Class 204/228.7 - Workpiece property sensing means (e.g., mass, coating thickness, etc.)

Subclass of Class 204 - Chemistry: electrical and wave energy
Definition: Apparatus having means for sensing a workpiece property
No. of patents: 34
Last issue date: 12/21/2010

Number	Title	Issue Date
7854824	Method of manufacturing semiconductor device using electrochemical deposition with electric current revised by reflectance of every substrate surface and semiconductor manufacturing apparatus A method of manufacturing a semiconductor device includes measuring the reflectance at the surface of a semiconductor substrate provided with concave portions and deciding a deposition parameter that represents a deposition condition corresponding to the measured re...	12/21/2010
7368042	Electroplating apparatus including a real-time feedback system An electro-chemical plating system includes an upper rotor assembly for receiving and holding a wafer; an electroplating reactor vessel for containing plating solution in which the wafer is immersed; an anode array including a plurality of concentric anode segments ...	05/06/2008
7238265	Electroplating apparatus with functions of voltage detection and flow rectification The present invention provides a fountain-type electroplating apparatus with functions of voltage detection and flow rectification, comprising: an electroplating tank, a rectification device, and an overflow tank, wherein the electroplating tank is positioned inside...	07/03/2007
7183787	Contact resistance device for improved process control A device for measuring resistances associated with electrical contacts of a contact ring used in a semiconductor wafer electroplating process. The device includes a substrate and a conductive pattern on the substrate. The conductive pattern is electrically contactab...	02/27/2007
7161689	Apparatus and method for processing a microelectronic workpiece using metrology A processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. The control can modify a process recipe or a process sequence of the processing apparatus based on a feed forward or a ...	01/09/2007
7156975	Polishing method and electropolishing apparatus A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface comprises a step of determining an electropolishing end point of the metal film on the basis of a change of a current waveform r...	01/02/2007
6953522	Liquid treatment method using alternating electrical contacts A contact is disposed to come into contact with a metal layer formed on a substrate being treated, the contact being in contact with a surface being treated from an opposite surface through a through hole present in a substrate. Alternatively, a contact is disposed ...	10/11/2005
6916413	Electro-plating apparatus and method Electroplating station S has a head 1 with anode 2, to one side of which there is located an electrically neutral wall 3. The width of anode 2 is provided to accommodate the width of web 6. Serrations 9 are provided on the a...	07/12/2005
6913681	Plating method and plating apparatus A cathode potential is applied to a conductive layer formed on a substrate having a depression pattern. A plating solution in electrical contact with an anode is supplied to the conductive layer to form a plating film on the conductive layer. At this time, the plati...	07/05/2005
6884333	Electrochemical system for analyzing performance and properties of electrolytic solutions The invention relates to the analysis of the performance and properties of electrochemical processes, and specifically, to electrolytic solutions and electrode processes. The invention discloses a device and a method for obtaining qualitative and quantitative inform...	04/26/2005
6755946	Clamshell apparatus with dynamic uniformity control The present invention includes apparatus and methods for measuring impedance of a layer of deposited metal on a substrate and controlling deposition uniformity during electroplating. A first circuit delivers plating current to a metal layer on the substrate, and a s...	06/29/2004
6736952	Method and apparatus for electrochemical planarization of a workpiece An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge ...	05/18/2004
6693417	Micro-electronic bond degradation sensor and method of manufacture A micro-electronic bond degradation sensor includes a sensor substrate having sensor circuitry and a sensor stud and a power stud extending therefrom. The sensor circuitry includes a voltage-to-current amplifier having an input coupled to sensor stud and ...	02/17/2004
6620307	Method for a removal of cathode depositions by means of bipolar pulses A method for on-line removal of cathode depositions during electrochemical process. The process control unit (30) is arranged to alternate the unipolar machining voltage pulses U1 with the voltage pulses of opposite polarity U2 to the work piece (2) and t...	09/16/2003
6517689	Plating device The present invention is to provide a conduction detection device that can detect electrical conductivity (contact condition) of feeding contacts with conductive layers of a substrate. The present invention also provides an electroplating apparatus, which...	02/11/2003
6500317	Plating apparatus for detecting the conductivity between plating contacts on a substrate The present invention provides a conductivity sensing device capable of detecting the conductivity (contact state) of the plurality of feeder contacts contacting the conductive area of the substrate, and a plating apparatus capable of forming a plating fi...	12/31/2002
6447668	Methods and apparatus for end-point detection An apparatus for detecting the end-point of an electropolishing process of a metal layer formed on a wafer includes an end-point detector. The end-point detector is disposed adjacent the nozzle used to electropolish the wafer. In one embodiment, the end-p...	09/10/2002
6428673	Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology An electrochemical processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. An electrochemical deposition unit provides a space to receive said microelectronic workpie...	08/06/2002
6391166	Plating apparatus and method An apparatus for plating a conductive film directly on a substrate with a barrier layer on top includes anode rod (1) placed in tube (109), and anode rings (2), and (3) placed between cylindrical walls (107) and (105), (103) and (101), respectively. Anode...	05/21/2002
6238539	Method of in-situ displacement/stress control in electroplating The dominant physical parameter that affects the internal stress of electroplated metals on substrates have been identified and their effects have been systematically studied. Thin electroplated metals have very high internal stresses, even though the sub...	05/29/2001
6235178	Method and device for coating a metal strip A method for coating a metal strip using a coating metal, in particular for coating a steel strip using zinc or a zinc/nickel compound, by means of at least one electroplating cell through which current flows and which contains an electrolyte through whic...	05/22/2001
6200450	Method and apparatus for depositing Ni-Fe-W-P alloys A method is described for electrodepositing an alloy of Ni-Fe-W-P. The alloy has good corrosion and wear resistance and hence is a possible replacement for hard chromium. The electrodeposition solution contains nickel ions, iron ions, tungsten ions and ph...	03/13/2001
6153065	Internal stress testing device for high speed electroplating An internal stress testing device for high speed electroplating is disclosed. The testing device comprises: a tank to be filled with a plating solution; a metal plate for anode disposed within the tank; a metal rod for cathode disposed within the tank and...	11/28/2000
6090262	Barrel plating method A barrel plating method wherein each box containing pieces to be plated is provided with a kanban corresponding to the pieces contained in the box. The kanban of each box is read by an apparatus before the pieces are transferred from the box to a plating ...	07/18/2000
5914022	Method and apparatus for monitoring and controlling electrodeposition of paint A method and apparatus for monitoring electrodes for the electrodeposition of paint onto metallic workpieces includes detecting current from the electrodes and displaying a plot of current versus time. A method and apparatus for controlling electrodeposit...	06/22/1999
5685971	Apparatus and method for forming a variable diameter hole in a conductive workpiece A method and apparatus for forming a passage with a variable diameter along its length in a conductive workpiece are disclosed. The workpiece is mounted in a fixture and an externally insulated hollow electrode is positioned proximate to a surface locatio...	11/11/1997
5454921	Electrolytic combined processing machine An electrolytic combined processing machine includes a grinding wheel spaced apart from and facing a workpiece, a current switching circuit for switching a coarse grinding to a fine grinding of the workpiece by the grinding wheel, and an infeed switching ...	10/03/1995
5190623	Nuclear fuel reprocessing plant In a nuclear fuel reprocessing plant for processing a used nuclear fuel by a nitric acid solution, the present invention provides a nuclear fuel reprocessing plant characterized by including electrolytic reduction means for reducing the valence of oxidizi...	03/02/1993
4786376	Electrodeposition without internal deposit stress An apparatus and method are described for electrodepositing an electroform with near zero internal stress. A voltage controlled power supply supplies current to both a mandrel, upon which a primary electroform is deposited, and to a deformable thin disk s...	11/22/1988
4497695	Plating current automatic switching method and apparatus A method and apparatus for automatically changing a plating thickness in an electrical plating line in which unwanted over-plating is prevented. The plating line includes a plurality of plating tanks through which a member to be plated is conveyed and cor...	02/05/1985
4287044	Silver recovery apparatus A silver recovery apparatus for recovering silver from a solution containing silver ions, such as a photographic fixer bath, including an electrolytic recovery cell, a probe electrode located in a liquid conduit connecting a source of the solution to the ...	09/01/1981
4287043	Apparatus for electrodepositing a metallic layer of predetermined thickness An apparatus for electrodepositing a layer of predetermined layer thickness has an anode supplied with DC voltage by a converter device. A programmable computer having inputs for the desired value of the layer thickness and for technological parameters, s...	09/01/1981
4129480	Method and apparatus for determining the immersed surface area of one of the electrodes of an electro-chemical bath The immersed surface area of one of the electrodes in a conventional electro-chemical bath is accurately determined, so that the bath may be operated at an optimium current density, to obtain high quality electro-plating or electro-polishing. The current ...	12/12/1978
3944478	Electrolytic drainage treating apparatus An electrolytic drainage treating apparatus is provided to treat a drainage containing a suspension of contaminated compound whereby the suspension is flocculated and removed by aluminum ions or iron ions eluted by electrolysis. The electrolytic drainage ...	03/16/1976

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Class 204/228.7 - Workpiece property sensing means (e.g., mass, coating thickness, etc.)