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3M employee and church chorister Art Fry needed something to temporarily mark pages in his hymnal. He was in luck because his colleague, Spencer Silver, accidentally developed a glue that was too weak for other purposes. After initially discouraging consumer response, Post-it Notes became a hit in 1979.
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| Number | Title | Issue Date |
| 7828944 | Electroplating apparatus An electroplating apparatus includes: a wafer holder that is detachable from an engaging hole of a cathode holder and capable of moving in a up and down direction; a spring contact type cathode electrode that is fixed to an electrode housing recess on a top surface ... | 11/09/2010 |
| RE40218 | Electro-chemical deposition system and method of electroplating on substrates The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto metal seede... | 04/08/2008 |
| 7323778 | Semiconductor device with improved design freedom of external terminal A semiconductor device comprises: a semiconductor chip; an extension portion formed in contact with the side surfaces so as to surround the semiconductor chip; an insulating film formed on a surface of the extension portion and the semiconductor chip; each of a plur... | 01/29/2008 |
| 7270735 | System and method for holding and releasing a workpiece for electrochemical machining A system and method are described for holding and releasing a workpiece for electrochemical machining. In one embodiment, a workpiece holder has a workpiece surface that couples to the workpiece when negative pressure is applied to provide a seal between the workpie... | 09/18/2007 |
| 7211145 | Substrate processing apparatus and substrate processing method A substrate processing apparatus include a spin chuck capable of holding a semiconductor wafer in a horizontal position, a drive motor for driving the spin chuck for rotation, and a processing vessel accommodating the spin chuck and the drive motor 50 therein... | 05/01/2007 |
| 7063604 | Independent edge control for CMP carriers A wafer carrier for controlling the edge effect during chemical mechanical planarization. A first bladder is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. A second bladder is dispo... | 06/20/2006 |
| 6994776 | Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an e... | 02/07/2006 |
| 6802947 | Apparatus and method for electro chemical plating using backside electrical contacts An apparatus and method for securing and electrically contacting a substrate on a non-production surface of the substrate. The apparatus includes a substrate holder assembly having a substrate engaging surface formed thereon, the substrate engaging surface being con... | 10/12/2004 |
| 6635157 | Electro-chemical deposition system The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other... | 10/21/2003 |
| 6514393 | Adjustable flange for plating and electropolishing thickness profile control An electrochemical reactor is used to electrofill damascene architecture for integrated circuits or for electropolishing magnetic disks. An inflatable bladder is used to screen the applied field during electroplating operations to compensate for potential... | 02/04/2003 |
| 6478937 | Substrate holder system with substrate extension apparatus and associated method An apparatus and associated method that removes electrolyte solution from a substrate, the apparatus comprises a thrust plate and a substrate extension unit. The thrust plate at least partially defines a spin recess. The substrate extension unit can be di... | 11/12/2002 |
| 6416647 | Electro-chemical deposition cell for face-up processing of single semiconductor substrates The invention provides an electro-chemical deposition cell for face-up processing of semiconductor substrates comprising a substrate support member, a cathode connected to the substrate plating surface, an anode disposed above the substrate support member... | 07/09/2002 |
| 6267853 | Electro-chemical deposition system The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other... | 07/31/2001 |
| 6261433 | Electro-chemical deposition system and method of electroplating on substrates The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto ... | 07/17/2001 |
| 5951833 | Anodizing apparatus A holder (102) made from an HF-resistant material includes annular suction pads (105, 108). The suction pad (105) is used to hold a small silicon substrate by suction, and the suction pad (108) is used to hold a large silicon substrate by suction. This ma... | 09/14/1999 |
| 5660699 | Electroplating apparatus An electroplating apparatus has a cathode base for supporting a substrate, and a clamper for clamping a peripheral edge portion of the substrate against the cathode base. A plating solution is supplied onto the substrate so that the surface of the substra... | 08/26/1997 |
| 5447615 | Plating device for wafer Disclosed is a plating device for plating a wafer, in which the resist film formed on a wafer need not preliminarily be removed, and plurality of needle-like electrodes can stably and reliably be contacted with the wafer to secure electrical continuity th... | 09/05/1995 |
| 5429733 | Plating device for wafer A plating device for a wafer employs an air bag 6, 20 as a holding means for downwardly depressing the wafer 8 upon performing plating on the wafer 8. The air bag 6, 20 constrain only the upper surface 13 of the circumferential edge of the wafer at an exp... | 07/04/1995 |
| 5342495 | Structure for holding integrated circuit dies to be electroplated A method of forming conductive bumps on the bond pads of one or more ICs is described wherein a barrier metal layer such as TiW is first formed over the bond pads in order to passivate the surface of the one or more ICs, an electroplatable base comprising... | 08/30/1994 |
| 5228966 | Gilding apparatus for semiconductor substrate According to this invention, a cathode electrode is brought into reliable contact with a semiconductor substrate. A cup-like tank is arranged independently of an outer tank, and adjusting mechanisms are arranged on the cup-like tank for supporting the sem... | 07/20/1993 |
| 4745253 | Device and process designed to automatically hold up and fix in position the parts cut out of a workpiece during electroerosion machining to rough dimensions and application involving the automatic removal of the cutout parts An EDM device includes two support bars bearing on the same reference surfaces as the workpiece. Gibs are provided which engage into driving units able to displace them axially while holding them at a small distance under one support bar. The other suppor... | 05/17/1988 |
| 4605483 | Electrode for electro-plating non-continuously conductive surfaces Apparatus for use as an electrode, which is particularly suited for use in electro-plating non-continuous conductive objects, particularly double-sided circuit boards, is described. Specifically, this electrode comprises: a housing having a plurality of s... | 08/12/1986 |
| 4428815 | Vacuum-type article holder and methods of supportively retaining articles A vacuum-type holder (10) for retaining fragile articles such as semiconductor wafers (16) during a manufacturing operation, such as an electrolytic treatment includes a vacuum-operated support (36) at each of the seats (23) which exerts a supporting forc... | 01/31/1984 |
| 4192729 | Apparatus for forming an aluminum interconnect structure on an integrated circuit chip An apparatus for forming an interconnect structure on an integrated circuit chip by employing a single chamber for both the required etching and anodization. It has been discovered that an etchant-electrolyte such as phosphoric acid solution in the ratios... | 03/11/1980 |
| 4043894 | Electrochemical anodization fixture for semiconductor wafers A fixture for holding a semiconductor wafer during anodization. The fixture has a major surface with a plurality of concentric ridges on the surface for supporting a semiconductor wafer, with adjacent ridges defining concentric channels therebetween. The ... | 08/23/1977 |
| 3994784 | Metal replication of Glass dies by electroforming In a process for metal replication of Glass dies, the cleaned die is secured in a cavity of a fixture, and a thin masking diaphragm is placed over the die and fixture to expose only the die surface to be replicated. A vacuum is applied through passages in... | 11/30/1976 |
