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| Number | Title | Issue Date |
| 7754061 | Method for controlling conductor deposition on predetermined portions of a wafer A plating apparatus and method for deposition of a conductive material on a semiconductor wafer having surface portions and cavity portions. A differential in an adsorbed concentration of an additive, including accelerators or suppressors, between a surface portion ... | 07/13/2010 |
| 7638028 | Probe tip plating A method of processing a probe element includes (a) providing a probe element comprising a first conductive material, and (b) coating only a tip portion of the probe element with a second conductive material. ... | 12/29/2009 |
| 7404886 | Plating by creating a differential between additives disposed on a surface portion and a cavity portion of a workpiece The present invention relates to methods for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive disposed on a cav... | 07/29/2008 |
| 7361582 | Method of forming a damascene structure with integrated planar dielectric layers Methods are provided for forming a circuit component on a workpiece substrate. The methods comprise the steps of depositing a dielectric material over the substrate; etching a pattern through the dielectric material to expose a portion of the substrate; depositing a... | 04/22/2008 |
| 7311809 | Plating apparatus for substrate The present invention provides a plating apparatus for a substrate which can plate a substrate under uniform pressure without increasing a load to be applied while holding the entire surface of a porous member in contact with the surface, to be plated, of the substr... | 12/25/2007 |
| 7270167 | Metal impregnated graphite composite tooling A metallic shell used, for example as a mold, is formed by spray deposition of metallic layers over non-metallic layers as, for example, a reinforcing fabric. ... | 09/18/2007 |
| 7235165 | Electroplating solution and method for electroplating An electroplating solution may be formulated as an aqueous solution of oxalic acid, trisodium phosphate and ammonium sulfate. Such solutions may be used for both brush plating and bath plating, and are suitable for use with a variety of plating metals and substrate ... | 06/26/2007 |
| 7229907 | Method of forming a damascene structure with integrated planar dielectric layers Methods are provided for forming a circuit component on a workpiece substrate. The methods comprise the steps of depositing a dielectric material over the substrate; etching a pattern through the dielectric material to expose a portion of the substrate; depositing a... | 06/12/2007 |
| 7204917 | Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same The present invention is directed to a top surface of a workpiece surface influencing device and a method of using the same. The top surface of the workpiece surface influencing device is adapted for use in an electrochemical mechanical processing apparatus in which... | 04/17/2007 |
| 7172497 | Fabrication of semiconductor interconnect structures A system and a method of forming copper interconnect structures in a surface of a wafer is provided. The method includes a step of performing a planar electroplating process in an electrochemical mechanical deposition station for filling copper material into a plura... | 02/06/2007 |
| 7160427 | In situ plating of electrical connector contacts A method of plating contacts in situ within an electrical connector, the connector having a plurality of contacts circumscribed by a skirt of a connector body. The method comprises. grounding the contacts and then applying a plate coating onto the contacts within th... | 01/09/2007 |
| 7067423 | Electroless plating apparatus, semiconductor wafer having bumps, semiconductor chip having bumps, methods of manufacturing the semiconductor wafer and the semiconductor chip, semiconductor device, circuit board, and electronic equipment An electroless plating apparatus includes: a storage tank for an electroless plating solution; a blocking member which blocks the electroless plating solution from flowing from a treatment side of a semiconductor wafer installed to the storage tank toward an opposit... | 06/27/2006 |
| 7001498 | Electroplating apparatus and four mask TFT array process with electroplated metal An electroplating apparatus, in accordance with the present invention, includes a plurality of chambers. A first chamber includes an anode therein. The first chamber has an opening for delivering an electrolytic solution containing metal ions onto a surface to be el... | 02/21/2006 |
| 6946066 | Multi step electrodeposition process for reducing defects and minimizing film thickness The present invention relates to a method for forming a planar conductive surface on a wafer. In one aspect, the present invention uses a no-contact process with electrochemical deposition, followed by a contact process with electrochemical mechanical deposition. | 09/20/2005 |
| 6921551 | Plating method and apparatus for controlling deposition on predetermined portions of a workpiece The present invention relates to methods and apparatus for plating a conductive material on a workpiece surface in a highly desirable manner. Using a workpiece-surface-influencing device, such as a mask or sweeper, that preferentially contacts the top surface of the... | 07/26/2005 |
| 6913681 | Plating method and plating apparatus A cathode potential is applied to a conductive layer formed on a substrate having a depression pattern. A plating solution in electrical contact with an anode is supplied to the conductive layer to form a plating film on the conductive layer. At this time, the plati... | 07/05/2005 |
| 6902659 | Method and apparatus for electro-chemical mechanical deposition The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electr... | 06/07/2005 |
| 6884334 | Vertically configured chamber used for multiple processes The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, th... | 04/26/2005 |
| 6869515 | Enhanced electrochemical deposition (ECD) filling of high aspect ratio openings Embodiments of the present invention provide methods for enhancing void-free metallic filling of narrow openings by electrochemical deposition (ECD). The methods provide enhanced replenishment of plating inhibitor at the field, while depleting the inhibitor inside n... | 03/22/2005 |
| 6863794 | Method and apparatus for forming metal layers A method of forming a metal layer on a substrate is disclosed. The metal layer is formed using a combined electrochemical plating/electrochemical mechanical polishing (ECP/EMP) process. In the ECP/EMP process, the metal layer is deposited on the substrate by contact... | 03/08/2005 |
| 6773570 | Integrated plating and planarization process and apparatus therefor A method and apparatus are described for performing both electroplating of a metal layer and planarization of the layer on a substrate. Electroplating and electroetching of metal (such as copper) are performed in a repeated sequence, followed by chemical-mechanical ... | 08/10/2004 |
| 6676822 | Method for electro chemical mechanical deposition The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer usin... | 01/13/2004 |
| 6524462 | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method This invention is a method of, providing conductive tracks on a printed circuit including coating a substrate carrying printed tracks with an electro-plating solution with a tool which provides a first electrode of an electro-plating circuit and a second ... | 02/25/2003 |
| 6508925 | Automated brush plating process for solid oxide fuel cells A method of depositing a metal coating (28) on the interconnect (26) of a tubular, hollow fuel cell (10) contains the steps of providing the fuel cell (10) having an exposed interconnect surface (26); contacting the inside of the fuel cell (10) with a cat... | 01/21/2003 |
| 6375823 | Plating method and plating apparatus A cathode potential is applied to a conductive layer formed on a substrate having a depression pattern. A plating solution in electrical contact with an anode is supplied to the conductive layer to form a plating film on the conductive layer. At this time... | 04/23/2002 |
| 6368467 | Electro-plating plasma arc deposition process An electrolytic process for metal-coating the surface of a workpiece of an electrically conductive material includes i) providing an electrolytic cell with a cathode defining the surface of the workpiece and an anode; ii) introducing an electrolyte of an ... | 04/09/2002 |
| 6312580 | Method for gold plating chromium and other passive metals A method is described for plating adherent, hard decorative gold in one or two steps, eliminating multistage substrate stripping on chromium plated automobile emblems.... | 11/06/2001 |
| 6270646 | Electroplating apparatus and method using a compressible contact A metal plating apparatus is described which includes a compressible member having a conductive surface covering substantially all of the surface of the substrate to be plated. The plating current is thereby transmitted over a wide area of the substrate, ... | 08/07/2001 |
| 6143156 | Electroplating method and apparatus The present invention provides an improved method for electroplating metallic ions onto a conductive substrate. In one embodiment, the method comprises at least partially covering a selected surface of the conductive substrate with an electrode wrap that ... | 11/07/2000 |
| 5453174 | Method and apparatus for depositing hard chrome coatings by brush plating Thick layers of hard dense chromium coatings are formed on metal substrates by an electrolytic brush plating operation in which a lead-tin anode is closely positioned to a cathodic workpiece in full anode wrap relationship and the surface of the cathodic ... | 09/26/1995 |
| 5409593 | Method and apparatus for selective electroplating using soluble anodes A device is provided for brush electroplating a surface of a workpiece. The device includes an anode generally composed of a metal to be electroplated on the surface of the workpiece. The anode is selectively retained within a cavity formed in a lower sur... | 04/25/1995 |
| 5389228 | Brush plating compressor blade tips A method is taught for application of an abrasive tip to a gas turbine blade by brush plating, wherein particulate abrasive is applied to the tip of said blade and held in position during electroplating by a porous dielectric cloth.... | 02/14/1995 |
| 5384026 | Method for gold plating a metallic surface A compact, hand portable, mobile electroplating unit provided with wheels, a seat for the user, and all of the chemical solutions and applicator equipment, including a D.C. power source, required to electroplate a metallic film on a metallic surface.... | 01/24/1995 |
| 5277785 | Method and apparatus for depositing hard chrome coatings by brush plating Thick layers of hard dense chromium coatings are formed on metal substrates by an electrolytic brush plating operation in which a lead-tin electrode having a porous polypropylene felt topped by an polypropylene molded brush element is maintained during co... | 01/11/1994 |
| 5184550 | Device for controlling wetting behavior of metal surfaces by application of electrolyte under controlled voltage Apparatus for controlling the wetting behavior of the surface of a cylinder formed of passivatable metal. A wetting device is used to apply an electrolyte to the surface of the metal cylinder. A direct current source is connected between the wetting devic... | 02/09/1993 |
| 4892626 | Method for plating one side of a woven fabric sheet In a method for plating one side of a woven fabric sheet, a backing layer is applied to one side of the sheet. The sheet and backing layer are wetted in an electrolytic solution containing metallic ions to be deposited on one side of the fabric sheet only... | 01/09/1990 |
| 4738756 | Method of brush chrome plating using tank chrome plating solutions A method of brush chrome plating a substrate is disclosed that utilizes a standard tank chrome plating solution instead of a specialized brush chrome plating solution. The use of a tank chrome plating solution reduces the expense of the brush chrome plati... | 04/19/1988 |
| 4661213 | Electroplate to moving metal An anodic roller electroplating process utilizes novel anodic roller apparatus and provides flexible operation parameters. The novel anodic roller apparatus comprises a perforate valve metal cylinder such as in mesh form. The cylinder has an electrocataly... | 04/28/1987 |
| 4655881 | Brush plating method for connector terminals Fork-like connector terminals are moved along the pass line under guidance so that the forked end part thereof won't pass astray from the predetermined passageway. A plating brush, which has been positioned in alignment with the predetermined passageway o... | 04/07/1987 |
| 4606795 | Method for spot plating flatware A method of spot gold plating a metallic flatware article by placing the article in a horizontal position resting upon a metallic cathode and a metallic mesh anode. The metallic mesh anode is filled with an aqueous gold plating solution before a D.C. volt... | 08/19/1986 |
