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| Number | Title | Issue Date |
| 8182661 | Controllable target cooling A sputter target assembly particularly useful for a large panel plasma sputter reactor having a target assembly sealed both to the main processing chamber and a vacuum pumped chamber housing a moving magnetron. The target assembly to which target tiles are bonded in... | 05/22/2012 |
| 7959776 | Cooled backing plate for a sputtering target, and sputtering target comprising a plurality of backing plates Claimed is a sputtering target system comprising a plurality of backing plates to be individually cooled. Each backing plate is provided on its back side with a meandering groove that is closed off by a sealing plate. The sealing plate is welded around its circumfer... | 06/14/2011 |
| 7938943 | Supply end block for rotary magnetron A supply end block to supply a sputter cathode with a coolant and electrical voltage, includes a housing with a coolant connection and a current connection as well as a support shaft mounted to rotate, on which a target tube is fastened. The coolant connection and c... | 05/10/2011 |
| 7901552 | Sputtering target with grooves and intersecting channels A sputtering chamber has a sputtering target comprising a backing plate and a sputtering plate. The backing plate comprises a backside surface having a plurality of concentric circular grooves and a plurality of arcuate channels which intersect the circular grooves.... | 03/08/2011 |
| 7799190 | Target backing plate for sputtering system A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. Multiple magnets (one for each target) in the magnetron assembly in the sputtering chamber... | 09/21/2010 |
| 7771574 | Sputtering cathode for coating processes A sputtering cathode (1) for coating processes in a vacuum chamber (18) comprises one at least single-piece target plate (2) mounted on a metallic diaphragm (3). On the side of the diaphragm (3) facing away from the target plate ( | 08/10/2010 |
| 7678248 | Circulated cooled target A liquid and a gas is constantly filled into a target chamber of a target. Then the liquid and the gas flow around the chamber and are flown out. By doing so, the target is effectively cooled down. ... | 03/16/2010 |
| 7632383 | Vacuum sputtering cathode A vacuum sputtering cathode includes a target support having a cooler. The cathode includes a support base on which a frame is disposed. The frame defines at least one cavity for the circulation of a coolant. A membrane is disposed on top of the frame and the base, ... | 12/15/2009 |
| 7625471 | Sacrificial cathode target for sputtering cathode assembly A sputtering cathode assembly attachable to a cathode mounting plate for a thin-film vapor deposition chamber. The cathode assembly includes a magnet module and a cathode body generally coextensive with and sealingly housing the magnet module and defining a water ch... | 12/01/2009 |
| 7560011 | Sputtering target and method/apparatus for cooling the target A sputtering target includes an outer target tube, an inner support tube supporting a magnet carrier bar extending along substantially the entire length of the inner support tube; and a water cooling circuit including at least one passageway within the inner support... | 07/14/2009 |
| 7504011 | Sputtering target and method/apparatus for cooling the target A sputtering target comprising an outer target tube, an inner support tube supporting a magnet carrier extending along substantially the entire length of the inner support tube; and a water cooling circuit including at least one passageway within the inner support t... | 03/17/2009 |
| 7479210 | Temperature control of pallet in sputtering system A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. The system includes a sputtering chamber and a separate pre-clean chamber, where wafers ca... | 01/20/2009 |
| 7413639 | Energy and media connection for a coating installation comprising several chambers The invention relates to an energy and media connection module for coating installations. Said module serves for supplying with cooling water, compressed air, process gases, signal, control and cathode power. It can be moved from one coating chamber to another coati... | 08/19/2008 |
| 7361411 | Hardfacing alloy, methods, and products Disclosed is a hardfacing alloy capable of withstanding service abrasion of the order of silicious earth particles and weldable on industrial products, such as tool joints and stabilizers used in oil and gas well drilling, and other industrial products. The hardfaci... | 04/22/2008 |
| 7342236 | Fluid-cooled ion source An ion source is cooled using a cooling plate that is separate and independent of the anode. The cooling plate forms a coolant cavity through which a fluid coolant (e.g., liquid or gas) can flow to cool the anode. In such configurations, the magnet may be thermally ... | 03/11/2008 |
| 7309527 | Hydrophilic surfaces carrying temporary protective covers A substrate carrying a temporary protective cover and related methods of producing and processing substrates are described. In one embodiment, a substrate bears a hydrophilic coating carrying a temporary protective cover that protects the hydrophilic coating against... | 12/18/2007 |
| 7305275 | Material supply system in semiconductor device manufacturing plant In a small scaled plant intended for flexible manufacturing, a pure water supply system is provided at a low cost without reducing a production efficiency. A pure water system produces a plurality of grades of pure water which are supplied through pipes connected to... | 12/04/2007 |
| 7300457 | Self-supporting metallic implantable grafts, compliant implantable medical devices and methods of making same Implantable medical grafts fabricated of metallic or pseudometallic films of biocompatible materials having a plurality of microperforations passing through the film in a pattern that imparts fabric-like qualities to the graft or permits the geometric deformation of... | 11/27/2007 |
| 7273533 | Plasma processing system with locally-efficient inductive plasma coupling An inductively coupled plasma source is provided with a peripheral ionization source for producing a high-density plasma in a vacuum chamber for semiconductor wafer coating or etching. The source includes a segmented configuration having high and low radiation segme... | 09/25/2007 |
| 7270724 | Scanning plasma reactor A scanning plasma reactor for exciting reactant gases at a substrate surface including a beam forming module, a gas injection module, a reaction chamber with a window and a vacuum chuck, a gas exhaust module. Radiation from the beam forming module and the reactant g... | 09/18/2007 |
| 7235162 | Cathode for vacuum sputtering treatment machine A cathode for a vacuum sputtering processing machine includes a target plate mounted on a support having a cooler. The support is secured to a frame delimiting a closed space for positioning and centering the target. The frame peripherally has a profiled catching ri... | 06/26/2007 |
| 7182816 | Particulate reduction using temperature-controlled chamber shield Particle flaking is reduced in a semiconductor wafer processing apparatus by installing a chamber shield assembly in the chamber of the apparatus. The shield assembly includes a plurality of nested shields that are supported out of contact with each other and suspen... | 02/27/2007 |
| 7156960 | Method and device for continuous cold plasma deposition of metal coatings A method for the deposition of a metal layer on a substrate (1) uses a cold plasma inside an enclosure (7) heated to avoid the formation of a metal deposit at its surface. The enclosure has an inlet (21) and an outlet (22) for the substra... | 01/02/2007 |
| 7156961 | Sputtering apparatus and film forming method The present invention is to provide a sputtering apparatus and a thin film formation method which make it possible to form respective layers of a multilayer film having a clean interface at a optimum temperature, or which make it possible to continuously carry out t... | 01/02/2007 |
| 7150792 | Film deposition system and film deposition method using the same The present invention provides a film deposition system capable of effectively cooling a work having a large volume, and a film deposition method using this system. The film deposition system has, within a vacuum chamber 1, an evaporation source 3 for ... | 12/19/2006 |
| 7114350 | Refrigerator with evaporator of variable dimensions A refrigerator with an evaporator and at least one preservation compartment, in which the evaporator is formed from extendable spiral-wound tube of engineering polymer. ... | 10/03/2006 |
| 7101466 | Linear sweeping magnetron sputtering cathode and scanning in-line system for arc-free reactive deposition and high target utilization A sweeping linear magnetron is described. The magnetron has a cathode backing plate, a drive housing attached to the cathode backing plate and a motor held in the drive housing. The motor drives a yoke positioned within a cut-out in the backing plate. The yoke has a... | 09/05/2006 |
| 7090741 | Semiconductor processing system A semiconductor processing system includes a common transfer chamber (34) having first and second compartments (46, 48) partitioned by a partition wall (44). First and second vacuum processing apparatuses (32E, 32A) are respectivel... | 08/15/2006 |
| 7087145 | Sputtering cathode assembly A sputtering cathode assembly attachable to a cathode mounting plate for a thin-film vapor deposition chamber. The cathode assembly includes a magnet module and a cathode body generally coextensive with and sealingly housing the magnet module and defining a water ch... | 08/08/2006 |
| 7071563 | Barrier layer for interconnect structures of a semiconductor wafer and method for depositing the barrier layer An interconnect structure of a semiconductor device includes a tungsten plug (14) deposited in a via or contact window (11). A barrier layer (15) separates the tungsten plug (14) from the surface of a dielectric material (16) withi... | 07/04/2006 |
| 7065900 | Docking-type system and method for transferring and treating substrate A substrate transferring/treating system includes a substrate stacking base, a substrate transferring member for receiving/transferring the substrate from/to the base, a substrate cleaning/drying device for cleaning and drying the substrate transferred from the subs... | 06/27/2006 |
| 7056806 | Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces The present disclosure provides methods and apparatus useful in depositing materials on batches of microfeature workpieces. One implementation provides a method in which a quantity of a first precursor gas is introduced to an enclosure at a first enclosure pressure.... | 06/06/2006 |
| 7056416 | Atmospheric pressure plasma processing method and apparatus Provided is a plasma processing method for generating microplasma in a space of a microplasma source arranged in the vicinity of an object to be processed by supplying gas to the space and supplying electric power to a member located in the vicinity of the space, ma... | 06/06/2006 |
| 7046719 | Soft handoff between cellular systems employing different encoding rates A receiver (200) is provided receiving signals from differing base stations (BTSA and BTSB). The signal from BTSA is encoded using a first rate convolutional encoder while the signal transmitted from BTSB is encoded... | 05/16/2006 |
| 7034371 | Biochip for the capacitive stimulation and/or detection of biological tissue and a method for its production The present invention relates to a biochip for capacitive stimulation and/or detection of biological tissue. The biochip includes a support structure, at least one stimulation and/or sensor device, which is arranged in or on the support structure, and at least one d... | 04/25/2006 |
| 7018515 | Selectable dual position magnetron A dual-position magnetron that is rotated about a central axis in back of a sputtering target, particularly for sputtering an edge of a target of a barrier material onto a wafer and cleaning material redeposited at a center of the target. During target cleaning, waf... | 03/28/2006 |
| 7000418 | Capacitance sensing for substrate cooling Described is a cooling system for use in the manufacture of substrates into magnetic disk memory in which cooling plates are positioned dynamically in relation to a substrate to be cooled. This enables positioning the cooling plates closer for more effective cooling... | 02/21/2006 |
| 7001491 | Vacuum-processing chamber-shield and multi-chamber pumping method One or more chambers of a multi-chamber vacuum processing apparatus are provided with a high gas flow conductance path to an exhaust volume of the apparatus that is maintained at high vacuum with a high vacuum pump. Separate pumps for the one or more chambers are ma... | 02/21/2006 |
| 6964731 | Soil-resistant coating for glass surfaces A glass article which has a water-sheeting coating and a method of applying coatings to opposed sides of a substrate are described. In one embodiment, a glass sheet is provided bearing a sputtered water-sheeting coating comprising silica on an exterior surface and b... | 11/15/2005 |
| 6962648 | Back-biased face target sputtering A facing targets sputtering device for semiconductor fabrication includes an air-tight chamber in which an inert gas is admittable and exhaustible; a pair of target plates placed at opposite ends of said air-tight chamber respectively so as to face each other and fo... | 11/08/2005 |
