | Microstructure array and a microlens array In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating ... | 11/13/2007 |
| 7291554 | Method for forming semiconductor device A method for forming a semiconductor device includes the steps of forming a flowable film made of an insulating material with flowability; forming a first concave portion in the flowable film through transfer of a convex portion of a pressing face of a pressing memb... | 11/06/2007 |
| 7279432 | System and method for forming an integrated barrier layer An apparatus and method for forming an integrated barrier layer on a substrate is described. The integrated barrier layer comprises at least a first refractory metal layer and a second refractory metal layer. The integrated barrier layer is formed using a dual-mode ... | 10/09/2007 |
| 7276442 | Method for forming a metallization layer A method for depositing metal on a semiconductor device having a substrate, an exposed first surface, and an exposed second surface is provided. Metal ions are deposited on the exposed first surface and on the exposed second layer by applying a first voltage between... | 10/02/2007 |
| 7276386 | Semiconductor device and method of manufacturing the same A method of manufacturing a semiconductor device includes the steps of forming barrier metals on first electrodes provided on a chip of the semiconductor device, implementing a predetermined test on the semiconductor device by applying a signal to the semiconductor ... | 10/02/2007 |
