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| Number | Title | Issue Date |
| 8419906 | Electroplating systems Electroplating systems that include a plurality of electrodes, a power supply operably coupled to the plurality of electrodes, a platen for bearing a substrate on which metal features are to be formed, and an electrode support are disclosed. The electrode support ma... | 04/16/2013 |
| 8349149 | Apparatus for enhanced electrochemical deposition One embodiment of the invention is an apparatus for electrochemical deposition (ECD) of a metal or an alloy inside at least one opening located at a front surface of a substrate, said apparatus including: (a) an electrochemical deposition (ECD) cell adapted to conta... | 01/08/2013 |
| 8343320 | Electrolytic acting torch for the surface working of metals The electrolytic action torch (2, 12, 19, 22, 26) for the surface treatment of metals, comprises a nib (4, 11) connected with the unipolar supply of electric current (7) from an external apparatus, the other pole being connected with the metal s... | 01/01/2013 |
| 8323460 | Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal Presented are methods and systems for fabricating three-dimensional integrated circuits having large diameter through-hole vias. One embodiment of the present invention provides a method of processing a wafer having holes for through-hole vias. The method comprises ... | 12/04/2012 |
| 8252154 | Electroplating apparatus An electroplating apparatus includes an electroplating tank, a first supporting bar, a first holding element, two second supporting bars, a number of spaced crossbars, a number of second holding elements, and a power supply. The first holding element is suspended in... | 08/28/2012 |
| 8110077 | Sealing jig and plating treatment apparatus A sealing jig comes into contact with a cylinder inner peripheral surface as a surface to be processed of a cylinder block and seals the cylinder inner peripheral surface in introducing treatment liquid to the cylinder inner peripheral surface. The sealing jig inclu... | 02/07/2012 |
| 8101050 | System, method, and apparatus for continuous electroplating of elongated workpieces A system electroplates the interior or exterior cylindrical surfaces of an elongated workpiece, such as a pipe or shaft. The workpiece is continuously electroplated with metallic solutions via a traveling anode that gradually plates along the axial length of the wor... | 01/24/2012 |
| 7947157 | Apparatus and method for depositing and planarizing thin films of semiconductor wafers An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided ... | 05/24/2011 |
| 7927468 | Electrode assembly for use in an electrodeposition process An electrode assembly for use with an electrodeposition process. According to an exemplary embodiment, the electrode assembly includes an electrode for exchanging electrical current with a solution, a passageway for removing gas that becomes trapped between a workpi... | 04/19/2011 |
| 7811423 | Proximity processing using controlled batch volume with an integrated proximity head A plating assembly for use in plating metallic materials onto a surface of a substrate is provided. The plating assembly comprising a delivery unit having a fluid chamber, a metallic source, and a porous insert. The plating assembly also comprising a receiving unit ... | 10/12/2010 |
| 7803258 | Machine for localized cleaning with an electrolytic cell, for pickling and/or polishing metal surfaces A machine for localized cleaning, using pickling acid or a composition/mixture of chemical elements with the effect of pickling acid, applied by mechanical feed instruments (54, 55) to the surface to be treated (5), presenting: the acid kept in a limit... | 09/28/2010 |
| 7803257 | Current-leveling electroplating/electropolishing electrode A current-leveling electrode for improving electroplating and electrochemical polishing uniformity in the electrochemical plating or electropolishing of metals on a substrate is disclosed. The current-leveling electrode includes a base electrode and at least one sub... | 09/28/2010 |
| 7799182 | Electroplating on roll-to-roll flexible solar cell substrates Embodiments of the invention contemplate the formation of a low cost flexible solar cell using a novel electroplating method and apparatus to form a metal contact structure. The apparatus and methods described herein remove the need to perform one or more high tempe... | 09/21/2010 |
| 7767065 | Device and method for electrolytically treating an at least superficially electrically conducting work piece A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this problem the invention provides ... | 08/03/2010 |
| 7722745 | Device for plating contacts in hermetic connector assemblies This invention relates generally to a method and apparatus for electroplating selected portions of elongate and generally cylindrical metallic articles pre assembled and held in spaced-apart fashion into a nonconductive support member encircled by a metallic tube li... | 05/25/2010 |
| 7691241 | Electrolytic etching method and apparatus The present invention relates to a method and apparatus for partial etching or pattern etching using an electrolysis reaction, wherein, conventionally, there was the problem that an etching line could not be finely formed on a cell edge because of apparatus problems... | 04/06/2010 |
| 7563348 | Electroplating head and method for operating the same An electroplating head including a chamber having a fluid entrance and a fluid exit is provided. The chamber is configured to contain a flow of electroplating solution from the fluid entrance to the fluid exit. The electroplating head also includes an anode disposed... | 07/21/2009 |
| 7438795 | Electrochemical-mechanical polishing system Provided is a polishing apparatus and polishing pad, intended for polishing a substrate, and designed for improved flow and distribution of a polishing composition to the area of interaction between the pad and substrate. In one aspect, a polishing pad is provided h... | 10/21/2008 |
| 7427340 | Conductive pad A method and apparatus for a processing pad assembly for polishing a substrate is disclosed. The processing pad assembly has a conductive processing pad having a plurality of raised features made of a conductive composite disposed on a conductive carrier. The raised... | 09/23/2008 |
| 7425250 | Electrochemical mechanical processing apparatus A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer to polish the conductive surface. Application of a potential differe... | 09/16/2008 |
| 7416647 | Plating processing device A plating processing device comprises: a plating bath, on which an object to be plated is mounted; and a sparger provided with plating nozzle and washing nozzle for jetting plating solution and washing solution, respectively, toward the object in such a manner that ... | 08/26/2008 |
| 7413638 | Nanolithography and microlithography devices and method of manufacturing such devices A lithography device includes one or more conductive strips monolithically embedded within an insulative structure. A method of manufacturing a lithography device includes monolithically forming a conductive strip through an insulative structure. Monolithically form... | 08/19/2008 |
| 7378004 | Pad designs and structures for a versatile materials processing apparatus An apparatus capable of assisting in controlling an electrolyte flow and an electric field distribution used for processing a substrate is provided. It includes a rigid member having a top surface of a predetermined shape and a bottom surface. The rigid member conta... | 05/27/2008 |
| 7374644 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupl... | 05/20/2008 |
| 7368049 | Method and apparatus for electrowinning copper using the ferrous/ferric anode reaction and a flow-through anode The present invention relates, generally, to a method and apparatus for electrowinning metals, and more particularly to a method and apparatus for copper electrowinning using the ferrous/ferric anode reaction and a flow-through anode, such as, for example, a dimensi... | 05/06/2008 |
| 7368042 | Electroplating apparatus including a real-time feedback system An electro-chemical plating system includes an upper rotor assembly for receiving and holding a wafer; an electroplating reactor vessel for containing plating solution in which the wafer is immersed; an anode array including a plurality of concentric anode segments ... | 05/06/2008 |
| 7361256 | Electrolytic reactor An electrolytic reactor including a conical recess of removable slices through which the electrolyte circulates towards a part to be coated under the action of a pump setting up forced circulation. The part is polarized to act as a cathode, facing a coaxial anode in... | 04/22/2008 |
| 7357115 | Wafer clamping apparatus and method for operating the same A wafer clamping apparatus is provided to secure a wafer within a chamber during wafer processing. The wafer clamping apparatus creates a pressure differential between a top surface and a bottom surface of the wafer. The pressure differential serves to pull the wafe... | 04/15/2008 |
| 7350316 | Meniscus proximity system for cleaning semiconductor substrate surfaces A system and apparatus for cleaning a substrate is provided. The system includes a first head configured as a bar shape that extends approximately a diameter of the substrate. The first head is configured for placement on a first side of the substrate. A second head... | 04/01/2008 |
| 7344623 | System and method for radially positioning a workpiece for electrochemical machining A system and method are described for radially positioning a workpiece for electrochemical machining. In one embodiment, a pressurized air chamber is configured to contain pressurized air. In addition, an expandable diaphragm is configured to position the workpiece ... | 03/18/2008 |
| 7341649 | Apparatus for electroprocessing a workpiece surface The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electr... | 03/11/2008 |
| 7334885 | Distribution container and distribution method for liquid-discharging head A distribution container containing storage liquid is mounted in a cartridge holding section of a line head to substitute for an ink cartridge during transportation and storage of the line head. The storage liquid prevents air from flowing into the line head through... | 02/26/2008 |
| 7329335 | Device providing electrical contact to the surface of a semiconductor workpiece during processing Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second ... | 02/12/2008 |
| 7323731 | Photoelectric conversion device, method of manufacturing photoelectric conversion device, and image pickup system A photoelectric conversion device comprising a semiconductor substrate of a first conduction type, and a photoelectric conversion element having an impurity region of the first conduction type and a plurality of impurity regions of a second conduction type opposite ... | 01/29/2008 |
| 7311809 | Plating apparatus for substrate The present invention provides a plating apparatus for a substrate which can plate a substrate under uniform pressure without increasing a load to be applied while holding the entire surface of a porous member in contact with the surface, to be plated, of the substr... | 12/25/2007 |
| 7303462 | Edge bead removal by an electro polishing process A method and apparatus for the removal of a deposited conductive layer along an edge of a substrate using an electrode configured to electro polish a substrate edge are disclosed. The electro polishing of the substrate edge may occur simultaneously during electroche... | 12/04/2007 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7297239 | Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad a... | 11/20/2007 |
| 7294243 | Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly (400) can comprise a support member (410) that includes an inner wall (412) which defines an opening (414) configured to receive the wor... | 11/13/2007 |
| 7288172 | Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing A method and apparatus for transmitting electrical signals and fluids to and/or from a microelectronic workpiece. An apparatus in accordance with one embodiment of the invention includes a shaft rotatable about a shaft axis and having a first end with a first electr... | 10/30/2007 |
