Bizarre Patents
User-operated amusement apparatus for kicking the user's buttocks
An apparatus including a user-operated and controlled apparatus for self-infliction of repetitive blows to the user's buttocks by a plurality of elongated arms bearing flexible extensions that rotate under the user's control.
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| Number | Title | Issue Date |
| 8157975 | Sprayed Si- or Si:Al-target with low iron content A sputter target for sputtering a silicon-containing film is provided. The target includes a silicon-containing sputter material layer, and a carrier for carrying the sputter material layer, wherein the sputter material layer contains less than 200 ppm iron. ... | 04/17/2012 |
| 7905995 | Alternating current rotatable sputter cathode The present invention is an alternating current rotary sputter cathode in a vacuum chamber. The apparatus includes a housing containing a vacuum and a cathode disposed therein. A drive shaft is rotatably mounted in the bearing housing. A rotary vacuum seal is locate... | 03/15/2011 |
| 7399385 | Alternating current rotatable sputter cathode The present invention is an alternating current rotary sputter cathode in a vacuum chamber. The apparatus includes a housing containing a vacuum and a cathode disposed therein. A drive shaft is rotatably mounted in the bearing housing. A rotary vacuum seal is locate... | 07/15/2008 |
| 7351596 | Method and system for operating a physical vapor deposition process A method for fabricating semiconductor wafers using physical vapor deposition. The method includes maintaining a substrate on a susceptor in a chamber. The substrate has a face positioned within a vicinity of a target material, which is within the chamber. The targe... | 04/01/2008 |
| 7320331 | In-situ plasma cleaning device for cylindrical surfaces An in-situ plasma cleaning device (PCD) performs an atomic surface cleaning process to remove contaminants and/or to modify the cylindrical surfaces of both the target and substrate. The atomic cleaning process utilizes a plasma generated locally within the in-situ ... | 01/22/2008 |
| 7304435 | Device for confinement of a plasma within a volume A device of a plasma (5) for confinement of a plasma within a housing (1), comprising creation means for creating a magnetic field, said means being a series of permanent magnets (3) for creation of a magnetic field presenting an alternating mul... | 12/04/2007 |
| 7294404 | Graded photocatalytic coatings The invention provides graded photocatalytic coatings. In one aspect, the invention provides a substrate carrying a photocatalytic coating that includes a first graded film region and a second graded film region. The first graded film region has a substantially cont... | 11/13/2007 |
| 7166199 | Magnetron sputtering systems including anodic gas distribution systems The present invention provides a magnetron sputtering system using a gas distribution system which also serves as a source of anodic charge to generate plasma field. The sputtering system is comprised of a vacuum chamber, a cathode target of sputterable material, a ... | 01/23/2007 |
| 7101466 | Linear sweeping magnetron sputtering cathode and scanning in-line system for arc-free reactive deposition and high target utilization A sweeping linear magnetron is described. The magnetron has a cathode backing plate, a drive housing attached to the cathode backing plate and a motor held in the drive housing. The motor drives a yoke positioned within a cut-out in the backing plate. The yoke has a... | 09/05/2006 |
| 7052583 | Magnetron cathode and magnetron sputtering apparatus comprising the same A magnetron cathode and a sputtering apparatus including the same are provided. The magnetron cathode includes three or more magnet units, each of which comprises a single magnet or a plurality of magnets having the same poles facing toward the same direction, where... | 05/30/2006 |
| 7044078 | Layer forming method, product comprising the layer, optical film, dielectric-coated electrode and plasma discharge apparatus A layer forming method is disclosed which comprises the steps of supplying power of not less than 1 W/cm2 at a high frequency voltage exceeding 100 kHz across a gap between a first electrode and a second electrode opposed to each other at atmospheric pres... | 05/16/2006 |
| 7022209 | PVD method and PVD apparatus A PVD method and a PVD apparatus use a rotating magnetic field in order to increase the yield. The magnetic field is provided such that it essentially vanishes, at least in a time average, outside a rotation axis of the magnetic field in sectors of the target region... | 04/04/2006 |
| 7014741 | Cylindrical magnetron with self cleaning target A cylindrical magnetron capable of running at high current and voltage levels with a target tube that is self cleaning not only in the center portion, but also at the ends. Sputtering the ends of the target tube virtually eliminates accumulation of condensate at the... | 03/21/2006 |
| 6929720 | Sputtering source for ionized physical vapor deposition of metals A plasma processing system is provided with a cylindrical target, open at both ends, and with a magnet array that forms a hollow cathode magnetron (HCM). At one of the open ends is placed an inductively coupled RF energy source. A dielectric window at one end of the... | 08/16/2005 |
| 6905579 | Cylindrical magnetron target and spindle apparatus A cylindrical magnetron target and spindle attachment apparatus for affixing a cylindrical magnetron target to a rotatable support spindle. The attachment apparatus includes a target and a spindle. The target defines a receiving portion. The spindle has a spindle pl... | 06/14/2005 |
| 6885154 | Discharge plasma processing system The present invention provides a magnetic neutral line plasma discharge processing system that makes it no longer necessary to use an insulator wall in the vacuum chamber and metal such as stainless steel may alternatively be used, while maintaining the features inc... | 04/26/2005 |
| 6875321 | Auxiliary magnet array in conjunction with magnetron sputtering An array of auxiliary magnets is disclosed that is positioned along sidewalls of a magnetron sputter reactor on a side towards the wafer from the target. The magnetron preferably is a small, strong one having a stronger outer pole of a first magnetic polarity surrou... | 04/05/2005 |
| 6864773 | Variable field magnet apparatus A magnet assembly for producing a varying magnetic field is provided wherein a plurality of permanent magnets are interposed between two members which are constructed of a ferromagnetic material. Each of the magnets is rotatable and has a north and south magnetic po... | 03/08/2005 |
| 6841051 | High-power ion sputtering magnetron A high-power ion sputtering magnetron having a rotary cathode comprising a conducting member disposed within the rotary cathode being made of an electrically conductive material for conducting electrical current from the power supply to the rotary cathode. The ion s... | 01/11/2005 |
| 6837975 | Asymmetric rotating sidewall magnet ring for magnetron sputtering A magnetron system for a sputtering target having an annular vault facing the wafer to be coated and having inner and outer sidewalls and a roof. A small magnetron is positioned over the roof. A first magnet assembly having a first magnet polarity along the target a... | 01/04/2005 |
| 6835290 | System and method for controlling thin film defects A system and method for reducing and controlling the number of defects due to carbon inclusions on magnetic media is disclosed. A diamond like carbon protective layer is deposited on magnetic media using a rotary cathode target assembly. The target and cathode are c... | 12/28/2004 |
| 6793785 | Magnetic control oscillating-scanning sputter A magnetic control oscillation-scanning sputter includes a sputtering target, a base and an elongated magnet. The sputtering target has a surface with a target located thereon corresponding to the base. The target being sputtered is deposited on the base. The elonga... | 09/21/2004 |
| 6793784 | Tube target A tube target for cathode sputtering installations, and a process for producing a cylindrical hollow body for such a tube target and its use. The problem of providing a simple and low-cost process for producing a cylindrical hollow body for a tube target and of prov... | 09/21/2004 |
| 6790326 | Magnetron for a vault shaped sputtering target having two opposed sidewall magnets A plasma sputter reactor including a target with an annular vault formed in its surface facing the wafer to be sputter coated and having inner and outer sidewalls and a roof thereover. A well is formed at the back of the target between the tubular inner sidewall. A ... | 09/14/2004 |
| 6787011 | Cylindrical target and its production method A cylindrical target having a cylindrical backing tube and hollow cylindrical target material disposed on an outer circumference of the cylindrical backing tube. The backing tube and the target material are joined via an electroconductive felt present beteween the b... | 09/07/2004 |
| 6736948 | Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation An AC/DC cylindrical magnetron with a drive system that absorbs large variations in the rotation of the target tube, an efficient high capacity electrical transfer system, and improved electrical isolation. ... | 05/18/2004 |
| 6730196 | Auxiliary electromagnets in a magnetron sputter reactor A magnetron sputter reactor having a complexly shaped target with a vault arranged about a central axis facing the wafer. The vault may be right cylindrical with axially magnetized magnets disposed in back of its sidewall or be annular with preferably opposed magnet... | 05/04/2004 |
| 6689253 | Facing target assembly and sputter deposition apparatus A facing target sputtering apparatus, comprising: inner and outer spaced-apart, concentric, and coextensive tubular cathodes open at each end, with the inwardly facing surface of the outer cathode and the outwardly facing surface of the inner cathode; a first ... | 02/10/2004 |
| 6673221 | Cylindrical magnetron target and apparatus for affixing the target to a rotatable spindle assembly An improved interconnection system for attaching an improved cylindrical magnetron target to a rotatable flanged spindle incorporates an annular extension on the target, which fits over the edge of the spindle flange, facilitates centering the target on t... | 01/06/2004 |
| 6627050 | Method and apparatus for depositing a tantalum-containing layer on a substrate A method of forming a tantalum-containing layer on a substrate is described. The tantalum-containing layer is formed using a physical vapor deposition technique wherein a magnetic field in conjunction with an electric field function to confine material sp... | 09/30/2003 |
| 6610184 | Magnet array in conjunction with rotating magnetron for plasma sputtering An array of auxiliary magnets is disclosed that is positioned along sidewalls of a magnetron sputter reactor on a side towards the wafer from the target. The magnetron preferably is a small, strong one having a stronger outer pole of a first magnetic pola... | 08/26/2003 |
| 6551477 | Interlocking cylindrical magnetron cathodes and targets A cylindrical magnetron having a cylindrical cathode surrounding a cylindrical target. The cathode is without features extending inwards thereof at either end such that the target may be axially removed from or installed into the cathode from either end. ... | 04/22/2003 |
| 6500321 | Control of erosion profile and process characteristics in magnetron sputtering by geometrical shaping of the sputtering target An apparatus and method for controlling and optimizing a non-planar target shape of a sputtering magnetron system are employed to minimize the redeposition of the sputtered material and optimize target erosion. The methodology is based on the integration ... | 12/31/2002 |
| 6497796 | Apparatus and method for controlling plasma uniformity across a substrate A magnetron source comprises a hollow cathode with a non-planar target. By using a magnet between the cathode and a substrate, plasma can be controlled to achieve high ionization levels, good step coverage, and good process uniformity. Step coverage unifo... | 12/24/2002 |
| 6488824 | Sputtering apparatus and process for high rate coatings A sputtering apparatus and method for high rate deposition of electrically insulating and semiconducting coatings with substantially uniform stoichiometry. At least one set of vertically mounted, dual and triple rotatable cylindrical (or planar) magnetron... | 12/03/2002 |
| 6471831 | Apparatus and method for improving film uniformity in a physical vapor deposition system A PVD system comprises a hollow cathode magnetron with a downstream plasma control mechanism. The magnetron has a hollow cathode with a non-planar target and at least one electromagnetic coil to generate and maintain a plasma within the cathode. The magne... | 10/29/2002 |
| 6454920 | Magnetron sputtering source A sputter source has at least two electrically mutually isolated stationar bar-shaped target arrangements mounted one alongside the other and separated by respective slits. Each of the target arrangements includes a respective electric pad so that each ta... | 09/24/2002 |
| 6451177 | Vault shaped target and magnetron operable in two sputtering modes A target and magnetron for a plasma sputter reactor. The target has an annular vault facing the wafer to be sputter coated. Various types of magnetic means positioned around the vault create a magnetic field supporting a plasma extending over a large volu... | 09/17/2002 |
| 6444105 | Physical vapor deposition reactor including magnet to control flow of ions A novel hollow cathode magnetron source is disclosed. The source comprises a hollow cathode with a non-planar target. By using a magnet between the cathode and a substrate, plasma can be controlled to achieve high ionization levels, good step coverage, an... | 09/03/2002 |
| 6444104 | Sputtering target having an annular vault A target for a magnetron plasma sputter reactor. The target has an annular vault facing the wafer to be sputter coated and has a width of preferably at least 5 cm and an aspect ratio of at least 1:2, preferably 1:1. Various types of magnetic means positio... | 09/03/2002 |
