Bizarre Patents
Wearable Device For Feeding and Observing Birds and Other Flying Animals
A device for feeding and observing flying animals comprising a hat, a support mounted on the hat and extending outward from the hat, and a feeder mounted on the support.
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| Number | Title | Issue Date |
| 8163157 | Method of producing a hydrogen production filter In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the me... | 04/24/2012 |
| 8142638 | Method for making a base plate for suspension assembly in hard disk drive A swage mount that includes a flange, having a first side and a second side, and a cylindrically shaped hub. The hub is primarily comprised of a metal (such as stainless steel), and extends from the second side of the flange, and has an inner surface and an outer su... | 03/27/2012 |
| 8128800 | Method of manufacturing light guide panel with pattern accuracy A method of manufacturing a mold for producing a light guide panel and a method of manufacturing the light guide panel using the mold are presented. The mold is made by manufacturing a pattern master on which a fine pattern is formed. A side mold for forming a light... | 03/06/2012 |
| 8057656 | Crossover A crossover is formed by imprinting a channel, by depositing a first conductor in the channel, by anodizing a surface of the first conductor and by electroforming a second conductor across the first conductor. ... | 11/15/2011 |
| 8052857 | Process for anodizing a robotic device A robotic device has a base and at least one finger having at least two links that are connected in series on rotary joints with at least two degrees of freedom. A brushless motor and an associated controller are located at each joint to produce a rotational movemen... | 11/08/2011 |
| 8021535 | Methods for plating write pole shield structures with ultra-thin metal gap seed layers Methods and structures for electroplating shield structures for perpendicular thin film write poles having ultra thin non-magnetic top gaps on the order of a few nanometers are disclosed. Ultra thin, conductive seed layers serve a dual purpose as both plating seed l... | 09/20/2011 |
| 8012331 | Probe and method of making same Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of ... | 09/06/2011 |
| 7922888 | Post and tip design for a probe contact The present invention relates to A microfabricated tip and post structure comprising a post having a rough top surface that diffuses incident light and a cross-section, and a tip, lithographically plated on the rough top surface of the post, having a smooth reflecti... | 04/12/2011 |
| 7901838 | Corrosion-resistant interconnects for fuel cells A method of construction of an electrochemical interconnect plate, the method comprising the steps of: (a) etching predetermined fluid flow channels in a first conductive sheet; and (b) coating the first conductive sheet with a corrosion resistant layer of nickel an... | 03/08/2011 |
| 7803263 | Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the me... | 09/28/2010 |
| 7763158 | Method for making a tunable cantilever device Mass distribution within programmable surface control devices is controlled by the presence or absence of an electrodeposition of metal and/or metal ions from a solid solution upon application of a suitable electric field. One such programmable surface control devic... | 07/27/2010 |
| 7560016 | Selectively accelerated plating of metal features To make a metal feature, a non-plateable layer is applied to a workpiece surface and then patterned to form a first plating region and a first non-plating region. Then, metal is deposited on the workpiece to form a raised field region in said first plating region an... | 07/14/2009 |
| 7449099 | Selectively accelerated plating of metal features To make a metal feature, a non-plateable layer is applied to a workpiece surface and then patterned to form a first plating region and a first non-plating region. Then, metal is deposited on the workpiece to form a raised field region in said first plating region an... | 11/11/2008 |
| 7441323 | Method of aligning components for installation on a head suspension assembly A head suspension for supporting a head slider over a storage media in a dynamic storage device is provided with a head suspension component having a spring metal layer, an electrically conductive layer and a dielectric layer interposed between the metal layer and t... | 10/28/2008 |
| 7441325 | Perpendicular head with trailing shield and rhodium gap process A perpendicular write head including a main pole and a trailing shield, the main pole being made of a diamond-like carbon (DLC) layer as hard mask and a rhodium (Rh) layer as shield gap, both DLC and Rh layers being CMP stop layers so as to avoid corner rounding and... | 10/28/2008 |
| 7398591 | Manufacturing method of a thin-film magnetic head The present invention relates to a manufacturing method of a thin-film magnetic head whereby re-deposition and an overlapped part in a region of a magnetoresistive effect multi-layered structure opposite to an air bearing surface can be removed and also a width of a... | 07/15/2008 |
| 7398592 | Manufacturable CMP assisted liftoff process to fabricate write pole for perpendicular recording heads This invention describes a manufacturable method, including a CMP liftoff process, for removing masking materials after ion milling for fabricating the write pole of a magnetic head. Significant parameters for the CMP assisted liftoff process include the thickness o... | 07/15/2008 |
| 7396445 | Method of manufacturing a thin-film magnetic head using a soft magnetic film having high saturation magnetic flux density A soft magnetic film is formed of a CoFe alloy having an Fe content in the range of 68 to 80 mass %, thereby having a saturation magnetic flux density of 2.0 T or more. The center lain average roughness of the film surface is 9 nm or less. The soft magnetic film can... | 07/08/2008 |
| 7395595 | Method for manufacturing P3 layer of a perpendicular magnetic write head A method for forming a P3 layer with NiFe and alumina mask using resist shrink process for use in perpendicular magnetic write heads. The method includes forming a laminated layer, forming an alumina layer on top of the laminated layer, depositing a conductiv... | 07/08/2008 |
| 7389578 | Manufacturing method of a perpendicular recording magnetic head Embodiments in accordance with the present invention relate to methods wherein when a main pole is processed by using an ion milling technique, a re-adhesion layer created on the side face of the resist mask is removed with certainty. In one embodiment, an inorganic... | 06/24/2008 |
| 7389576 | Method of manufacturing micro flux gate sensor A method of manufacturing a micro flux gate sensor that has a good electrical connection and can be easily manufactured includes operations of forming a metal pattern, forming a first insulation layer to cover the metal pattern and forming viaholes to expose a certa... | 06/24/2008 |
| 7386930 | Method for manufacturing a magnetostrictive torque sensor For forming an annular magnetostrictive coat on an outer peripheral surface of a rotational shaft associated with a magnetostrictive torque sensor, a magnetostrictive coat forming method comprises a step of fitting a cylindrical masking jig over the outer peripheral... | 06/17/2008 |
| 7384531 | Plated ground features for integrated lead suspensions A method for forming an electrical interconnect on an integrated lead suspension or suspension component of the type formed from a laminated sheet of material having a stainless steel layer, a conductive lead layer and an insulating layer separating the stainless st... | 06/10/2008 |
| 7363700 | Method of manufacturing a thin film magnetic head The present invention provides a thin film magnetic head achieving improved recording performance by sharpening recording magnetic field gradient as much as possible. The thin film magnetic head has a return yoke layer disposed on a trailing side of a magnetic pole ... | 04/29/2008 |
| 7365006 | Semiconductor package and substrate having multi-level vias fabrication method A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ... | 04/29/2008 |
| 7364649 | Method of producing the keytop for pushbutton switch According to a method of producing a key top for a pushbutton switch of the present invention, a base layer made of an insulating resin that can be plated with metal, an electroless plating layer to be formed on the surface of the base layer, and a polymer coating l... | 04/29/2008 |
| 7364979 | Capcitor with single crystal tantalum oxide layer and method for fabricating the same A capacitor and a method for fabricating the same are provided. The capacitor includes: a substrate; an inter-layer insulation layer formed over the substrate and including a contact hole; a storage node formed over the inter-layer insulation layer and filled into t... | 04/29/2008 |
| 7360301 | Method of manufacturing a thin film magnetic head The invention is directed to improvement of a write element of a thin film magnetic head. The first pole portion projects from a flat surface of a first yoke portion at a medium-facing surface side and having a reduced width at its upper end. The second pole portion... | 04/22/2008 |
| 7358116 | Substrate conductive post formation A substrate with at least one conductive post formed prior to the formation of an inter-layer dielectric (ILD) coating on the substrate. The conductive post may be formed from a metal layer of the substrate. Additionally, the conductive post may be built up on the s... | 04/15/2008 |
| 7351448 | Anti-reflective coating on patterned metals or metallic surfaces An apparatus and process for coating surfaces of metal or metallic components including providing at least one metal having a patterned outer surface exhibiting an optical reflection greater than about 40%, providing at least one anti-reflective coating material, th... | 04/01/2008 |
| 7351321 | Method for electrochemical fabrication An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substra... | 04/01/2008 |
| 7335463 | Electroplated three dimensional ink jet manifold and nozzle structures using successive lithography and electroplated sacrificial layers Mechanical and/or structural devices are formed using electroplating techniques in conjunction with sacrificial materials that can also be formed using electroplated techniques. This can produce devices that are attached at only selected points to a substrate and/or... | 02/26/2008 |
| 7332402 | Method for optically trimming electronic components Methods for adjusting the bulk material properties of manufactured components, such as resistors, thermistors, varistors, capacitors, resonators, oscillators, and optical components. Adjustment of the resistance of a resistor can be achieved by directing a high ener... | 02/19/2008 |
| 7328499 | Method of manufacturing a thin film magnetic head Provided is a thin film magnetic head capable of inhibiting the occurrence of track erasing and improving the reliability of magnetic recording. Two taper surfaces are disposed on both sides of a return yoke layer. As no corner portion which may induce concentration... | 02/12/2008 |
| 7323093 | Producing method of flexible wired circuit board A producing method of a flexible wired circuit board that can prevent the formation of a gap between an elongate substrate and a stiffener sheet bonded thereto to prevent contamination of the flexible wired circuit board obtained. In the process subsequent to the pr... | 01/29/2008 |
| 7320174 | Methods for creating ground paths for ILS Methods for creating a ground path between a stainless steel suspension and a copper trace layer in an integrated lead assembly of a disk drive suspension. The invention prevents electrostatic discharge (ESD) damage by providing a means for grounding a lead to a con... | 01/22/2008 |
| 7319070 | Semiconductor device fabrication method In a conductive layer fabrication method, a lower resist layer (210) is formed on a semiconductor substrate. A water soluble resin layer (212) is formed over the lower resist layer. Heat treatment is performed so as to produce a cross-linking layer ( | 01/15/2008 |
| 7314708 | Method and apparatus for electronic synthesis of molecular structures A self-addressable, self-assembling microelectronic device is designed and fabricated to actively carry out and control multi-step and multiplex molecular biological reactions in microscopic formats. These reactions include nucleic acid hybridization, antibody/antig... | 01/01/2008 |
| 7310870 | Method for forming an annular magnetostrictive coat on an outer peripheral surface of a rotational shaft of magnetostrictive torque sensor For forming an annular magnetostrictive coat on an outer peripheral surface of a rotational shaft associated with a magnetostrictive torque sensor, a magnetostrictive-coat forming method comprises a step of fitting a cylindrical masking jig over the outer peripheral... | 12/25/2007 |
| 7304249 | Bonding pads for a printed circuit board Bonding pad(s) for a printed circuit board with circuit patterns are provided. The bonding pad(s) include a plurality of copper patterns formed on the PCB and electrically connected to the circuit patterns, a filler filled between the copper patterns such that an up... | 12/04/2007 |
