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| Number | Title | Issue Date |
| 7425255 | Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition Bipolar wave current, with both positive and negative current portions, is used to electrodeposit a nanocrystalline grain size deposit. Polarity Ratio is the ratio of the absolute value of the time integrated amplitude of negative polarity current and positive polar... | 09/16/2008 |
| 7381318 | Method of manufacturing biaxially textured metallic layer featured by electroplating on the surface of single-crystalline or quasi-single-crystalline metal surface, and articles therefrom Disclosed herein are a biaxially textured pure metal or alloy layer deposited by electroplating process on the surface of a single-crystalline or quasi-single-crystalline metal substrate, and a method for manufacturing the biaxially textured pure metal or alloy laye... | 06/03/2008 |
| 7374654 | Method of making an organic memory cell A method of making an organic memory cell which comprises two electrodes with a controllably conductive media between the two electrodes is disclosed. The present invention involves providing a dielectric layer having formed therein one or more first electrode pads;... | 05/20/2008 |
| 7371311 | Modified electroplating solution components in a low-acid electrolyte solution An embodiment of the invention provides a method for reducing within die thickness variations by modifying the concentration of components of a low-acid electroplating solution. For one embodiment, the leveler concentration is increased sufficiently to reduce within... | 05/13/2008 |
| RE40218 | Electro-chemical deposition system and method of electroplating on substrates The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto metal seede... | 04/08/2008 |
| 7329334 | Controlling the hardness of electrodeposited copper coatings by variation of current profile Pulse reverse electrolysis of acid copper solutions is used for applying copper deposits of a controlled hardness for applications such as producing printing cylinders. The benefits include improved production capacity. Hardness of the deposit is controlled by varyi... | 02/12/2008 |
| 7323095 | Integrated multi-step gap fill and all feature planarization for conductive materials A method and apparatus is provided for depositing and planarizing a material layer on a substrate. In one embodiment, an apparatus is provided which includes a partial enclosure, a permeable disc, a diffuser plate and optionally an anode. A substrate carrier is posi... | 01/29/2008 |
| 7323094 | Process for depositing a layer of material on a substrate An electroplating system (30) and process makes electrical current density across a semiconductor device substrate (20) surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. The electrical curr... | 01/29/2008 |
| 7309412 | Compositions and coatings including quasicrystals Composite coating compositions, composite metallic coatings derived from these compositions, and methods of forming the composite coating compositions and composite metallic coatings, wherein the compositions and coatings comprise particles of at least one quasicrys... | 12/18/2007 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7294389 | Microstructure array and a microlens array In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating ... | 11/13/2007 |
| 7282445 | Multiple seed layers for interconnects One embodiment of the present invention is a method for depositing two or more seed layers over a substrate, the substrate includes a patterned insulating layer which comprises at least one opening surrounded by a field, the at least one opening and the field being ... | 10/16/2007 |
| 7278911 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly th... | 10/09/2007 |
| 7268075 | Method to reduce the copper line roughness for increased electrical conductivity of narrow interconnects (<100nm) Embodiments of the present invention provide methods to reduce the copper line roughness for increased electrical conductivity in narrow interconnects having a width of less than 100 nm. These methods reduce the copper line roughness by first smoothing the surface o... | 09/11/2007 |
| 7264704 | Electrolysis cell for restoring the concentration of metal ions in electroplating processes It is described an electrolysis cell wherein the anodic dissolution of metals is carried out, in particular of metals characterised by a relatively high oxidation potential, such as copper, or metals with high hydrogen overpotential, for example tin, aimed at restor... | 09/04/2007 |
| 7256121 | Contact resistance reduction by new barrier stack process The present invention provides a method for forming an interconnect on a semiconductor substrate 100. The method includes forming an opening 230 over an inner surface of the opening 130, the depositing forming a reentrant profile near a top port... | 08/14/2007 |
| 7254885 | Wafer-level fabrication method for top or side slider bond pads A method is used for fabricating sliders for use in a disc drive actuation system, the sliders having bonds pads formed on either a top surface or side faces of the slider. The method comprises providing a substrate having a top surface. Trenches are formed in the s... | 08/14/2007 |
| 7247934 | Multi-chip semiconductor package A multi-chip semiconductor package and a fabrication method thereof are provided. At least one first chip is mounted on and electrically connected to an upper surface of a substrate via solder bumps. A preformed package structure having a second chip and a first enc... | 07/24/2007 |
| 7244347 | Method and system to provide electrical contacts for electrotreating processes Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented. ... | 07/17/2007 |
| 7239747 | Method and system for locating position in printed texts and delivering multimedia information Apparatus and methods are disclosed for processing printed material to provide an index of locations within the printed material that can be associated with external actions such as displaying a graphical image, providing an audio or video output, or providing a mul... | 07/03/2007 |
| 7238086 | Surface finishing method for aluminum shapes by barrel polishing A surface finishing method for aluminum shapes by barrel polishing, wherein caps are mounted at both open ends of a hollow aluminum shape, and two aluminum shapes each mounted with the caps are set on two right and left holders so as not to interfere with each other... | 07/03/2007 |
| 7229535 | Hydrogen bubble reduction on the cathode using double-cell designs An apparatus and method for planarizing a surface of a substrate using a chamber separated into two parts by a membrane, and two separate electrolytes is provided. The embodiments of the present invention generally provide an electrochemical mechanical polishing sys... | 06/12/2007 |
| 7226531 | Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes is disclosed, including electroplating a substrate having a conductive baseline on a surface thereof in an electroplating bath containing a metal ion and carbon nanot... | 06/05/2007 |
| 7211186 | Method and system to provide electrical contacts for electrotreating processes Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented. ... | 05/01/2007 |
| 7211174 | Method and system to provide electrical contacts for electrotreating processes Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented. ... | 05/01/2007 |
| 7201828 | Planar plating apparatus An apparatus for performing an electrochemical process on a surface of a workpiece comprises a platen assembly comprising a support platen, an electrolyte distribution plate, and a first conductive layer intermediate the support platen and distribution plate and con... | 04/10/2007 |
| 7200920 | Method for the implementation of electronic components in via-holes of a multi-layer multi-chip module The substrate (2) containing the via-hole (3) is inserted into an electrophoretic cell (1) and an electrode (6) (the “first electrode”) is placed on top of a first orifice of the via-hole(s) (3), to be implemented with electric... | 04/10/2007 |
| 7199052 | Seed layers for metallic interconnects One embodiment of the present invention is a method for making copper or a copper alloy interconnects, which method includes: (a) forming a patterned insulating layer over a substrate, the patterned insulating layer including at least one opening and a field surroun... | 04/03/2007 |
| 7189647 | Sequential station tool for wet processing of semiconductor wafers Methods and apparatus are provided for processing semiconductor wafers sequentially. Sequential processes employ multi-station processing modules, where particular encompassing wafer processes are divided into sub-processes, each optimized for increasing wafer to wa... | 03/13/2007 |
| 7189313 | Substrate support with fluid retention band An apparatus and method for supporting a substrate is provided. In one embodiment, an apparatus for supporting a substrate includes a body having a band extending therefrom. The band is adapted to retain a fluid on the body thereby forming a shallow processing bath ... | 03/13/2007 |
| 7179736 | Method for fabricating planar semiconductor wafers The present invention relates to a method of fabricating planar semiconductor wafers. The method comprises forming a dielectric layer on a semiconductor wafer surface, the semiconductor wafer surface having vias, trenches and planar regions. A barrier and seed metal... | 02/20/2007 |
| 7172818 | Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board A copper foil for chip-on-film use, a plasma display panel, or a high-frequency printed circuit board obtained by rolling copper foil to smooth the surface to give a surface area of not more than 1.30 times an ideal smooth surface, the smoothed copper foil having de... | 02/06/2007 |
| 7169700 | Metal interconnect features with a doping gradient A metal filled damascene structure with improved electromigration resistance and method for forming the same, the method including providing a semiconductor process wafer comprising damascene openings; and, depositing metal and at least one metal dopant according to... | 01/30/2007 |
| 7160401 | Use of a low-alloyed copper alloy and hollow profile component made therefrom Use of a low-alloyed, phosphorus-deoxidized copper alloy (DHP-Cu) for manufacturing hollow profile components by internal high-pressure forming, the copper alloy having the following composition: 0.030 to 0.080 wt-% of at least one element of a group including tin (... | 01/09/2007 |
| 7150818 | Process for electrochemical deposition of tantalum and an article having a surface modification A process for electrochemical deposition of tantalum on an article in an inert, non-oxidizing atmosphere, or under vacuum, in a molten electrolyte containing tantalum ions, comprising the steps of: immersing the article into the molten electrolyte heated to a workin... | 12/19/2006 |
| 7138039 | Liquid isolation of contact rings Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending fro... | 11/21/2006 |
| 7135103 | Preparation of soft magnetic thin film A soft magnetic thin film of CoFe alloy having a high Br and low Hc is prepared by furnishing a plating tank including cathode and anode compartments which are separated by a diaphragm or salt bridge so as to permit charge transfer, but inhibit penetration of Fe ion... | 11/14/2006 |
| 7128821 | Electropolishing method for removing particles from wafer surface An electropolishing method for removing potential device-contaminating particles from a wafer, is disclosed. The method includes immersing the wafer in an electropolishing electrolyte solution and removing defects and particles from the wafer by rotational friction ... | 10/31/2006 |
| 7128823 | Anolyte for copper plating Embodiments of the invention provide a method for plating copper into features formed on a semiconductor substrate. The method includes positioning the substrate in a plating cell, wherein the plating cell includes a catholyte volume containing a catholyte solution,... | 10/31/2006 |
| 7125477 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 10/24/2006 |
