Quotables
"Telephone, n. An invention of the devil which abrogates some of the advantages of making a disagreeable person keep his distance. "
Ambose Bierce
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8168057 | Balancing pressure to improve a fluid seal A method of fluid sealing a workpiece is provided. The method includes providing a force to cause a ring to form a barrier to fluid entry with the workpiece and preventing fluid from crossing the barrier to fluid entry by forming a pressure differential across the b... | 05/01/2012 |
| 8080147 | Electrolytic plating method and semiconductor device manufacturing method A disclosed electrolytic plating method includes a first step of immersing a substrate in electrolytic plating liquid including copper salt to form a first Cu layer on the substrate; and a second step of forming a second Cu layer over the first Cu layer. The first s... | 12/20/2011 |
| 7828951 | Wafer support apparatus for electroplating process and method for using the same A multi-layered wafer support apparatus is provided for performing an electroplating process on a semiconductor wafer (“wafer”). The multi-layered wafer support apparatus includes a bottom film layer and a top film layer. The bottom film layer includes a wafer p... | 11/09/2010 |
| 7736483 | Method for electroplating metal wire A method for electroplating low-resistance metal wire for resolving the problem to fabricate the metal wire on large-area substrate through the technology of photolithographing and etching in the prior art. Then the invention improves the RC-delay characteristic of ... | 06/15/2010 |
| 7604727 | Electroplating method for a semiconductor device An electroplating method calls for immersing a body to be plated in a plating solution containing tin and bismuth to form a tin-bismuth alloy skin layer on surfaces of the body. The plating is carried out such that a solid tin metal and a solid bismuth metal placed ... | 10/20/2009 |
| 7438794 | Method of copper electroplating to improve gapfill A copper electroplating bath composition and a method of copper electroplating to improve gapfill are provided. The method of electroplating includes providing an aqueous electroplating composition, comprising copper, at least one acid, at least one halogen ion, an ... | 10/21/2008 |
| 7435323 | Method for controlling thickness uniformity of electroplated layers An apparatus which can control thickness uniformity during deposition of conductive material from an electrolyte onto a surface of a semiconductor substrate is provided. The apparatus has an anode which can be contacted by the electrolyte during deposition of the co... | 10/14/2008 |
| 7431817 | Electroplating solution for gold-tin eutectic alloy The invention relates to an electrolyte used in connection with the deposition of a gold-tin alloy on an electroplatable substrate. This solution generally includes water; stannous and/or stannic tin ions, a complexing agent to render the stannous and/or stannic tin... | 10/07/2008 |
| 7425250 | Electrochemical mechanical processing apparatus A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer to polish the conductive surface. Application of a potential differe... | 09/16/2008 |
| 7405163 | Selectively accelerated plating of metal features An accelerator solution is globally applied to a workpiece to form an accelerator film, and then a portion of the accelerator film is selectively removed from the workpiece to form an acceleration region having a higher concentration of accelerator. The higher conce... | 07/29/2008 |
| 7396447 | Through-hole conductors for semiconductor substrates and system for making same A method, structure and system for forming a through-hole conductor in a semiconductor substrate includes forming a hole having an inner surface from a first side of the semiconductor substrate to a second side of the semiconductor substrate and plating the inner su... | 07/08/2008 |
| 7388147 | Metal contact structure for solar cell and method of manufacture In a solar cell having p doped regions and n doped regions alternately formed in a surface of a semiconductor wafer in offset levels through use of masking and etching techniques, metal contacts are made to the p regions and n regions by first forming a base layer c... | 06/17/2008 |
| 7387717 | Method of performing electrolytic treatment on a conductive layer of a substrate A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surfac... | 06/17/2008 |
| 7370406 | Method of manufacturing a thin film structure A thin film magnetic head is described, the magnetic head having an insulating layer and a protrusion which has an upper portion and a base portion, and the upper portion has an extended portion. The insulating layer is present under the extending part. A method of ... | 05/13/2008 |
| 7357850 | Electroplating apparatus with segmented anode array An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are ... | 04/15/2008 |
| RE40218 | Electro-chemical deposition system and method of electroplating on substrates The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto metal seede... | 04/08/2008 |
| 7347949 | Method of manufacturing a wiring board by utilizing electro plating A method of manufacturing a wiring board by utilizing electro plating characterized in that: when a wiring pattern is formed on the board by utilizing electro plating, an unnecessary portion does not remain on the wiring pattern. The method comprises: first electrol... | 03/25/2008 |
| 7337654 | Method of forming a needle for auto-sampler In a method of forming a needle for an auto-sampler successively collecting liquid samples from plural sample containers, a parent material forming the needle is coated with a coating material having a chemical activity small than that of the needle. Then, the coate... | 03/04/2008 |
| 7338585 | Electroplating chemistries and methods of forming interconnections A method comprising forming an interconnection opening through a dielectric material to a contact point; and electroplating a interconnection comprising copper in the contact opening using an electroplating bath comprising an alkoxylated sulfopropylated alkylamine. ... | 03/04/2008 |
| 7335288 | Methods for depositing copper on a noble metal layer of a work piece Methods for electrodeposition of copper on a noble metal layer of a work piece are provided. An exemplary method includes exposing the noble metal layer to an electrodeposition composition. The electrodeposition composition comprises a copper salt, a suppressor, an ... | 02/26/2008 |
| 7332212 | Circuitized substrate with conductive polymer and seed material adhesion layer A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating... | 02/19/2008 |
| 7330533 | Compact x-ray source and panel A compact, self-contained x-ray source, and a compact x-ray source panel having a plurality of such x-ray sources arranged in a preferably broad-area pixelized array. Each x-ray source includes an electron source for producing an electron beam, an x-ray conversion t... | 02/12/2008 |
| 7323406 | Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures A method for making novel elevated bond-pad structures with sidewall spacers is achieved. The elevated bond-pad structures increase the space between the chip and a substrate during flip-chip bonding. The increased spacing results in better under-filling and reduces... | 01/29/2008 |
| 7323094 | Process for depositing a layer of material on a substrate An electroplating system (30) and process makes electrical current density across a semiconductor device substrate (20) surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. The electrical curr... | 01/29/2008 |
| 7323097 | Electroplating method for a semiconductor device An electroplating method calls for immersing a body to be plated in a plating solution containing tin and bismuth to form a tin-bismuth alloy skin layer on surfaces of the body. The plating is carried out such that a solid tin metal and a solid bismuth metal placed ... | 01/29/2008 |
| 7320933 | Double bumping of flexible substrate for first and second level interconnects An apparatus and method for improving the yield and reducing the cost of forming a semiconductor device assembly. An interposer substrate is formed with interconnections in the form of conductive bumps on both a first surface and a second surface to provide a respec... | 01/22/2008 |
| 7319265 | Semiconductor chip assembly with precision-formed metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal ... | 01/15/2008 |
| 7316783 | Method of wiring formation and method for manufacturing electronic components A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film partially overlaps the feeder film, forming a plated wiring on the platin... | 01/08/2008 |
| 7317253 | Cobalt tungsten phosphate used to fill voids arising in a copper metallization process A semiconductor device includes a substrate, at least one layer of functional devices formed on the substrate, a first dielectric layer formed over the functional device layer and a first trench/via located in the first dielectric layer. A copper conductor fills the... | 01/08/2008 |
| 7316772 | Defect reduction in electrodeposited copper for semiconductor applications A method for electroplating a copper deposit onto a semiconductor integrated circuit device substrate having submicron-sized features, and a concentrate for forming a corresponding electroplating bath. A substrate is immersed into an electroplating bath formed from ... | 01/08/2008 |
| 7314543 | Tin deposition A device includes an integrated circuit and a deposited tin in electrical contact with a portion of the integrated circuit. The deposited tin is formed by electrodeposition from a bath. The deposited tin includes a residue characteristic of the bath. The bath includ... | 01/01/2008 |
| 7311811 | Device providing electrical contact to the surface of a semiconductor workpiece during processing Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second ... | 12/25/2007 |
| 7309413 | Providing electrical contact to the surface of a semiconductor workpiece during processing Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second ... | 12/18/2007 |
| 7303992 | Copper electrodeposition in microelectronics An electrolytic plating method and composition for electrolytically plating Cu onto a semiconductor integrated circuit substrate having submicron-sized interconnect features. The composition comprises a source of Cu ions and a suppressor compound comprising polyethe... | 12/04/2007 |
| 7301190 | Structures and methods to enhance copper metallization Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary structure includes an inhibiting layer between an insulator and a meta... | 11/27/2007 |
| 7300562 | Platinum alloy using electrochemical deposition The present invention is directed to methods and compositions for depositing a noble metal alloy onto a microelectronic workpiece. In one particular aspect of the invention, a platinum metal alloy is electrochemically deposited on a surface of the workpiece from an ... | 11/27/2007 |
| 7294858 | Semiconductor device and method of manufacturing the same A semiconductor device provided with a silicon carbide semiconductor substrate, and an ohmic metal layer joined to one surface of the silicon carbide semiconductor substrate in an ohmic contact and composed of a metal material whose silicide formation free energy an... | 11/13/2007 |
| 7288179 | Method for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing A method and apparatus for transmitting electrical signals and fluids to and/or from a microelectronic workpiece. An apparatus in accordance with one embodiment of the invention includes a shaft rotatable about a shaft axis and having a first end with a first electr... | 10/30/2007 |
| 7288845 | Fabrication of wire bond pads over underlying active devices, passive devices and/or dielectric layers in integrated circuits A wire connection structure for an integrated circuit (IC) die includes a semiconductor wafer with an active device and/or a passive device. One or more dielectric layers are arranged adjacent to the active and/or passive device. One or more metal interconnect layer... | 10/30/2007 |
| 7285196 | Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals In recent years, copper wiring has emerged as a promising substitute for the aluminum wiring in integrated circuits, because copper offers lower electrical resistance and better reliability at smaller dimensions than aluminum. However, use of copper typically requir... | 10/23/2007 |
