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An aircraft having vertical takeoff and landing capability provided with at least first and second laterally extending paddle wheels rotatable on a central axis perpendicular to the longitudinal axis of the aircraft fuselage and between its nose and tail.
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| Number | Title | Issue Date |
| 8066856 | Service module with at least one anode clamp and means for applying a force or a shock on the anode rod A tending module for a series of electrolysis cells designed for the manufacture of aluminum by igneous electrolysis, each cell including a series of anodes provided with a metal rod designed to fix and electrically connect the anodes to a metal anode frame. The ten... | 11/29/2011 |
| 7938942 | Single side workpiece processing A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational ... | 05/10/2011 |
| 7645366 | Microelectronic workpiece holders and contact assemblies for use therewith The invention provides an improved contact ring and an improved workpiece support, each of which is useful alone or jointly with the other in a workpiece holder for electrochemically treating microelectronic workpieces. Several embodiments of the invention provide a... | 01/12/2010 |
| 7416648 | Image sensor system for monitoring condition of electrode for electrochemical process tools A system for use in manufacturing semiconductor devices, is provided. The system includes an electrochemical processing tool and an image sensor. The electrochemical processing tool includes an electrode located at a central region of a platen. The electrode is adap... | 08/26/2008 |
| 7294243 | Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly (400) can comprise a support member (410) that includes an inner wall (412) which defines an opening (414) configured to receive the wor... | 11/13/2007 |
| 7214297 | Substrate support element for an electrochemical plating cell A contact ring for an electrochemical plating system is provided. The contact ring includes an annular substrate supporting member, a plurality of radially positioned conductive substrate contact pins extending from the substrate supporting member, an annular conduc... | 05/08/2007 |
| 7211178 | Fixture for electro-chemical machining On a fixture for electro-chemical machining for the production of long, curved cavities (11) in a component (12), the working electrode (3) of the electro-chemical machining tool (1) is connected to a guide body (1a) which m... | 05/01/2007 |
| 7208070 | Stent manufacture The present invention provides improvements in methods for the manufacture of stents. Specifically, the invention provides methods wherein stents are placed on jigs of various designs which facilitate manufacture, stents carried by the jigs are immersed in liquid ba... | 04/24/2007 |
| 7204920 | Contact ring design for reducing bubble and electrolyte effects during electrochemical plating in manufacturing A contact ring for use in electroplating of a substrate material is constructed such that fluid (e.g., electrolyte) is allowed to flow radially away from the axis of a toroidal support ring, thus preventing the trapping of fluids between the substrate and the toroid... | 04/17/2007 |
| 7138039 | Liquid isolation of contact rings Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending fro... | 11/21/2006 |
| 7087144 | Contact ring with embedded flexible contacts A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an an... | 08/08/2006 |
| 7067045 | Method and apparatus for sealing electrical contacts during an electrochemical deposition process An apparatus for securing a substrate in an electrochemical deposition system is provided. The apparatus generally includes a substrate support member adapted to receive the substrate and a thrust plate assembly adapted to exert a downward force on the substrate. Fo... | 06/27/2006 |
| 7025862 | Plating uniformity control by contact ring shaping An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating surface adapted to recei... | 04/11/2006 |
| 6999184 | Electronic component mounting apparatus and electronic component mounting method Jig interchanging mechanism for supplying and carrying out a component holding jig to and from an electronic component supply portion is moved by a component image taking camera moving mechanism for moving the component image taking camera above the electronic compo... | 02/14/2006 |
| 6962649 | Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblies can comprise a support member that includes an inner wall which defines an opening configured to receive the workpiece and a plurality of contacts. The individual... | 11/08/2005 |
| 6939448 | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact a... | 09/06/2005 |
| 6911127 | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact a... | 06/28/2005 |
| 6855235 | Anode impedance control through electrolyte flow control Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to s... | 02/15/2005 |
| 6849167 | Electroplating reactor including back-side electrical contact apparatus An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece ... | 02/01/2005 |
| 6843897 | Anode slime reduction method while maintaining low current Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to s... | 01/18/2005 |
| 6749728 | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the present invention, the top section and the bottom section are configured ... | 06/15/2004 |
| 6673219 | Transverse conveyor for electrodes The invention relates to a transverse conveyor for electrodes used in the production of metals. This transverse conveyor consists of a transfer device, located below the electrodes to be transferred and which device moves back and forth on a horizontal pl... | 01/06/2004 |
| 6663762 | Plating system workpiece support having workpiece engaging electrode A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrod... | 12/16/2003 |
| 6635159 | Device for removing deposit created in electrolytic refining or electrowinning The invention relates to a device for at least partly removing a deposit created in the electrolytic refining or electrowinning of metal from the surface of the mother plate used as an electrode in the refining or electrowinning process, said device compr... | 10/21/2003 |
| 6623609 | Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same A lift and rotate assembly for use in a workpiece processing station. The lift and rotate assembly includes a body having a slim profile and pins located on opposite sides for mounting the assembly onto a tool frame. The lift and rotate assembly is remova... | 09/23/2003 |
| 6610182 | Cup-type plating apparatus and method for plating wafers The present cup-type plating apparatus improves a conventional cup-type plating apparatus and prevents the surface of a wafer due to a mist of the plating solutions from being contaminated. A plating solution is supplied to a wafer which is placed on a wa... | 08/26/2003 |
| 6582570 | Electroplating apparatus for wheel disk An electroplating apparatus for wheel disk comprises an electrolytic cell containing electrolytic bath, a cathode plate, an auxiliary anode, at least one anode plate and a driving mechanism. Part of the auxiliary anode is provided with an insulating shiel... | 06/24/2003 |
| 6565722 | Installation and method for multilayered immersion coating A method for multilayered coating, whereby hurdles for the item that is to be treated are guided for galvanic dip coating (2) through in a separate circuit. Downstream from the tank, the hurdles are changed over (12) and the item that is to be treated is ... | 05/20/2003 |
| 6565983 | Electrical contact element and use of the contact element An electrical contact element for electrically connecting an electric device and providing current transmission in an electric device wherein the electrical contact element comprises a metallic body, and wherein at least one contact surface, present on th... | 05/20/2003 |
| 6527926 | Electroplating reactor including back-side electrical contact apparatus An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the... | 03/04/2003 |
| 6521103 | Plating clamp assembly A plating clamp assembly for use with a plating system including a plating bath and an article transport assembly to selectively engage an article to be plated as the article is moved through the plating bath by the article transport assembly to coat at l... | 02/18/2003 |
| 6478934 | Motorized frame for adjusting the interelectrodic gap in mercury cells The invention concerns a motorized device for adjusting the interelectrodic gap in mercury cathode electrolysis cells, mainly consisting of a frame, to which a number of anodes are suspended, movable in the vertical direction by means of a single jackscre... | 11/12/2002 |
| 6461494 | Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot Methods used in semiconductor electroplating systems, such as for plating copper, onto a semiconductor wafer or other semiconductor workpiece. The methods apply to patterned metal layers plated onto seed layer which is partially protected by an overlying ... | 10/08/2002 |
| 6355148 | Diaphragm workholding device for ECM A workholder for an ECM process comprises a set of jaws which define an interior workpiece holding region are mounted on the surface of a diaphragm which is movable under air pressure from a flat to a more generally spheroid shape with the injection of pr... | 03/12/2002 |
| 6322677 | Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same A lift and rotate assembly for use in a workpiece processing station. The lift and rotate assembly includes a body having a slim profile and pins located on opposite sides for mounting the assembly onto a tool frame. The lift and rotating assembly further... | 11/27/2001 |
| 6322678 | Electroplating reactor including back-side electrical contact apparatus An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the... | 11/27/2001 |
| 6274013 | Electrode semiconductor workpiece holder A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger assembly is operatively mounted upon the workpiece support and in... | 08/14/2001 |
| 6267853 | Electro-chemical deposition system The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other... | 07/31/2001 |
| 6168695 | Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same A lift and rotate assembly for use in a workpiece processing station. The lift and rotate assembly includes a body having a slim profile and pins located on opposite sides for mounting the assembly onto a tool frame. The lift and rotating assembly further... | 01/02/2001 |
| 6071385 | Racking fixture for electrochemical processing The present invention relates to a racking fixture for holding components while they are electro-chemically processed. The fixture includes at least one shelf for holding the components and is electrically connected to a bus bar. A motor is mechanically e... | 06/06/2000 |
