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| Number | Title | Issue Date |
| 8182662 | Rotary cathode for magnetron sputtering apparatus A rotary cathode for a magnetron sputtering apparatus is disclosed. The rotary cathode comprises a rotatable target cylinder, and a non-rotatable interior structure in the target cylinder. The interior structure has an outer surface and an inner passageway. An outer... | 05/22/2012 |
| 8163144 | Magnetron sputtering device The present invention relates to a magnetron sputtering device and technique for depositing materials onto a substrate at a high production rate in which the deposited films have predictive thickness distribution and in which the apparatus can operate continuously a... | 04/24/2012 |
| 8038858 | Coaxial plasma arc vapor deposition apparatus and method An apparatus for deposition of plasma reaction films includes a substrate for the deposition of either thin or thick films. The substrate also allows for a film deposition which adheres to the substrate, and also films which may be removed after deposition. The cath... | 10/18/2011 |
| 7368041 | Method for controlling plasma density or the distribution thereof Method for manufacturing magnetron sputter-coated workpieces includes placing a substrate adjacent a magnetron source having a target cathode, generating above the target cathode, at least one plasma loop by an electron trap established by generating a magnetic fiel... | 05/06/2008 |
| 7361256 | Electrolytic reactor An electrolytic reactor including a conical recess of removable slices through which the electrolyte circulates towards a part to be coated under the action of a pump setting up forced circulation. The part is polarized to act as a cathode, facing a coaxial anode in... | 04/22/2008 |
| 7347919 | Sputter source, sputtering device, and sputtering method According to the invention, when targets are sputtered, each of them moves with respect to a substrate; and therefore, the entire area of the substrate is opposed to the targets during sputtering, so that a film of homogeneous quality can be formed on the surface of... | 03/25/2008 |
| 7294404 | Graded photocatalytic coatings The invention provides graded photocatalytic coatings. In one aspect, the invention provides a substrate carrying a photocatalytic coating that includes a first graded film region and a second graded film region. The first graded film region has a substantially cont... | 11/13/2007 |
| 7244344 | Physical vapor deposition plasma reactor with VHF source power applied through the workpiece A physical vapor deposition plasma reactor includes a vacuum chamber including a sidewall, a ceiling and a wafer support pedestal near a floor of the chamber, and a vacuum pump coupled to the chamber, a process gas inlet coupled to the chamber and a process gas sour... | 07/17/2007 |
| 7211179 | Dual anode AC supply for continuous deposition of a cathode material There is provided by this invention an apparatus for sputter deposition of an insulating material in a continuous mode of operation that utilizes at least two sputtering anodes and a cathode connected to a center tapped conductor to maintain the target cathode at a ... | 05/01/2007 |
| 7198699 | Sputter coating apparatus including ion beam source(s), and corresponding method A coating apparatus deposits a first coating (single or multi-layered) onto a first side of a substrate (e.g., glass substrate) passing through the apparatus, and a second coating (single or multi-layered) onto the other or second side of the substrate. In certain e... | 04/03/2007 |
| 7192648 | Thin film coating having transparent base layer The invention provides thin film coatings that have a transparent base layer. For example, the invention provides low-emissivity coatings with a transparent base layer. In certain embodiments, a silicon dioxide base layer is used. Methods of producing thin film coat... | 03/20/2007 |
| 7182842 | Device for amplifying the current of an abnormal electrical discharge and system for using an abnormal electrical discharge comprising one such device A device (1) for amplifying the current of an abnormal electrical discharge, characterized in that it comprises an electrode which is positively polarized (2) and associated with a magnetic circuit (3) producing a magnetic field (4) which... | 02/27/2007 |
| 7166199 | Magnetron sputtering systems including anodic gas distribution systems The present invention provides a magnetron sputtering system using a gas distribution system which also serves as a source of anodic charge to generate plasma field. The sputtering system is comprised of a vacuum chamber, a cathode target of sputterable material, a ... | 01/23/2007 |
| 7147759 | High-power pulsed magnetron sputtering Magnetically enhanced sputtering methods and apparatus are described. A magnetically enhanced sputtering source according to the present invention includes an anode and a cathode assembly having a target that is positioned adjacent to the anode. An ionization source... | 12/12/2006 |
| 7135097 | Box-shaped facing-targets sputtering apparatus and method for producing compound thin film Disclosed is a box-shaped facing-targets sputtering apparatus capable of forming, at low temperature, a compound thin film of high quality while causing minimal damage to an underlying layer. The box-shaped facing-targets sputtering apparatus includes a box-shaped f... | 11/14/2006 |
| 7098667 | Cold cathode ion gauge A cold cathode ion gauge is provided that is suitable for use in a high vacuum and in the presence of contaminating gases. By decreasing the discharge current and, more precisely, decreasing the charge current density received by the gauge electrodes, and using cert... | 08/29/2006 |
| 7037589 | Thin film coating having niobium-titanium layer The invention provides niobium-titanium films, coatings (e.g., low-emissivity coatings) comprising one or more niobium-titanium films, and substrates bearings such coatings. Methods of depositing niobium-titanium films are also provided. ... | 05/02/2006 |
| 7014741 | Cylindrical magnetron with self cleaning target A cylindrical magnetron capable of running at high current and voltage levels with a target tube that is self cleaning not only in the center portion, but also at the ends. Sputtering the ends of the target tube virtually eliminates accumulation of condensate at the... | 03/21/2006 |
| 6972079 | Dual magnetron sputtering apparatus utilizing control means for delivering balanced power There is disclosed a dual magnetron sputtering apparatus that is comprised of a balancing circuit connected to the output of an ac power source that supplies ac power to at least two target materials such that the balancing circuit allows the power supply to deliver... | 12/06/2005 |
| 6969426 | Forming improved metal nitrides Method and apparatus are provided for forming metal nitride (MN), wherein M is contacted with iodine vapor or hydrogen iodide (HI) vapor to form metal iodide (MI) and then contacting MI with ammonia to form the MN in a process of reduced or no toxicity. Such method ... | 11/29/2005 |
| 6960283 | Anode and magnetron therewith Anode with a 2450 MHz resonance frequency, and magnetron therewith, the anode including a cylindrical anode body with an inside diameter in a range of 32.5 to 34.0 mm, a total of ten vanes fitted to an inside circumferential surface of the anode body in a radial dir... | 11/01/2005 |
| 6896773 | High deposition rate sputtering Methods and apparatus for high-deposition sputtering are described. A sputtering source includes an anode and a cathode assembly that is positioned adjacent to the anode. The cathode assembly includes a sputtering target. An ionization source generates a weakly-ioni... | 05/24/2005 |
| 6869509 | Source for vacuum treatment process The invention relates to an arc source or a source for vaporizing or sputtering of materials and a method for operating a source. The source comprises an insulated counter-electrode and/or an AC magnet system. Thereby, dependent on the requirement, any desired poten... | 03/22/2005 |
| 6855236 | Components for vacuum deposition apparatus and vacuum deposition apparatus therewith, and target apparatus A component for a vacuum deposition apparatus comprises a component body and a spray deposit formed on a surface of a component body. A spray deposit has surface roughness in which a mean spacing S of tops of local peak of profile is in the range from 50 to 150 μm,... | 02/15/2005 |
| 6818103 | Method and apparatus for substrate biasing in multiple electrode sputtering systems A method and an apparatus are disclosed for causing ion bombardment of the substrate during sputter deposition of an insulating or conducting material on a substrate (3) when using dual cathode or dual anode sputtering approaches. A novel electrical circuit i... | 11/16/2004 |
| 6783638 | Flat magnetron An electric field is provided in a first direction between an anode and a target having a flat disposition. A magnetic field is provided such that the magnetic flux lines are in a second direction substantially perpendicular to the first direction. The magnet struct... | 08/31/2004 |
| 6767436 | Method and apparatus of plasma-enhanced coaxial magnetron for sputter-coating interior surfaces A plasma-enhanced coaxial magnetron sputter-cleaning and coating assembly for sputter-cleaning and coating the interior surfaces of a cylindrical workpiece is provided. The apparatus sputter-coats the workpiece using a cylindrical sputtering material, the material h... | 07/27/2004 |
| 6761804 | Inverted magnetron A source of sputtered deposition material has, in one embodiment, a torus-shaped plasma generation area in which a plasma operates to sputter the interior surface of a toroidal cathode. In one embodiment, the sputtered deposition material passes to the exterior of t... | 07/13/2004 |
| 6752911 | Device and method for coating objects at a high temperature The invention relates to a device for coating an object at a high temperature by means of cathode sputtering, having a vacuum chamber and a sputter source, the sputter source having a sputtering cathode. Inside the vacuum chamber is arranged an inner chamber formed ... | 06/22/2004 |
| 6706155 | Sputtering apparatus and film manufacturing method In order to form a thin film having a high aspect ratio, a space between a target within a vacuum chamber and a substrate table is enclosed by an anode electrode and earth electrodes. The anode electrode is positioned on the side of the target, and a positive voltag... | 03/16/2004 |
| 6699374 | Low temperature cathodic magnetron sputtering An apparatus and method for cathodic magnetron sputtering of a coating onto a temperature-sensitive substrate is disclosed. The apparatus consists of a vacuum chamber having a work-supporting station and a magnetron sputtering target opposite the work-sup... | 03/02/2004 |
| 6692617 | Sustained self-sputtering reactor having an increased density plasma A plasma reactor for physical vapor deposition (PVD), also known as sputtering, which is adapted so that the atomic species sputtered from the target can self-sustain the plasma without the need of a working gas such as argon. The self-sustained sputterin... | 02/17/2004 |
| 6676752 | Forming metal nitrides Method and apparatus are provided for forming metal nitrides (MN) wherein M is contacted with iodine vapor or hydrogen iodide (HI) vapor to form metal iodide (MI) and contacting MI with ammonia to form the MN in a process of reduced or no toxicity. MN is ... | 01/13/2004 |
| 6620298 | Magnetron sputtering method and apparatus A first target is arranged opposite a substrate while a second target is arranged not opposite the substrate within a vacuum chamber. Pressure within the vacuum chamber is adjusted to a first pressure, and during a period wherein the pressure is changed f... | 09/16/2003 |
| 6605198 | Apparatus for, and method of, depositing a film on a substrate An electrical field between a positive anode and a negative target in a cavity and a magnetic field in the cavity cause electrons from the target to ionize neutral gas (e.g. argon) atoms in the cavity. The ions cause the target to release sputtered atoms ... | 08/12/2003 |
| 6592729 | In-line sputtering apparatus An in-line sputtering apparatus includes a deposition chamber, a target installed inside the deposition chamber, a substrate holder to hold a substrate, a substrate holder transferring mechanism which transfers the substrate holder relative to the target ... | 07/15/2003 |
| 6585871 | Method of film deposition on substrate surface and substrate produced by the method A method of film deposition is disclosed, which eliminates the conventional problem that a coating film having a component concentration gradient in the thickness direction and thus having a boundary with a compositional gradient or a coating film in whic... | 07/01/2003 |
| 6579423 | Light transmitting electromagnetic wave filter and process for producing the same A light transmitting electromagnetic wave filter comprising a transparent and a light transmitting electromagnetic wave shield film having a laminate structure composed of 2n+1 (nࣙ1) layers in which at least two dielectric layers and at least one silver... | 06/17/2003 |
| 6562200 | Thin-film formation system and thin-film formation process In a thin-film formation process and system, a target and a substrate are placed in a sputtering space and a film-forming space, respectively, the pressure in the film-forming space is maintained at a pressure lower than the pressure in the sputtering spa... | 05/13/2003 |
| 6554979 | Method and apparatus for bias deposition in a modulating electric field The present invention provides a method and apparatus for achieving conformal step coverage of one or more materials on a substrate using sputtered ionized material. In one embodiment, a chamber having one or more current return plates, a support member, ... | 04/29/2003 |
