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| Number | Title | Issue Date |
| 8142637 | Gold alloy electrolytes Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color. ... | 03/27/2012 |
| 7993508 | Method of forming an electrode casing for an alkaline electrochemical cell with reduced gassing Electrochemical cells including a casing or cup for direct electrical contact with a negative electrode or counter electrode and serving as the current collector for the electrode. The casing includes a substrate having a plated coating of an alloy including copper,... | 08/09/2011 |
| 7704366 | Pretreatment of magnesium substrates for electroplating The present invention relates to a method for depositing an adherent zinc coating onto a zinc-containing magnesium alloy substrate in order to render the surface suitable for electroplating. The coatings are applied from a pyrophosphate-based zinc electrolyte soluti... | 04/27/2010 |
| 7569131 | Method for producing multiple magnetic layers of materials with known thickness and composition using a one-step electrodeposition process A method for multi-layer electrodeposition in a single bath is also provided. A substrate is immersed in a bath. An electrodeposition operation is initiated for depositing a first layer of material on the substrate. The electrodeposition operation includes agitating... | 08/04/2009 |
| 7462269 | Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an e... | 12/09/2008 |
| 7438794 | Method of copper electroplating to improve gapfill A copper electroplating bath composition and a method of copper electroplating to improve gapfill are provided. The method of electroplating includes providing an aqueous electroplating composition, comprising copper, at least one acid, at least one halogen ion, an ... | 10/21/2008 |
| 7371311 | Modified electroplating solution components in a low-acid electrolyte solution An embodiment of the invention provides a method for reducing within die thickness variations by modifying the concentration of components of a low-acid electroplating solution. For one embodiment, the leveler concentration is increased sufficiently to reduce within... | 05/13/2008 |
| 7357853 | Electroplating composite substrates An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described. ... | 04/15/2008 |
| 7332062 | Electroplating tool for semiconductor manufacture having electric field control An electroplating tool for providing a metal or metal film on a semiconductor wafer during processing thereof has a wafer chucking mechanism with a conductor or conductors associated therewith. The conductor(s) are electrically connected to a controller that applies... | 02/19/2008 |
| 7329334 | Controlling the hardness of electrodeposited copper coatings by variation of current profile Pulse reverse electrolysis of acid copper solutions is used for applying copper deposits of a controlled hardness for applications such as producing printing cylinders. The benefits include improved production capacity. Hardness of the deposit is controlled by varyi... | 02/12/2008 |
| 7314543 | Tin deposition A device includes an integrated circuit and a deposited tin in electrical contact with a portion of the integrated circuit. The deposited tin is formed by electrodeposition from a bath. The deposited tin includes a residue characteristic of the bath. The bath includ... | 01/01/2008 |
| 7309411 | Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys An electroplating bath medium for electroplating articles with a tin-cobalt, tin-nickel, or tin-cobalt-nickel alloy comprises: at least one tin salt; an alloying metal salt comprising a cobalt salt and/or a nickel salt; a complexant comprising a hydroxycarboxylic ac... | 12/18/2007 |
| 7288178 | Methods of and apparatus for making high aspect ratio microelectromechanical structures Various embodiments of the invention provide techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks th... | 10/30/2007 |
| 7239747 | Method and system for locating position in printed texts and delivering multimedia information Apparatus and methods are disclosed for processing printed material to provide an index of locations within the printed material that can be associated with external actions such as displaying a graphical image, providing an audio or video output, or providing a mul... | 07/03/2007 |
| 7208197 | Method of depositing copper on a support A process for the deposition of copper on a support. The process includes bringing a copper precursor, in the vapor phase, into contact with a heated support, optionally in the presence of hydrogen. The copper precursor is in the form of a CuCl or CuBr composition i... | 04/24/2007 |
| 7189318 | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a mathematical model of the processing ... | 03/13/2007 |
| 7189647 | Sequential station tool for wet processing of semiconductor wafers Methods and apparatus are provided for processing semiconductor wafers sequentially. Sequential processes employ multi-station processing modules, where particular encompassing wafer processes are divided into sub-processes, each optimized for increasing wafer to wa... | 03/13/2007 |
| 7172684 | Methods of and apparatus for making high aspect ratio microelectromechanical structures Various embodiments of the invention provide techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks th... | 02/06/2007 |
| 7172785 | Process for deposition of metal on a surface The invention relates to a process for depositing a metal on a material. The process comprises the steps of: immersing the material in deposition solution comprising the metal; inducing a material vibration in the deposition solution having a frequency corresponding... | 02/06/2007 |
| 7163614 | Methods of and apparatus for making high aspect ratio microelectromechanical structures Various embodiments of the invention provide techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks th... | 01/16/2007 |
| 7105082 | Composition and method for electrodeposition of metal on a work piece A composition for electrodeposition of a metal on a work piece, which electrodeposition is conducted at an electrodeposition temperature, is provided. The composition comprises a metal salt, a polymer suppressor having a cloud point, an accelerator and an electrolyt... | 09/12/2006 |
| 7101792 | Methods of plating via interconnects Methods for filling high aspect ratio vias with conductive material. At least one high aspect ratio via is formed in the backside of a semiconductor substrate. The at least one via is closed at one end by a conductive element forming a conductive structure of the se... | 09/05/2006 |
| 6992389 | Barrier for interconnect and method A method of creating a multi-layered barrier for use in an interconnect, a barrier for an interconnect, and an interconnect including the barrier are disclosed. The method includes creating the multi-layered barrier in a recess of the device terminal by use of a sin... | 01/31/2006 |
| 6974531 | Method for electroplating on resistive substrates A conductive material is electroplated onto a platable resistive metal barrier layer(s) employing a plating bath optionally comprising a super filling additive and a suppressor, and by changing the current or voltage as a function of the area of plated metal. A stru... | 12/13/2005 |
| 6953522 | Liquid treatment method using alternating electrical contacts A contact is disposed to come into contact with a metal layer formed on a substrate being treated, the contact being in contact with a surface being treated from an opposite surface through a through hole present in a substrate. Alternatively, a contact is disposed ... | 10/11/2005 |
| 6946065 | Process for electroplating metal into microscopic recessed features Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plat... | 09/20/2005 |
| 6932897 | Titanium-containing metals with adherent coatings and methods for producing same A method for plating a titanium-containing metal, comprising the steps of: (a) surface treating the titanium-containing metal in a solution consisting essentially of an aqueous solvent and hydrochloric acid for a period of time sufficient to activate the surface of ... | 08/23/2005 |
| 6921551 | Plating method and apparatus for controlling deposition on predetermined portions of a workpiece The present invention relates to methods and apparatus for plating a conductive material on a workpiece surface in a highly desirable manner. Using a workpiece-surface-influencing device, such as a mask or sweeper, that preferentially contacts the top surface of the... | 07/26/2005 |
| 6919011 | Complex waveform electroplating A method of electroplating an object includes providing a electroplating bath solution with one or more anodes therein, disposing an object to be electroplated in the bath, and passing a complex current waveform between the anode nodes and the object. The waveform i... | 07/19/2005 |
| 6913680 | Method of application of electrical biasing to enhance metal deposition A method and associated apparatus includes depositing metal on a plating surface of an object immersed in an electrolyte solution prior to bulk deposition on the plating surface. In one aspect, the method further includes applying a voltage between an anode and the ... | 07/05/2005 |
| 6893550 | Electroplating bath composition and method of using The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to copper electroplating in the fabrication of interconnect structures in semiconduc... | 05/17/2005 |
| 6863794 | Method and apparatus for forming metal layers A method of forming a metal layer on a substrate is disclosed. The metal layer is formed using a combined electrochemical plating/electrochemical mechanical polishing (ECP/EMP) process. In the ECP/EMP process, the metal layer is deposited on the substrate by contact... | 03/08/2005 |
| 6835294 | Electrolytic copper plating method Electrolytic copper plating methods are provided, wherein copper is electrolytically deposited on a substrate, and the electrolytic copper plating solution supplied to the electrolytic copper plating is subjected to dummy electrolysis using an insoluble anode. The m... | 12/28/2004 |
| 6827833 | Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields The interior of cavities and through-holes in electrically conductive substrates having high-aspect ratios of 8:1 or greater can be electroplated with a uniform layer of metal on their interior surfaces by using a pulse reverse voltage waveform having a pulse train ... | 12/07/2004 |
| 6824668 | Method for electroplating Ni-Fe-P alloys using sulfamate solution Disclosed is a method of electroplating a Ni—Fe—P alloy using a sulfamate solution and, in particular, a method of electroplating a Ni—Fe—P alloy using a plating solution containing nickel sulfamate, iron sulfamate, phosphorous acid, and a buffer agent. The ... | 11/30/2004 |
| 6824665 | Seed layer deposition Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures. ... | 11/30/2004 |
| 6814847 | Method and apparatus for electro-deposition of metal A method and apparatus for maintaining electro-deposition of metal on a cathode in an electrolytic cell. The cell comprises a metal anode, a cathode, an electrolytic bath and a main power supply to apply an electric potential across the anode and cathode resulting i... | 11/09/2004 |
| 6811675 | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece This invention employs a novel approach to the copper metallization of a workpiece, such as a semiconductor workpiece. In accordance with the invention, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper direct... | 11/02/2004 |
| 6805786 | Precious alloyed metal solder plating process A relatively simple and inexpensive process for plating precious alloyed metals, such as AuSn, AuSnIn, AgSn, AuIn and AgIn. Anodes are formed from each of the metal components in the alloy and disposed in a conducting solution. The mass of each metal components is d... | 10/19/2004 |
| 6799832 | Alloy and orifice plate for an ink-jet pen using the same An alloy that is suitable for coating a nickel orifice plate of an ink-jet printhead so as to allow the orifice plate to adhere to an intermediate layer of the ink-jet printhead and to improve the non-wetting characteristics of the nickel orifice plate is disclosed.... | 10/05/2004 |
