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| Number | Title | Issue Date |
| 7229532 | Sputtering apparatus A sputtering apparatus for forming a film by a physical gas-phase growth on a substrate having a irregular or flat shape is provided including three or more axes for independently varying a relative positional relationship between a substrate and a cathode in the co... | 06/12/2007 |
| 6905578 | Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure An apparatus and method for depositing plural layers of materials on a substrate within a single vacuum chamber allows high-throughput deposition of structures such as these for GMR and MRAM application. An indexing mechanism aligns a substrate with each of plural t... | 06/14/2005 |
| 6835289 | Particle implantation apparatus and particle implantation method The particle implantation apparatus comprises a target, an ion beam source, a target scanning mechanism, a slit plate, a holder, and a holder scanning mechanism. The target is used for sputtering. The ion beam source applies an ion beam apparently like a sheet wider... | 12/28/2004 |
| 6800183 | Sputtering device The invention is intended to provide a sputtering device in which a single sputtering chamber is equipped with a plurality of supports and a target-positioning mechanism for rotating the supports to position the targets into film-forming position. Each support is pr... | 10/05/2004 |
| 6736946 | Physical vapor deposition apparatus with modified shutter disk and cover ring Physical vapor deposition (PVD) system comprises a chamber, an upper shield and a lower shield mounted within the chamber, a cover ring having one or more tabs extending radially inwardly therefrom. The PAD system further includes a shutter disk having one or more n... | 05/18/2004 |
| 6726816 | Method for forming thin film, spheroid coated with thin film, light bulb using the spheroid and equipment for film formation The present invention provides a method for forming thin films, wherein thin films with a uniform thickness can be formed on substrates as objects such as spheroids, even when the films are formed by conventional film-formation methods using an incident particle bea... | 04/27/2004 |
| 6641702 | Sputtering device The present invention is directed to a sputtering device for depositing multi-layer films on a substrate, the sputtering device comprising at least one planar-magnetron-sputtering-cathode and at least one facing-targets-sputtering-cathode housed in a sing... | 11/04/2003 |
| 6623606 | Method and apparatus for sputter coating with variable target to substrate spacing Thickness uniformity of films sputtered from a target onto a series of substrates is maintained as the target surface shape changes due to the consumption of the target. The eroded condition of the target is sensed by directly measuring the position of a ... | 09/23/2003 |
| 6579420 | Apparatus and method for uniformly depositing thin films over substrates A thin film deposition apparatus and method are disclosed in this invention. The apparatus includes a depositing thin-film particle source, a beam-defining aperture between the particle source and the deposited substrate(s), and a substrate holder to rota... | 06/17/2003 |
| 6485616 | System and method for coating substrates with improved capacity and uniformity A system and method for coating substrates. The coating process includes an improved capacity and uniformity through the addition of a second motion component in which the substrates move in a closed path. A major portion of the path is linear and the con... | 11/26/2002 |
| 6461483 | Method and apparatus for performing high pressure physical vapor deposition A method and apparatus that operates at a high pressure of at least one torr for improving sidewall coverage within trenches and vias in a substrate. The apparatus comprises a chamber enclosing a target and a pedestal, a process gas that provides a proces... | 10/08/2002 |
| 6416635 | Method and apparatus for sputter coating with variable target to substrate spacing Thickness uniformity of films sputtered from a target onto a series of substrates is maintained as the target surface shape changes due to the consumption of the target. The eroded condition of the target is sensed by directly measuring the position of a ... | 07/09/2002 |
| 6402906 | Sputtering alloy films using a crescent-shaped aperture A method and system for producing thin film alloy by a sputtering deposition process comprising using a crescent-shaped aperture interposed between the target and substrate of a sputtering deposition system.... | 06/11/2002 |
| 6395156 | Sputtering chamber with moving table producing orbital motion of target for improved uniformity A sputtering chamber has a target that moves with an orbital motion relative to an ion beam. An X-Y assembly allows for target movement in both the horizontal and vertical directions. The X-Y assembly has a base plate, an intermediate plate, and a target ... | 05/28/2002 |
| 6355146 | Sputtering process and apparatus for coating powders A process and apparatus for coating small particles and fibers. The process involves agitation by vibrating or tumbling the particles or fibers to promote coating uniformly, removing adsorbed gases and static charges from the particles or fibers by an ini... | 03/12/2002 |
| 6350317 | Linear drive system for use in a plasma processing system A linear drive assembly for moving a body associated with processing a substrate is disclosed. The linear drive assembly includes a first gear and a second gear, which is operatively engaged with the first gear. The linear drive assembly further includes ... | 02/26/2002 |
| 6328858 | Multi-layer sputter deposition apparatus A multi-layer sputter deposition chamber or cluster tool module is described. The sputter deposition chamber includes a plurality of magnetrons mounted on a rotatable member that defines an aperture. A predetermined one of the plurality of magnetrons is p... | 12/11/2001 |
| 6309516 | Method and apparatus for metal allot sputtering A method and apparatus for sputter deposition of metal alloys with improved compositional uniformity is provided, wherein a first, narrow width target is provided with a sputtering surface comprised of a metal alloy including metal elements having differe... | 10/30/2001 |
| 6303008 | Rotating film carrier and aperture for precision deposition of sputtered alloy films A method and system for producing thin film alloy by a sputtering deposition process comprising using a circle-shaped aperture interposed between the target and substrate of a sputtering deposition system and establishing a rotating/oscillating relationsh... | 10/16/2001 |
| 6270633 | Artificial latticed multi-layer film deposition apparatus The present invention relates to an artificial latticed multi-layer film deposition apparatus for depositing on a substrate a gigantic magneto-resistive effect film (GMR film) having an artificial lattice structure formed of magnetic metal films and non-m... | 08/07/2001 |
| 6238531 | Method and apparatus to improve the properties of ion beam deposited films in an ion beam sputtering system An ion beam sputtering system having a chamber, an ion beam source, multiple targets, a shutter, and a substrate stage for securely holding a wafer substrate during the ion beam sputtered deposition process in the chamber. The substrate stage is made to t... | 05/29/2001 |
| 6235171 | Vacuum film forming/processing apparatus and method Disclosed is a vacuum film forming/processing apparatus and method which is hardly influenced by dusts and contamination on a substrate and moreover has a reduced exhaust volume. A substrate chamber for housing and holding a substrate and target chambers ... | 05/22/2001 |
| 6216631 | Robotic manipulation system utilizing patterned granular motion A system (100, 100', 100") and method for robotic manipulation of objects (130) is provided wherein particulates (110, 110') are agitated by the transfer of energy thereto to establish patterned granular motion of the particulates (110, 110'). The pattern... | 04/17/2001 |
| 6210540 | Method and apparatus for depositing thin films on vertical surfaces A mask is placed over a center portion of a deposition source to limit angle of the flux from the source. A substrate or device with a vertical surface (referenced to a major surface of the substrate or device) is rotated past the deposition source to coa... | 04/03/2001 |
| 6193853 | Magnetron sputtering method and apparatus An elongate emitter is used as a cathode to coat material onto a cylindrical workpiece by magnetron sputterinig. Where the inside surface of the workpiece is coated, the workpiece itself is used as the vacuum sputtering chamber. The overlap between the pl... | 02/27/2001 |
| 6149785 | Apparatus for coating powders A process and apparatus for coating small particles and fibers. The process involves agitation by vibrating or tumbling the particles or fibers to promote coating uniformly, removing adsorbed gases and static charges from the particles or fibers by an ini... | 11/21/2000 |
| 6123814 | Coating station A coating station has a flat sputter source opposite a workpiece receiving arrangement is configured as a planet arrangement. The rotating axes (AP) of the planets intersect one another on a rotating axis (AS) of the sun system on th... | 09/26/2000 |
| 6086727 | Method and apparatus to improve the properties of ion beam deposited films in an ion beam sputtering system An ion beam sputtering system having a chamber, an ion beam source, a multiple targets, a shutter, and a substrate stage for securely holding a wafer substrate during the ion beam sputtered deposition process in the chamber. The substrate stage is made to... | 07/11/2000 |
| 6051113 | Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure using target indexing An apparatus and method for depositing plural layers of materials on a substrate within a single vacuum chamber allows high-throughput deposition of structures such as those for GMR and MRAM application. An indexing mechanism aligns a substrate with each ... | 04/18/2000 |
| 6036821 | Enhanced collimated sputtering apparatus and its method of use A sputtering apparatus using a collimator disposed between a wafer holder for holding a wafer and a target to intercept some of the particles ejected from the target, wherein the collimator is movable in a direction parallel to the wafer surface in a mann... | 03/14/2000 |
| 5783055 | Multi-chamber sputtering apparatus A multi-chamber sputtering apparatus characterized in that a plurality of target electrodes and a substrate transfer mechanism which is able to transfer a substrate to positions facing the target electrodes and change distance between the target electrode... | 07/21/1998 |
| 5755937 | Apparatus for applying layers of metal onto a surface An apparatus and method for supporting and agitating a plurality of loose objects during a procedure known as sputter coating. A magnetron gun and the apparatus are positioned within a vacuum chamber. The magnetron or sputtering gun produces a metal ion f... | 05/26/1998 |
| 5741404 | Multi-planar angulated sputtering target and method of use for filling openings Disclosed is a multi-plans sputtering target and a method of using the multi-planar sputtering target in PVD sputtering for filling high aspect ratio interconnect structure openings. The multi-planar sputtering target comprises at least two planar sheets ... | 04/21/1998 |
| 5730847 | Arc ion plating device and arc ion plating system The present invention relates to an arc ion plating device utilizing a vacuum arc discharge to be utilized for the surface process of works and to an arc ion plating system provided with the above-mentioned device, and the present invention offers the dev... | 03/24/1998 |
| 5709785 | Metallizing machine A vacuum-metallizing machine including a metal platter base (17) having an obverse side and a face side. A substrate-receiving platter (2) is resiliently disposed (3, 3b) in a recess on the face side of the platter base (17). The platter (2) receives a su... | 01/20/1998 |
| 5662785 | Method for masking a workpiece and a vacuum treatment facility A vacuum treatment facility and method are provided for the surface treatment of workpieces, particularly for the covering of the central and/or peripheral area of circular-disk-shaped workpieces, as in the manufacturing of CD's or storage plates. The fac... | 09/02/1997 |
| 5616226 | Cathode assembly A pair of parallel elongate targets are fixed with respect to respective plates mounted in a vacuum chamber by means of clamps arranged along the longitudinal sides of each target, and an expandable wedge system between the rear plate and magnetic yokes o... | 04/01/1997 |
| 5540821 | Method and apparatus for adjustment of spacing between wafer and PVD target during semiconductor processing A heater and pedestal actuator is provided to actuate the pedestal of a deposition chamber from a first position wherein a wafer may be placed thereon to a second position adjacent to the deposition target. To adjust the inward travel of the heater to com... | 07/30/1996 |
| 5520784 | Ultrasonic enhancement of aluminum step coverage and apparatus A method and apparatus for sputter depositing aluminum onto a semiconductor substrate to fill micron and submicron vias utilizes ultrasonic energy to ensure adequate filling of the vias. The semiconductor is supported on a block and heated and subjected t... | 05/28/1996 |
| 5182256 | Process and apparatus for preparing superconducting thin films A process for preparing a thin film of high-temperature compound oxide superconductor by a magnetron sputtering method. A substrate and a target are arranged in parallel with each other in a vacuum chamber and one of the substrate and the target is moved ... | 01/26/1993 |
