Did You Know...
...that it was melting ice cream that inspired the invention of the outboard motor? It was a lovely August day and Ole Evinrude was rowing his boat to his favorite island picnic spot. As he rowed, he watched his ice cream melt and wished he had a faster way to get to the island. At that moment the idea for the outboard motor was born!
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| Number | Title | Issue Date |
| 8142627 | System for monitoring, control, and management of a plant where hydrometallurgical electrowinning and electrorefining processes for non ferrous metals A system to monitor, control and management of a plant where hydrometallurgical processes of electrowinning or electrorefining of non ferrous metals which enables measuring the process variables which comprises: at least one group of electrolytic cells, said cells h... | 03/27/2012 |
| 8123917 | Contact bar for capping board Disclosed is a contact bar for use on a capping board of a given length in order to electrically connect a plurality of anodes and cathodes extending in spaced apart, alternate positions in adjacent electrolytic cells all along the capping board. The contact bar ext... | 02/28/2012 |
| 7901550 | Plating apparatus A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus includes a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so... | 03/08/2011 |
| 7857954 | Compact pot tending module for use in plants for the production of aluminum by electrolysis This invention relates to pot tending module intended for aluminium production plants by fused bath electrolysis. According to the invention, the turret (9) of the pot tending module (7) is equipped with a determined set of tools, in which the tool ( | 12/28/2010 |
| 7854825 | Symmetical double contact electro-winning A symmetrical double-double contact mechanism for an electro-deposition mechanism. Using a base insulator, a cap block insulator is formed to support four series of electrodes of two different types (anode and cathode). Because of the contact mechanism employed, red... | 12/21/2010 |
| 7780824 | Electroplating jig An electroplating jig which includes: a first insulator plate having an aperture; a second insulator plate sandwiching a body to be plated between the first insulator plate and the second insulator plate so that the body to be plated is faced outside from the apertu... | 08/24/2010 |
| 7641776 | System and method for increasing yield from semiconductor wafer electroplating A system and method increase yield from semiconductor wafer electroplating. The aspects include a semiconductor wafer, the semiconductor wafer comprising a plurality of die areas. A plating ring for holding the semiconductor wafer in position during electroplating i... | 01/05/2010 |
| 7608174 | Apparatus and method for electroforming high aspect ratio micro-parts A fixture is disclosed to more easily affix a workpiece in the proper orientation and spacing with sealed electrical interconnection within an electrochemical plating bath. The workpiece can be any planar metallic or non-metallic substrate such as a silicon wafer co... | 10/27/2009 |
| 7445697 | Method and apparatus for fluid processing a workpiece A method and apparatus for retaining a workpiece against a workpiece holder are described. A flexible member can be used to provide a substantially uniform force to securely retain the workpiece, which can allow the workpiece to be consistently positioned in a proce... | 11/04/2008 |
| 7425257 | Method for the formation of a good contact surface on a cathode support bar and support bar The disclosure relates to a method of obtaining a good current contact on the support bar of a cathode used in electrolysis. In this method a highly electroconductive layer is formed on the contact piece on the end of the support bar of the cathode, especially at th... | 09/16/2008 |
| 7416648 | Image sensor system for monitoring condition of electrode for electrochemical process tools A system for use in manufacturing semiconductor devices, is provided. The system includes an electrochemical processing tool and an image sensor. The electrochemical processing tool includes an electrode located at a central region of a platen. The electrode is adap... | 08/26/2008 |
| 7402227 | Plating apparatus and method An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps (protruding electrodes) on the surface of a semiconductor wafer. The app... | 07/22/2008 |
| 7384522 | Ergonomic loading apparatus for electroplating processes A loading apparatus for use in electroplating processes includes a container designed to sealingly receive a plurality of airfoil blades fitted with gaskets. Each fitted airfoil blade is disposed in contact with a plurality of electrical contact assemblies having a ... | 06/10/2008 |
| RE40218 | Electro-chemical deposition system and method of electroplating on substrates The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto metal seede... | 04/08/2008 |
| 7328812 | Overhead travelling carriage A centering member 20 is pressed downward using an elastic member 28; the centering member 20 is provided at the bottom of a platform 14. A plate 26 receiving an upper end of the elastic member 28 is positioned high while th... | 02/12/2008 |
| RE40035 | Modular ceramic oxygen generator A ceramic oxygen generator is described which is capable of modular construction to permit the oxygen generation capacity to be expanded. An ionically conducted ceramic electrolyte is formed into a series of rows and columns of tubes on a tube support member and lik... | 01/29/2008 |
| 7294243 | Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly (400) can comprise a support member (410) that includes an inner wall (412) which defines an opening (414) configured to receive the wor... | 11/13/2007 |
| 7288172 | Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing A method and apparatus for transmitting electrical signals and fluids to and/or from a microelectronic workpiece. An apparatus in accordance with one embodiment of the invention includes a shaft rotatable about a shaft axis and having a first end with a first electr... | 10/30/2007 |
| 7285195 | Electric field reducing thrust plate A method and apparatus for an electrochemical processing cell that is configured to minimize bevel and backside deposition. The apparatus includes a contact ring assembly for supporting a substrate, a thrust plate movably positioned to engage a substrate positioned ... | 10/23/2007 |
| 7282124 | Device providing electrical contact to the surface of a semiconductor workpiece during processing Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second ... | 10/16/2007 |
| 7264699 | Workpiece holder for processing apparatus, and processing apparatus using the same An inexpensive workpiece holder having high reliability and a processing apparatus equipped with the workpiece holder are provided, in which damage caused by oxygen in the air is prevented. The holder comprises: a ceramic body which has an electrode and a heater cir... | 09/04/2007 |
| 7252750 | Dual contact ring and method for metal ECP process A dual contact ring for contacting a patterned surface of a wafer and electrochemical plating of a metal on the patterned central region of the wafer and removing the metal from the outer, edge region of the wafer. The dual contact ring has an outer voltage ring in ... | 08/07/2007 |
| 7247563 | Filling high aspect ratio openings by enhanced electrochemical deposition (ECD) One embodiment of the invention is a method for void-free filling with a metal or an alloy inside openings by electrochemical deposition (ECD), said method including steps of: (a) providing a substrate with at least one opening and a field surrounding the at least o... | 07/24/2007 |
| 7247222 | Electrochemical processing cell Embodiments of the invention may generally provide a small volume electrochemical plating cell. The plating cell generally includes a fluid basin configured to contain a plating solution therein, the fluid basin having a substantially horizontal weir. The cell furth... | 07/24/2007 |
| 7223324 | Capping board with separating walls Disclosed in a capping board for use to support hanging legs of anodes and cathodes within adjacent electrolytic cells. This capping board has a main body having a bottom surface shaped to fit onto upper edges of the adjacent cells, and a top surface. A first set of... | 05/29/2007 |
| 7214297 | Substrate support element for an electrochemical plating cell A contact ring for an electrochemical plating system is provided. The contact ring includes an annular substrate supporting member, a plurality of radially positioned conductive substrate contact pins extending from the substrate supporting member, an annular conduc... | 05/08/2007 |
| 7211174 | Method and system to provide electrical contacts for electrotreating processes Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented. ... | 05/01/2007 |
| 7211178 | Fixture for electro-chemical machining On a fixture for electro-chemical machining for the production of long, curved cavities (11) in a component (12), the working electrode (3) of the electro-chemical machining tool (1) is connected to a guide body (1a) which m... | 05/01/2007 |
| 7208070 | Stent manufacture The present invention provides improvements in methods for the manufacture of stents. Specifically, the invention provides methods wherein stents are placed on jigs of various designs which facilitate manufacture, stents carried by the jigs are immersed in liquid ba... | 04/24/2007 |
| 7208074 | Substrate processing apparatus and substrate plating apparatus A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a s... | 04/24/2007 |
| 7204919 | Capping board with at least one sheet of electrically conductive material embedded therein Disclosed is a capping board for use to support anodes and cathodes within adjacent electrolytic cells, which has a plurality of individual seats positioned in spaced apart relationship all along its length to receive and support hanging legs projecting from these a... | 04/17/2007 |
| 7204920 | Contact ring design for reducing bubble and electrolyte effects during electrochemical plating in manufacturing A contact ring for use in electroplating of a substrate material is constructed such that fluid (e.g., electrolyte) is allowed to flow radially away from the axis of a toroidal support ring, thus preventing the trapping of fluids between the substrate and the toroid... | 04/17/2007 |
| 7189313 | Substrate support with fluid retention band An apparatus and method for supporting a substrate is provided. In one embodiment, an apparatus for supporting a substrate includes a body having a band extending therefrom. The band is adapted to retain a fluid on the body thereby forming a shallow processing bath ... | 03/13/2007 |
| 7169269 | Plating apparatus, plating cup and cathode ring A plating apparatus (10) provided with: a plating vessel (61a to 61d) having a cylindrical side wall (361) for containing a plating liquid; a substrate holding mechanism (74a to 74d) for generally... | 01/30/2007 |
| 7169280 | Apparatus and method for deposition of an electrophoretic emulsion The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current phot... | 01/30/2007 |
| 7166204 | Plating apparatus and method A plating apparatus and method which smoothly perform contact of a plating liquid with a surface of the substrate and which can prevent air bubbles from remaining on the surface to be plated. The plating apparatus includes a plating bath containing a plating liquid ... | 01/23/2007 |
| 7153400 | Apparatus and method for depositing and planarizing thin films of semiconductor wafers An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided ... | 12/26/2006 |
| 7150816 | Apparatus and method for deposition of an electrophoretic emulsion The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current phot... | 12/19/2006 |
| 7147765 | Apparatus and method for deposition of an electrophoretic emulsion The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current phot... | 12/12/2006 |
| 7138039 | Liquid isolation of contact rings Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending fro... | 11/21/2006 |
