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"I watched his countenance closely, to see if he was not deranged ... and I was assured by other senators after he left the room that they had no confidence in it."
U.S. Senator Smith of Indiana ; After seeing Samuel Morse demonstrate the telegraph.
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| Number | Title | Issue Date |
| 8157979 | Film having cobalt selenide nanowires and method of forming same A method for making a film having an array of cobalt selenide nanowires including: providing an aluminum substrate; anodizing the aluminum substrate to form anodized aluminum including an aluminum oxide layer having a plurality of pores therein on a surface of the a... | 04/17/2012 |
| 8157978 | Etching system and method for forming multiple porous semiconductor regions with different optical and structural properties on a single semiconductor wafer Disclosed is an electrochemical etching system with localized etching capability. The system allows multiple different porous semiconductor regions to be formed on a single semiconductor wafer. Localized etching is achieved through the use of one or more stationary ... | 04/17/2012 |
| 8152984 | Method of manufacturing nozzle plate A method of manufacturing a nozzle plate has steps of: (e) covering a surface of a plate with a light-curable resin; (f) covering the resin with a light-shielding member having an annular light-shielding region which encloses an opening of a nozzle hole therein in a... | 04/10/2012 |
| 8133375 | Method of surface printing and plating A method of surface printing and electric plating, it is to perform pre-plating to form a pre-plated layer firstly on a surface of a metallic or non-metallic article to be plated, thereby the metallic or non-metallic surface will not be oxidized, and to perform prin... | 03/13/2012 |
| 8105472 | Enhanced transparent conductive coatings and methods for making them Transparent conductive coated devices (films, three dimensional objects and others) produced through coating with a nano metal containing emulsion which forms a conductive pattern with enhanced electrical, optical and other properties. ... | 01/31/2012 |
| 8092666 | Method for fabricating plated product A bumper molding is fabricated by disposing segmented anodes 31 and 32 on surfaces 22 and 24 of a base material 20, which are to be plated, and performing electroplating so as to form metal films on the surfaces 22 and 24... | 01/10/2012 |
| 8070930 | Methods for fabricating metal nanowires Methods for the preparation of long, dimensionally uniform, metallic nanowires that are removable from the surface on which they are synthesized. The methods include the selective electrodeposition of metal nanowires at step edges present on a stepped surface, such ... | 12/06/2011 |
| 8070931 | Electrochemical fabrication method including elastic joining of structures Embodiments are directed to methods for forming multi-layer three-dimensional structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer three-dimensional structure, wherein the joining occurs via one of: (... | 12/06/2011 |
| 8062497 | Method for forming a hermetically sealed cavity One inventive aspect relates to a method for forming hermetically sealed cavities, e.g. semiconductor cavities comprising fragile devices, MEMS or NEMS devices. The method allows forming hermetically sealed cavities at a controlled atmosphere and pressure and at low... | 11/22/2011 |
| 7998331 | Method for electrochemical fabrication An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substra... | 08/16/2011 |
| 7998330 | Direct nanoscale patterning of metals using polymer electrolytes Disclosed herein are electrochemical fabrication platforms for making structures, arrays of structures and functional devices having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods, systems and system components use... | 08/16/2011 |
| 7981269 | Method of electrochemical fabrication An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substra... | 07/19/2011 |
| 7947162 | Free standing single-crystal nanowire growth by electro-chemical deposition The present invention relates to a method for obtaining monocrystalline or single crystal nanowires. Said nanowires are grown in a pattern making use of electro-chemical deposition techniques. Most preferred, the electrolytic bath is based on chlorides and has an ac... | 05/24/2011 |
| 7918984 | Method of electrodepositing germanium compound materials on a substrate A method of electrodepositing germanium compound materials on an exposed region of a substrate structure, which includes forming a plating solution by dissolving at least one germanium salt and at least one salt containing an element other than germanium in water; o... | 04/05/2011 |
| 7918983 | Substrate plating method and apparatus A substrate plating method makes it possible to plate a metal, such as copper or a copper alloy, uniformly into fine recesses in a substrate without forming voids in the metal-filled recesses. The substrate plating method for filling a metal into fine recesses in a ... | 04/05/2011 |
| 7857959 | Methods of fabricating nanowires and electrodes having nanogaps A cost-effective and highly reproducible method of fabricating nanowires, and small gaps or spacings in nanowires is disclosed. The nanogaps bridge an important size regime between 1 nm and 100 nm. The nanogaps can be selectively predetermined to be as small as 1.0 ... | 12/28/2010 |
| 7854829 | Method of plating and method of manufacturing a micro device A method of plating, which allows compositions of plating patterns of a plurality of layers to be uniform without any operational complexity, is provided. The area of the plating layer electrodeposited including plating patterns is constant in each of the plurality ... | 12/21/2010 |
| 7790009 | Method and electrode for defining and replicating structures in conducting materials The present invention concerns an electrochemical pattern replication method, ECPR, and a construction of a conductive electrode for production of applications involving micro and nano structures. An etching or plating pattern, which is defined by a conductive elect... | 09/07/2010 |
| 7790010 | Spatially selective deposition of polysaccharide layer onto patterned template A method is provided for electrochemically depositing a polymer with spatial selectivity. A substrate having a substrate surface is contacted with an aqueous solution containing a selectively insolubilizable polysaccharide, such as chitosan, which is subjected to el... | 09/07/2010 |
| 7758739 | Methods of producing structures for electron beam induced resonance using plating and/or etching We describe an ultra-small structure and a method of producing the same. The structures produce visible light of varying frequency, from a single metallic layer. In one example, a row of metallic posts are etched or plated on a substrate according to a particular ge... | 07/20/2010 |
| 7674361 | Micro-turbines, roller bearings, bushings, and design of hollow closed structures and fabrication methods for creating such structures Multi-layer fabrication methods (e.g. electrochemical fabrication methods) for forming microscale and mesoscale devices or structures (e.g. turbines) provide bushings or roller bearing that allow rotational or linear motion which is constrained by multiple structura... | 03/09/2010 |
| 7666291 | Method for fabricating metal wires A method for fabricating metal wires is disclosed. A substrate is first provided, and a first metal layer is formed over the surface of the substrate. Next, a mask with patterns is formed on the surface of the substrate, in which the first metal layer is partially e... | 02/23/2010 |
| 7618525 | Method for electrochemical fabrication An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substra... | 11/17/2009 |
| 7611616 | Mesoscale and microscale device fabrication methods using split structures and alignment elements Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers as opened structures which can be folded over or other otherwise com... | 11/03/2009 |
| 7534337 | Substrate before insulation, method of manufacturing substrate, method of manufacturing surface acoustic wave transducer, surface acoustic wave device, and electronic equipment A substrate before an insulation process, which is provided with a protection film to prevent a part of a surface area, which has electrical conductivity from being insulated, the substrate comprises: a base including the surface area, which has electrical conductiv... | 05/19/2009 |
| 7531077 | Electrochemical fabrication process for forming multilayer multimaterial microprobe structures Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of ... | 05/12/2009 |
| 7504014 | High density interconnections with nanowiring The present invention generally relates to circuits on the nanotechnology scale. Specifically, it is directed to methods of fabricating carbon nanotube-based (i.e., CNT-based) circuits. The method involves providing a mixture of carbon nanotubes that is substantiall... | 03/17/2009 |
| 7449098 | Method for planar electroplating A disclosed form of mechanically assisted electroplating leads to a flat, thin, overburden. In one example, an accelerator is deposited on a copper surface and mechanically removed in a simplified CMP-like apparatus. The wafer is then plated in an electrolyte contai... | 11/11/2008 |
| 7435324 | Noncontact localized electrochemical deposition of metal thin films A method of selectively electroplating metal features on a semiconductor substrate having a conductive surface. An electrode assembly that includes a plurality of adjacent, mutually spaced and electrically isolated electrodes connected in series so as to be opposite... | 10/14/2008 |
| 7431817 | Electroplating solution for gold-tin eutectic alloy The invention relates to an electrolyte used in connection with the deposition of a gold-tin alloy on an electroplatable substrate. This solution generally includes water; stannous and/or stannic tin ions, a complexing agent to render the stannous and/or stannic tin... | 10/07/2008 |
| 7422696 | Multicomponent nanorods Multicomponent nanorods having segments with differing electronic and/or chemical properties are disclosed. The nanorods can be tailored with high precision to create controlled gaps within the nanorods or to produce diodes or resistors, based upon the identities of... | 09/09/2008 |
| 7402231 | Method and apparatus for partially plating work surfaces For partially plating work surfaces, a tubular shield member is set around a work which is connected to a cathode, in face to face and in predetermined small gap relation with a non-plating surface or surfaces of a work. In a plating bath, an anode is located on the... | 07/22/2008 |
| 7396447 | Through-hole conductors for semiconductor substrates and system for making same A method, structure and system for forming a through-hole conductor in a semiconductor substrate includes forming a hole having an inner surface from a first side of the semiconductor substrate to a second side of the semiconductor substrate and plating the inner su... | 07/08/2008 |
| 7384530 | Methods for electrochemically fabricating multi-layer structures including regions incorporating maskless, patterned, multiple layer thickness depositions of selected materials The invention includes methods of fabrication and apparatuses. In at least some embodiments of the applicants' invention, the methods include processes of: maskless selective deposition of non-layered structures, selective etching and/or deposition without use of a ... | 06/10/2008 |
| 7384531 | Plated ground features for integrated lead suspensions A method for forming an electrical interconnect on an integrated lead suspension or suspension component of the type formed from a laminated sheet of material having a stainless steel layer, a conductive lead layer and an insulating layer separating the stainless st... | 06/10/2008 |
| 7375014 | Methods of electrochemically treating semiconductor substrates The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second regions is provided. The first and second regions can be defined by a si... | 05/20/2008 |
| 7372616 | Complex microdevices and apparatus and methods for fabricating such devices Various embodiments of the invention are directed to various microdevices including sensors, actuators, valves, scanning mirrors, accelerometers, switches, and the like. In some embodiments the devices are formed via electrochemical fabrication (EFAB™). ... | 05/13/2008 |
| 7371311 | Modified electroplating solution components in a low-acid electrolyte solution An embodiment of the invention provides a method for reducing within die thickness variations by modifying the concentration of components of a low-acid electroplating solution. For one embodiment, the leveler concentration is increased sufficiently to reduce within... | 05/13/2008 |
| 7368044 | Non-conformable masks and methods and apparatus for forming three-dimensional structures Electrochemical Fabrication techniques are used to modify substrates or to form multilayer structures (e.g. components or devices) from a plurality of overlaying and adhered layers. Masks are used to selectively etch or deposit material. Some masks may be of the con... | 05/06/2008 |
| 7368045 | Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow A method is provided for electroplating a gate metal or other conducting or semiconducting material directly on a dielectric such as a gate dielectric. The method involves selecting a substrate, dielectric layer, and electrolyte solution or melt, wherein the combina... | 05/06/2008 |
