Did You Know...
...that Thomas Edison's patent application on his phonograph was approved by the Patent Office in just seven weeks? In contrast, it took Gordon Gould, the inventor of the laser, 30 years to obtain his patent -- finally awarded in 1988!
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| Number | Title | Issue Date |
| 8173004 | Method of manufacturing chromium plated article and chromium plating apparatus A pulse current from a pulse current supply side is fed to a middle part of an anode holding body to which anodes are connected; both end portions of a cathode holding body, to which cathodes are connected, are connected to a negative pole on the pulse power source ... | 05/08/2012 |
| 8048280 | Process for electroplating metals into microscopic recessed features Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plat... | 11/01/2011 |
| 7972491 | Method for imparting hydrogen resistance to articles A simple and low cost method for imparting excellent hydrogen resistance to various types of articles such as a rare earth metal-based permanent magnet. A method for imparting hydrogen resistance to an article of the present invention is characterized by forming a m... | 07/05/2011 |
| 7909976 | Method for filling through hole It is characterized in that in the case of filling a through hole formed in a substrate with a plated metal by electrolytic plating, the electrolytic plating is started by a high current density higher than Constant Current Density capable of fully filling the throu... | 03/22/2011 |
| 7776198 | Method for anodizing objects A method and apparatus of anodizing a component, preferably aluminum, is disclosed. The component is placed in an electrolyte solution. A number of pulses are applied to the solution and component. Each pulse is formed by a pattern including having three magnitudes.... | 08/17/2010 |
| 7582199 | Plating method Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing powe... | 09/01/2009 |
| 7462270 | Cantilever probes for nanoscale magnetic and atomic force microscopy The various embodiments discloses a cantilever probe comprising a first electrode and a second electrode engaged to a substrate and a branched cantilever wherein the cantilever comprises a nanostruture. Furthermore, the probe comprises a first arm of the cantilever ... | 12/09/2008 |
| 7396445 | Method of manufacturing a thin-film magnetic head using a soft magnetic film having high saturation magnetic flux density A soft magnetic film is formed of a CoFe alloy having an Fe content in the range of 68 to 80 mass %, thereby having a saturation magnetic flux density of 2.0 T or more. The center lain average roughness of the film surface is 9 nm or less. The soft magnetic film can... | 07/08/2008 |
| RE40386 | Chrome plated parts and chrome plating method Using a chrome plating bath containing organic sulfonic acid, plating is conducted by application of a pulse current to thereby form a crack-free lower chrome layer on a steel substrate. The lower chrome layer has a compressive residual stress of 100 MPa or more and... | 06/17/2008 |
| 7381318 | Method of manufacturing biaxially textured metallic layer featured by electroplating on the surface of single-crystalline or quasi-single-crystalline metal surface, and articles therefrom Disclosed herein are a biaxially textured pure metal or alloy layer deposited by electroplating process on the surface of a single-crystalline or quasi-single-crystalline metal substrate, and a method for manufacturing the biaxially textured pure metal or alloy laye... | 06/03/2008 |
| 7351313 | Production device and production method for conductive nano-wire The object of the present invention is to provide a nano-scale molecular assembly such as a conductive nano-wire. Specifically, there is provided an electrolytic apparatus for forming a molecular assembly, including two electrodes and an electrolytic cell holding an... | 04/01/2008 |
| 7326480 | Fuel cell power system and method of controlling a fuel cell power system A fuel cell power system includes a fuel cell which has an optimal voltage; an energy storage device having a nominal voltage substantially similar to the optimal voltage of the fuel cell; and an electrical switch that, in operation, selectively electrically couples... | 02/05/2008 |
| 7312149 | Copper plating of semiconductor devices using single intermediate low power immersion step A method of electroplating a metal layer on a semiconductor device includes a sequence of biasing operations that includes a first electroplating step at a first current density followed by a second immersion step at a second current density being less than the firs... | 12/25/2007 |
| 7309412 | Compositions and coatings including quasicrystals Composite coating compositions, composite metallic coatings derived from these compositions, and methods of forming the composite coating compositions and composite metallic coatings, wherein the compositions and coatings comprise particles of at least one quasicrys... | 12/18/2007 |
| 7309411 | Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys An electroplating bath medium for electroplating articles with a tin-cobalt, tin-nickel, or tin-cobalt-nickel alloy comprises: at least one tin salt; an alloying metal salt comprising a cobalt salt and/or a nickel salt; a complexant comprising a hydroxycarboxylic ac... | 12/18/2007 |
| 7302856 | Strain sensors based on nanowire piezoresistor wires and arrays A highly sensitive and ultra-high density array of electromechanical nanowires is fabricated. Nanowires are extremely sensitive to the strain induced by the attachment of biological and chemical species. Real-time detection is realized through piezoresistive transdu... | 12/04/2007 |
| 7256115 | Asymmetric plating A method and apparatus are disclosed for forming a tapered contact structure over a contact pad. The tapered contact structure may be used to securely anchor an overlying solder bump or solder ball. Additionally, the tapered contact structure allows the use of eithe... | 08/14/2007 |
| 7229916 | Method of manufacturing a semiconductor device A method of manufacturing a semiconductor device is to be provided, which improves filling performance of a conductive layer to be formed by an electrolytic plating process in an interconnect trench or a via hole, and achieves a higher in-plane uniformity in bottom-... | 06/12/2007 |
| 7220347 | Electrolytic copper plating bath and plating process therewith An electrolytic copper plating bath used for via-filling plating of blind via-holes formed on a substrate, containing a water-soluble copper salt, sulfuric acid, chloride ions, and a leveler as an additive, wherein the leveler is either one or both of a quaternary p... | 05/22/2007 |
| 7220346 | Methods for fabricating metal nanowires Methods for the preparation of long, dimensionally uniform, metallic nanowires that are removable from the surface on which they are synthesized. The methods include the selective electrodeposition of metal nanowires at step edges present on a stepped surface, such ... | 05/22/2007 |
| 7214604 | Method of fabricating ultra thin flip-chip package Provided is a method of fabricating an ultra thin flip-chip package. In the above method, an under barrier metal film is formed on a bond pad of a semiconductor chip. Three-dimensional structured solder bumps are formed on the under barrier metal film, each of the s... | 05/08/2007 |
| 7214303 | Cantilever probes for nanoscale magnetic and atomic force microscopy The various embodiments discloses a cantilever probe comprising a first electrode and a second electrode engaged to a substrate and a branched cantilever wherein the cantilever comprises a nanostruture. Furthermore, the probe comprises a first arm of the cantilever ... | 05/08/2007 |
| 7195700 | Method of electroplating copper layers with flat topography A method of electrochemically filling features on a wafer surface to form a substantially planar copper layer is provided. The features to be filled includes a first feature that is an unfilled feature with the smallest width and a second feature having the next lar... | 03/27/2007 |
| 7189650 | Method and apparatus for copper film quality enhancement with two-step deposition The disclosure relates to a method and apparatus for enhancing copper film quality with a two-step deposition. The two step deposition may include depositing a first copper film by electrochemical plating, annealing the first copper film at a desired temperature for... | 03/13/2007 |
| 7179360 | Soft magnetic film having improved saturated magnetic flux density, magnetic head using the same, and manufacturing method therefore A lower magnetic pole layer and/or an upper magnetic pole layer are formed of a CoFeα alloy in which the component ratio X of Co is 8 to 48 mass %, the component ratio Y of Fe is 50 to 90 mass %, the component ratio Z of the element α (the element α is at least o... | 02/20/2007 |
| 7179561 | Nanowire-based membrane electrode assemblies for fuel cells The present invention discloses nanowires for use in a fuel cell comprising a metal catalyst deposited on a surface of the nanowires. A membrane electrode assembly for a fuel cell is disclosed which generally comprises a proton exchange membrane, an anode electrode,... | 02/20/2007 |
| 7160427 | In situ plating of electrical connector contacts A method of plating contacts in situ within an electrical connector, the connector having a plurality of contacts circumscribed by a skirt of a connector body. The method comprises. grounding the contacts and then applying a plate coating onto the contacts within th... | 01/09/2007 |
| 7135103 | Preparation of soft magnetic thin film A soft magnetic thin film of CoFe alloy having a high Br and low Hc is prepared by furnishing a plating tank including cathode and anode compartments which are separated by a diaphragm or salt bridge so as to permit charge transfer, but inhibit penetration of Fe ion... | 11/14/2006 |
| 7135404 | Method for applying metal features onto barrier layers using electrochemical deposition The present invention is directed to a process for producing structures containing metallized features for use in microelectric workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable mean... | 11/14/2006 |
| 7132179 | Methods and apparatus for improving the cold starting capability of a fuel cell Apparatus and methods of ceasing operation of an electric power generating system improve the cold starting capability of the system. The system comprises a fuel cell stack connectable to an external circuit for supplying power to the external circuit. The stack com... | 11/07/2006 |
| 7128821 | Electropolishing method for removing particles from wafer surface An electropolishing method for removing potential device-contaminating particles from a wafer, is disclosed. The method includes immersing the wafer in an electropolishing electrolyte solution and removing defects and particles from the wafer by rotational friction ... | 10/31/2006 |
| 7112354 | Electron spin mechanisms for inducing magnetic-polarization reversal An apparatus includes a low magnetic-coercivity layer of material (LMC layer) having a majority electron-spin-polarization (M-ESP), an energy-gap coupled with the LMC layer, wherein a flow of spin-polarized electrons having an electron-spin-polarization anti-paralle... | 09/26/2006 |
| 7067867 | Large-area nonenabled macroelectronic substrates and uses therefor A method and apparatus for an electronic substrate having a plurality of semiconductor devices is described. A thin film of nanowires is formed on a substrate. The thin film of nanowires is formed to have a sufficient density of nanowires to achieve an operational c... | 06/27/2006 |
| 7060176 | Method and apparatus for anodizing objects A method and apparatus of anodizing a component, preferably aluminum, is disclosed. The component is placed in an electrolyte solution. A number of pulses are applied to the solution and component. Each pulse is formed by a pattern including having three magnitudes.... | 06/13/2006 |
| 7056806 | Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces The present disclosure provides methods and apparatus useful in depositing materials on batches of microfeature workpieces. One implementation provides a method in which a quantity of a first precursor gas is introduced to an enclosure at a first enclosure pressure.... | 06/06/2006 |
| 7052592 | Chromium plating method An electrolyte bath and method of electrolytically plating a layer of metallic chromium on a substrate comprises providing an electrolyte bath of a trivalent chromium, passing a current through the bath from an anode to a cathode which receives the substrate, mainta... | 05/30/2006 |
| 7037421 | Thin-film magnetic head having magnetic gap formed of NiP A gap layer of a thin-film magnetic head is formed of NiP. The P content of the NiP gap layer is controlled to be within the range of 11 mass percent to 14 mass percent so that the gap layer is nonmagnetic. ... | 05/02/2006 |
| 6974531 | Method for electroplating on resistive substrates A conductive material is electroplated onto a platable resistive metal barrier layer(s) employing a plating bath optionally comprising a super filling additive and a suppressor, and by changing the current or voltage as a function of the area of plated metal. A stru... | 12/13/2005 |
| 6958572 | Controlled non-normal alignment of catalytically grown nanostructures in a large-scale synthesis process Systems and methods are described for controlled non-normal alignment of catalyticaly grown nanostructures in a large-scale synthesis process. A method includes: generating an electric field proximate an edge of a protruding section of an electrode, the electric fie... | 10/25/2005 |
| 6946065 | Process for electroplating metal into microscopic recessed features Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plat... | 09/20/2005 |
