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Mountable Printable Placard With Headband
A resilient headband in a shape for being mounted on the head of the user. The headband is equipped with a longitudinal slotted member for holding a placard.
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| Number | Title | Issue Date |
| 7837841 | Apparatuses for electrochemical deposition, conductive layer, and fabrication methods thereof Electrochemical plating (ECP) apparatuses with auxiliary cathodes to create uniform electric flux density. An ECP apparatus for electrochemical deposition includes an electrochemical cell with an electrolyte bath for electrochemically depositing a metal on a substra... | 11/23/2010 |
| 7442283 | Hydrogen peroxide generator A device and process is presented for producing hydrogen peroxide on an as needed basis is disclosed. The process and device produces hydrogen peroxide on a small scale without the addition of chemicals and disposal of waste streams. ... | 10/28/2008 |
| 7396441 | Flow-through oxygenator An oxygen emitter which is an electrolytic cell is disclosed. When the anode and cathode are separated by a critical distance, very small microbubbles and nanobubbles of oxygen are generated. The very small oxygen bubbles remain in suspension, forming a solution sup... | 07/08/2008 |
| 7393440 | Hydrogen generation system The present invention provides a system for generating hydrogen gas in an aqueous solution based electrolytic or galvanic cell wherein the cathode is made from aluminum or an aluminum alloy. In a preferred arrangement the cell is a galvanic cell and cathode is made ... | 07/01/2008 |
| 7381313 | Integrated hydrogen production and processing system and method of operation A method of operating an integrated hydrogen production and processing system is provided. The method includes operating an electrolyzer to produce hydrogen from water and utilizing heat generated from the electrolyzer to increase a temperature of an electrolyte in ... | 06/03/2008 |
| 7368049 | Method and apparatus for electrowinning copper using the ferrous/ferric anode reaction and a flow-through anode The present invention relates, generally, to a method and apparatus for electrowinning metals, and more particularly to a method and apparatus for copper electrowinning using the ferrous/ferric anode reaction and a flow-through anode, such as, for example, a dimensi... | 05/06/2008 |
| 7357850 | Electroplating apparatus with segmented anode array An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are ... | 04/15/2008 |
| 7351315 | Chambers, systems, and methods for electrochemically processing microfeature workpieces Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first proces... | 04/01/2008 |
| 7351314 | Chambers, systems, and methods for electrochemically processing microfeature workpieces Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first proces... | 04/01/2008 |
| 7341633 | Apparatus for electroless deposition Embodiments of the invention generally provide a fluid processing platform. The platform includes a mainframe having a substrate transfer robot, at least one substrate cleaning cell on the mainframe, and at least one processing enclosure. The processing enclosure in... | 03/11/2008 |
| 7329321 | Enhanced wafer cleaning method A method for removing post-processing residues in a single wafer cleaning system is provided. The method initiates with providing a first heated fluid to a proximity head disposed over a substrate. Then, a meniscus of the first fluid is generated between a surface o... | 02/12/2008 |
| 7326329 | Commercial production of hydrogen from water Large quantities of low cost hydrogen free of carbon oxides are required as fuel for the hydrogen economy. Commercial quantities of hydrogen can be produced from the electrolysis of water using a diaphragm-less electrolytic cell. The electrolytic cell has an anode c... | 02/05/2008 |
| 7323058 | Apparatus for electroless deposition of metals onto semiconductor substrates An electroless deposition system is provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station inclu... | 01/29/2008 |
| 7303660 | Electrochemical treatment of an aqueous solution A method and apparatus are provided for the electrochemical treatment of an aqueous solution in an electrolytic cell. Output solution having a predetermined level of available free chlorine is produced by applying a substantially constant current across the cell bet... | 12/04/2007 |
| 7284760 | Holding device for disk-shaped objects Semiconductor technology requires the use of object holders, which are capable of holding wafers securely, also during rotation. In order to save time and expense, such holders should be suitable for integration directly into a processing facility, wherever possible... | 10/23/2007 |
| 7286059 | Talking tool holder A talking tool holder provides an audio message in response to a user selection that indicates the size of the tool the user has selected. The talking tool holder includes a housing with multiple uniquely-sized tool-receiving locations, with a corresponding sensor f... | 10/23/2007 |
| 7250110 | Electro-kinetic water conditioning A method for treating hard water comprising the steps of flowing water containing suspended colloidal mineral particles through a confined treatment zone, applying an electrical potential across the flowing water to cause electrical current to flow through the water... | 07/31/2007 |
| 7208069 | Device for etching semiconductors with a large surface area The device etches semiconductors with a large surface area in a trough-shaped receptacle containing a liquid electrolyte. A sample head is mounted inside the etching trough, and is provided with a device for holding at least one semiconductor wafer. The device is ti... | 04/24/2007 |
| 7208074 | Substrate processing apparatus and substrate plating apparatus A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a s... | 04/24/2007 |
| 7205153 | Analytical reagent for acid copper sulfate solutions Embodiments of the invention provide an analytical method and analytical reagent solutions for determining the concentration of electrolyte components, such as copper, acid and chloride constituents in an acid or basic metal plating bath using a chemical analyzer. C... | 04/17/2007 |
| 7192494 | Method and apparatus for annealing copper films A method and apparatus for annealing copper. The method comprises forming a copper layer by electroplating on a substrate in an integrated processing system and annealing the copper layer in a chamber inside the integrated processing system. ... | 03/20/2007 |
| 7189146 | Method for reduction of defects in wet processed layers The present invention provides a method and apparatus for wet processing of a conductive layer using a degassed process solution such as a degassed electrochemical deposition solution, a degassed electrochemical polishing solution, a degassed electroless deposition ... | 03/13/2007 |
| 7169269 | Plating apparatus, plating cup and cathode ring A plating apparatus (10) provided with: a plating vessel (61a to 61d) having a cylindrical side wall (361) for containing a plating liquid; a substrate holding mechanism (74a to 74d) for generally... | 01/30/2007 |
| 7169280 | Apparatus and method for deposition of an electrophoretic emulsion The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current phot... | 01/30/2007 |
| 7157051 | Sampling management for a process analysis tool to minimize sample usage and decrease sampling time A method and system for analysis of additives in electrolysis plating solutions, using a flow management system that minimizes loss of plating solutions and decreases sampling time. The system includes at least one analysis chamber, a sampling duct connected to proc... | 01/02/2007 |
| 7150816 | Apparatus and method for deposition of an electrophoretic emulsion The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current phot... | 12/19/2006 |
| 7147827 | Chemical mixing, replenishment, and waste management system A chemical control system for controlling the chemistry of a chemical solution having predetermined chemical constituents in a plating system, such as a NiFe plating system, employs a mix container for containing a plating solution and a hold container for containin... | 12/12/2006 |
| 7138039 | Liquid isolation of contact rings Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending fro... | 11/21/2006 |
| 7090750 | Plating An apparatus and method for treating a substrate to deposit, clean or etch material on a substrate using a first horizontal chuck to which a plurality of substrates is attached and electrically charged. Spaced closely to the first horizontal chuck is a coextensive h... | 08/15/2006 |
| 7087144 | Contact ring with embedded flexible contacts A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an an... | 08/08/2006 |
| 7044476 | Compact pinlifter assembly integrated in wafer chuck A compact pinlifter assembly is fitted in a substantially enclosed cavity within a wafer chuck such that an overall outside shape of the wafer chuck remains highly unaffected. The pinlifter assembly includes wedge guides providing a movement path in a wedge angle re... | 05/16/2006 |
| 7033463 | Substrate plating method and apparatus A method and apparatus plate a substrate to form wiring by efficiently filling a fine recess formed in a semiconductor substrate with plating metal without a void or contamination. The plating of the substrate to fill a wiring recess formed in the semiconductor subs... | 04/25/2006 |
| 7025861 | Contact plating apparatus Embodiments of the invention generally provide a substrate processing system and method. The substrate processing system generally includes a fluid basin configured to contain a plating solution therein, an anode assembly positioned in a lower portion of the fluid b... | 04/11/2006 |
| 7018093 | Apparatus and method for sensing defects in temperature sensors In a temperature controlling apparatus for controlling temperature by using a temperature sensor, a defect state of the temperature sensor is sensed by sensing a change of specific resistance of the temperature sensor. A temperature value of the temperature sensor i... | 03/28/2006 |
| 7008523 | Electrolytic cell for surface and point of use disinfection The present invention is an apparatus and method for disinfecting or sanitizing a desired object. The apparatus includes a container for an aqueous solution; the container may be a spray bottle. The apparatus includes an electrolytic cell, containing an electrolyte,... | 03/07/2006 |
| 6979034 | Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector A two sided wafer handling end-effector provides for the efficient loading and unloading of wafers into and out of a wafer processing apparatus. Each side of the end-effector includes spaced apart rotatable catch mechanisms between which a wafer is firmly grasped. W... | 12/27/2005 |
| 6958113 | Plating apparatus and plating method A plating apparatus for plating a substrate. The apparatus is provided with a plating unit, a substrate cleaning unit, a substrate transport mechanism, a post-treatment agent supplying section, a minor constituent managing section for managing minor constituents (an... | 10/25/2005 |
| 6955840 | Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same The LCD according to present invention includes a first substrate and a second substrate, two protective layers including at least one layer formed on outer surface of the first and second substrates, a transparent electrode formed on inner surface of the first subs... | 10/18/2005 |
| 6921472 | Process for the solution of metals into an electrolytic deposition solution and solution plant operating such process A process for dissolving metals, in particular tin, and a plant for dissolving metals operating according to said process allow to minimize the quantity of metal in the sludge and the oxygen consumption, and entail a first step in which in a first reactor an effecti... | 07/26/2005 |
| 6916413 | Electro-plating apparatus and method Electroplating station S has a head 1 with anode 2, to one side of which there is located an electrically neutral wall 3. The width of anode 2 is provided to accommodate the width of web 6. Serrations 9 are provided on the a... | 07/12/2005 |
