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| Number | Title | Issue Date |
| 7670468 | Contact assembly and method for electrochemical mechanical processing Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a contact assembly for electrochemically processing a substrate includes a housing having a ball ... | 03/02/2010 |
| 7361256 | Electrolytic reactor An electrolytic reactor including a conical recess of removable slices through which the electrolyte circulates towards a part to be coated under the action of a pump setting up forced circulation. The part is polarized to act as a cathode, facing a coaxial anode in... | 04/22/2008 |
| 7294243 | Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly (400) can comprise a support member (410) that includes an inner wall (412) which defines an opening (414) configured to receive the wor... | 11/13/2007 |
| 7189313 | Substrate support with fluid retention band An apparatus and method for supporting a substrate is provided. In one embodiment, an apparatus for supporting a substrate includes a body having a band extending therefrom. The band is adapted to retain a fluid on the body thereby forming a shallow processing bath ... | 03/13/2007 |
| 7169269 | Plating apparatus, plating cup and cathode ring A plating apparatus (10) provided with: a plating vessel (61a to 61d) having a cylindrical side wall (361) for containing a plating liquid; a substrate holding mechanism (74a to 74d) for generally... | 01/30/2007 |
| 7141147 | Electrolytic cell The invention relates to an electrolytic cell, and a method for manufacturing such cell. The cell comprises an anode and a cathode compartment, a separator partitioning the compartments, gas diffusion electrode members arranged to the separator with a space between ... | 11/28/2006 |
| 7138039 | Liquid isolation of contact rings Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending fro... | 11/21/2006 |
| 7112268 | Plating device and plating method A plating device and a plating method are provided that are capable of enhancing uniformity in plating on a treatment surface of an object to be treated. The plating device includes: a plating solution bath capable of storing a plating solution and having a first el... | 09/26/2006 |
| 7087144 | Contact ring with embedded flexible contacts A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an an... | 08/08/2006 |
| 7021476 | Jig and a method and apparatus of applying a surface treatment to a member on the jig A jig (10) is provided for holding an elongate member (56) to be surface treated. The jig (10) comprises a beam (12) and a plurality of hangers 14 spaced apart along the beam (12). The hangers (14) have supports (9... | 04/04/2006 |
| 6962649 | Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblies can comprise a support member that includes an inner wall which defines an opening configured to receive the workpiece and a plurality of contacts. The individual... | 11/08/2005 |
| 6939448 | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact a... | 09/06/2005 |
| 6926813 | Electrical contacting element made of an elastic material To electrically contact and electrolytically treat, more specifically to electroplate, very thin, electrically conductive layers, especially with a high electrolytic current, a device comprising contact carriers, more specifically clamps, clips and like, with contac... | 08/09/2005 |
| 6911127 | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact a... | 06/28/2005 |
| 6887113 | Contact element for use in electroplating It is difficult to transmit large processing current on the surfaces of printed circuit boards (L) using clamp-type contact organs (6, 7). In order to solve said problem, contact elements (15, 16) having one or more contact surfaces (26) are dis... | 05/03/2005 |
| 6841047 | Electrolysis cell, in particular for the electrochemical preparation of chlorine The invention relates to an electrolysis cell comprising an anode frame (26), an anode (24), a cation-exchange membrane (34), a gas diffusion electrode (32), a current collector (10) and a cathode frame (12), with the anode ... | 01/11/2005 |
| 6805778 | Contact assembly for supplying power to workpieces during electrochemical processing Methods used in semiconductor electroplating systems, such as for plating copper, onto a semiconductor wafer or other semiconductor workpiece. The methods apply to patterned metal layers plated onto a seed layer which is partially protected by an overlying photoresi... | 10/19/2004 |
| 6755946 | Clamshell apparatus with dynamic uniformity control The present invention includes apparatus and methods for measuring impedance of a layer of deposited metal on a substrate and controlling deposition uniformity during electroplating. A first circuit delivers plating current to a metal layer on the substrate, and a s... | 06/29/2004 |
| 6749728 | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the present invention, the top section and the bottom section are configured ... | 06/15/2004 |
| 6726823 | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces A wafer chuck assembly for holding a wafer during electroplating and/or electropolishing of the wafer includes a wafer chuck for receiving the wafer. The wafer chuck assembly also includes an actuator assembly for moving the wafer chuck between a first and a second ... | 04/27/2004 |
| 6699712 | Electroporation chamber A shocking chamber for performing electroporation is constructed in the form of a base and a hinged lid which when lowered forms an enclosure with the base that fully encloses a cuvette and impresses a high voltage across the cuvette, the voltage connecti... | 03/02/2004 |
| 6673218 | Cathode cartridge for electropating tester A cathode cartridge (N) for an electroplating tester includes a cathode conductor (10) that conducts electricity to a surface (Wa) to be plated of a silicon wafer (W) as an object to be plated, a first insulator (20) that covers a front side of the silico... | 01/06/2004 |
| 6613200 | Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform An apparatus is provided for depositing and polishing a material layer on a substrate. In one embodiment, an apparatus is provided which includes a basin, a cover, a permeable disc, an anode and a polishing head. The permeable disc is disposed in the basi... | 09/02/2003 |
| 6579430 | Semiconductor wafer plating cathode assembly A cathode assembly for semiconductor wafer plating employs a polymer coating on a metal structural ring to provide a low-profile seal to the perimeter of the wafer surface to be plated. The polymer coating also electrically insulates the metal so that it ... | 06/17/2003 |
| 6572743 | Electroplating assembly for metal plated optical fibers An electrode assembly for electroplating conducting portions of nonconductors comprises an insulating frame having a first projection opposite a second projection. Preferably the insulating frame comprises a resin selected from the group consisting of acr... | 06/03/2003 |
| 6569302 | Substrate carrier The invention relates to a substrate carrier for holding substrates, especially semiconductor wafers. Good sealing of the wafer surface and electrical contact are made possible in that the substrate carrier has a first and a second part having a central o... | 05/27/2003 |
| 6565983 | Electrical contact element and use of the contact element An electrical contact element for electrically connecting an electric device and providing current transmission in an electric device wherein the electrical contact element comprises a metallic body, and wherein at least one contact surface, present on th... | 05/20/2003 |
| 6562204 | Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are provided to mitigate corrosion of a metal seed layer on recessed ... | 05/13/2003 |
| 6540899 | Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces A method and apparatus for fluid sealing the underside of a workpiece, such as a semiconductor wafer and the like, during wet-processing such as electrodeposition and the like, employing an elastomeric encased ring of flexible fingers against which the pe... | 04/01/2003 |
| 6527926 | Electroplating reactor including back-side electrical contact apparatus An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the... | 03/04/2003 |
| 6521103 | Plating clamp assembly A plating clamp assembly for use with a plating system including a plating bath and an article transport assembly to selectively engage an article to be plated as the article is moved through the plating bath by the article transport assembly to coat at l... | 02/18/2003 |
| 6517689 | Plating device The present invention is to provide a conduction detection device that can detect electrical conductivity (contact condition) of feeding contacts with conductive layers of a substrate. The present invention also provides an electroplating apparatus, which... | 02/11/2003 |
| 6500320 | Fastening apparatus A fastening apparatus is provided, in particular, for work-pieces in the form of plates for use in electrochemical baths. The fastening apparatus ensures that the contact quality is achieved irrespective of the thickness of the work-piece. The fastening a... | 12/31/2002 |
| 6495007 | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workplaces A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the present invention, the top section and the bottom section are ... | 12/17/2002 |
| 6478937 | Substrate holder system with substrate extension apparatus and associated method An apparatus and associated method that removes electrolyte solution from a substrate, the apparatus comprises a thrust plate and a substrate extension unit. The thrust plate at least partially defines a spin recess. The substrate extension unit can be di... | 11/12/2002 |
| 6475357 | Inflatable compliant bladder assembly The present invention provides a bladder assembly for use in an electroplating cell. The bladder assembly comprises a mounting plate, a bladder, and an annular manifold. One or more inlets are formed in the mounting plate and are coupled to a fluid source... | 11/05/2002 |
| 6454926 | Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas A semiconductor workpiece holder used in electroplating systems for plating metal layers, such as copper, onto a semiconductor workpiece. The workpiece holder includes electrodes which extend and are partially submerged in a liquid plating bath. The elect... | 09/24/2002 |
| 6444101 | Conductive biasing member for metal layering A contact ring applies electroplating to a substrate having an electrically conductive portion. The contact ring comprises an annular insulative body, a conductive biasing member, and a seal member. The annular insulative body defines a central opening. T... | 09/03/2002 |
| 6413391 | Masking techniques for metal plating Apparatus for metal plating an article comprising a frame having a plurality of sealing members positioned thereon, the frame being capable of conducting an electrical current between sealing members, each sealing member being adapted to be in close conta... | 07/02/2002 |
| 6365020 | Wafer plating jig The present invention is to provide a wafer plating jig for a plating apparatus having a simple construction and capable of sealing conducting pins from the plating solution completely. The wafer plating jig for gripping a wafer, comprises a main jig body... | 04/02/2002 |
