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| Number | Title | Issue Date |
| 8182656 | Electrolyzing device An electrolyzing device is capable of removing scales adhered to a cathode in an electrolyzing mode without deteriorating an electrode forming an anode. An electrolyzing device includes a first main electrode 3, a second main electrode 4, an aux... | 05/22/2012 |
| 8177944 | Plating apparatus and plating method A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank... | 05/15/2012 |
| 7981259 | Electrolytic capacitor for electric field modulation A method and apparatus for adjusting an electric field of an electrochemical processing cell are provided. In one embodiment, a capacitive element is disposed in the processing solution. The strength, shape, or direction of the electric field in the processing solut... | 07/19/2011 |
| 7846306 | Apparatus and method for improving uniformity in electroplating A method and apparatus for plating a metal onto a substrate. One embodiment of the present invention provides an apparatus for electroplating a substrate. The apparatus comprises a fluid basin, an anode disposed near a bottom of the fluid basin, a restrictor dispose... | 12/07/2010 |
| 7727364 | Auxiliary electrode encased in cation exchange membrane tube for electroplating cell A method and apparatus for plating a metal onto a substrate. One embodiment of the invention provides an apparatus for electrochemically plating a substrate. The apparatus comprises a fluid basin configured to retain a plating solution therein, an anode assembly dis... | 06/01/2010 |
| 7615138 | Electrolysis apparatus with pulsed, dual voltage, multi-composition electrode assembly An electrolysis system (100) is provided. In addition to an electrolysis tank (101) and a membrane (105) separating the tank into two regions, the system includes at least one pair of low voltage electrodes (115/117) of a first type compr... | 11/10/2009 |
| 7566386 | System for electrochemically processing a workpiece A reactor for electrochemically processing at least one surface of a microelectronic workpiece is set forth. The reactor comprises a reactor head including a workpiece support that has one or more electrical contacts positioned to make electrical contact with the mi... | 07/28/2009 |
| 7438788 | Apparatus and methods for electrochemical processing of microelectronic workpieces An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having ... | 10/21/2008 |
| 7410561 | Three-electrode metal oxide reduction cell A method of electrochemically reducing a metal oxide to the metal in an electrochemical cell is disclosed along with the cell. Each of the anode and cathode operate at their respective maximum reaction rates. An electrolyte and an anode at which oxygen can be evolve... | 08/12/2008 |
| 7359113 | Semiconductor optical amplifier having a non-uniform injection current density A semiconductor optical amplifier (SOA) with efficient current injection is described. Injection current density is controlled to be higher in some areas and lower in others to provide, e.g., improved saturation power and/or noise figure. Controlled injection curren... | 04/15/2008 |
| RE40218 | Electro-chemical deposition system and method of electroplating on substrates The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto metal seede... | 04/08/2008 |
| 7332062 | Electroplating tool for semiconductor manufacture having electric field control An electroplating tool for providing a metal or metal film on a semiconductor wafer during processing thereof has a wafer chucking mechanism with a conductor or conductors associated therewith. The conductor(s) are electrically connected to a controller that applies... | 02/19/2008 |
| 7323094 | Process for depositing a layer of material on a substrate An electroplating system (30) and process makes electrical current density across a semiconductor device substrate (20) surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. The electrical curr... | 01/29/2008 |
| 7150816 | Apparatus and method for deposition of an electrophoretic emulsion The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current phot... | 12/19/2006 |
| 7147765 | Apparatus and method for deposition of an electrophoretic emulsion The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current phot... | 12/12/2006 |
| 7147760 | Electroplating apparatus with segmented anode array An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are ... | 12/12/2006 |
| 7005268 | Detection of biopolymers utilizing photo-initiated charge separation A method for detecting the presence of target molecules bound to a working electrode in a first location. The first location is coated with a detection solution containing labeling molecules that include a first charge-separation moiety attached to a first molecule ... | 02/28/2006 |
| 6994776 | Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an e... | 02/07/2006 |
| 6969619 | Full spectrum endpoint detection A method of endpoint detection during plasma processing of a semiconductor wafer comprises processing a semiconductor wafer using a plasma, detecting radiation emission from the plasma during the semiconductor processing, and tracking data points representing change... | 11/29/2005 |
| 6921468 | Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations A system for electroplating a semiconductor wafer is set forth. The system comprises a first electrode in electrical contact with the semiconductor wafer and a second electrode. The first electrode and the semiconductor wafer form a cathode during electroplating of ... | 07/26/2005 |
| 6887368 | Method and device for electroextraction of heavy metals from technological solutions and wastewater The basic principles of the method for heavy metals electroextraction from technological solutions and wastewater includes pretreating to remove Chromium-6 and high concentrations of heavy metals and periodically treating in a six-electrode bipolar cylindrical elect... | 05/03/2005 |
| 6827827 | Metal plating apparatus and process In order to make plating thickness uniform in a metal plating apparatus, a metal plating apparatus capable of performing metal plating to a uniform thickness is provided by aligning lines of electric force uniformly and in parallel by disposing a pair of conductive ... | 12/07/2004 |
| 6663758 | Method and apparatus for producing electrolytic copper foil An electrolytic copper foil is electrodeposited onto the cathodic drum surface of a rotating cathode drum by feeding an electrolytic solution between the cathode drum and an anode facing each other and applying direct current between them, while the initi... | 12/16/2003 |
| 6562204 | Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are provided to mitigate corrosion of a metal seed layer on recessed ... | 05/13/2003 |
| 6554976 | Electroplating apparatus A method of electroplating an object to be plated attached to a lower portion of a plating bath constituted by draining used plating solution and supplying new plating solution at every plating procedure. The method has a step of supplying additional curr... | 04/29/2003 |
| 6425991 | Plating system with secondary ring anode for a semiconductor wafer An electroplating system is provided for seed layer covered semiconductor wafers. A plating chamber is provided with an inert primary anode connectible to a positive voltage source and a semiconductor wafer connector connectible to a negative voltage sour... | 07/30/2002 |
| 6413389 | Method for recovering metal from etch by-products A method and assembly for recovering a metal from by-products produced from etching a metal (e.g., platinum, iridium, aluminum, etc.) in a plasma processing chamber. The method includes recovering from the plasma processing chamber a deposit of the by-pro... | 07/02/2002 |
| 6274023 | Apparatus and method for electroplating wafers, substrates and other articles A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformnity of the plating deposition across the surface of the wafer, and minimizing damage to t... | 08/14/2001 |
| 6261433 | Electro-chemical deposition system and method of electroplating on substrates The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto ... | 07/17/2001 |
| 6207037 | Recovery of metal from solution Recovery of silver from a photographic fixer solution in an electrolytic cell is controlled so as to maintain a high current efficiency whilst minimizing unwanted side effects. The difference between plating voltages when operating at two different curren... | 03/27/2001 |
| 6168693 | Apparatus for controlling the uniformity of an electroplated workpiece An electroplating system for plating at least one metal on at least one substrate. At least one plating tank contains a plating solution including the at least one metal to be plated on the at least one substrate. At least one anode is arranged in the at ... | 01/02/2001 |
| 6126794 | Apparatus for producing orthohydrogen and/or parahydrogen An apparatus for producing orthohydrogen and/or parahydrogen. The apparatus includes a container holding water and at least one pair of closely-spaced electrodes arranged within the container and submerged in the water. A first power supply provides a par... | 10/03/2000 |
| 6071385 | Racking fixture for electrochemical processing The present invention relates to a racking fixture for holding components while they are electro-chemically processed. The fixture includes at least one shelf for holding the components and is electrically connected to a bus bar. A motor is mechanically e... | 06/06/2000 |
| 6071399 | Electrolytic cell An electrolytic cell comprises a housing (12), means (21) defining a liquid level (25) in said housing (12), a first contact surface (32) positioned above said liquid level (25) for making contact with a removable electrode (20) when positioned in said ho... | 06/06/2000 |
| 5935392 | Electrodes for electrolytic removal of nitrates from water, methods of making same, and apparatus incorporating said electrodes A carbon fiber electrode is coated with a noble metal oxide to create a noble metal oxide electrode with a very large surface area. According to a presently preferred embodiment, the noble metal oxide is iridium oxide. A method of making the electrode inc... | 08/10/1999 |
| 5885434 | Method and apparatus for performing fine working A method for performing fine working of a material by electrochemical reaction comprises a two-step scanning operation in which a surface topography of the material is obtained during a first scan which is used to control the position of a probe during a ... | 03/23/1999 |
| 5833819 | Copper foil for a printed circuit board, a process and an apparatus for producing the same This invention provides a process for producing an electrolytic copper foil for a printed wiring board by supplying current between a rotary cathode and an electrolytic anode in a copper electrolyte so as to electrodeposit copper on the surface of the rot... | 11/10/1998 |
| 5723028 | Electrodeposition apparatus with virtual anode An electrochemical etching step in a semiconductor device fabrication process increases the radius of curvature of edges of metal lines deposited on the semiconductor device. The metal lines are fabricated by forming a mask, electrodepositing the metal, a... | 03/03/1998 |
| 5516412 | Vertical paddle plating cell An electroplating cell includes a floor, ceiling, front wall, and back wall forming a box having first and second opposite open ends. A rack for supporting an article to be electroplated is removably positioned vertically to close the first open end and i... | 05/14/1996 |
| 5441620 | Electroplating apparatus An electroplating apparatus carries out an electroplating on a work by using an insoluble anode for keeping the electrolyte clean, and, thereafter, makes up ionized metal into the electrolyte by respectively connecting a soluble anode and the insoluble an... | 08/15/1995 |
