Did You Know...
...that it was melting ice cream that inspired the invention of the outboard motor? It was a lovely August day and Ole Evinrude was rowing his boat to his favorite island picnic spot. As he rowed, he watched his ice cream melt and wished he had a faster way to get to the island. At that moment the idea for the outboard motor was born!
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| Number | Title | Issue Date |
| 7993498 | Apparatus and method of electrolytic removal of metals from a wafer surface An apparatus and method designed to remove metals from a wafer surface using an electrolytic removal process. The apparatus includes a conductive pad having a plurality of alternating cathodes and anodes provided with a power source. The conductive pad is structured... | 08/09/2011 |
| 7758732 | Method and apparatus for applying a voltage to a substrate during plating A method for applying a strike voltage to one or more substrates during plating. During this method, the substrates are moved in a planetary manner while being held at their exterior edges by a set of parallel mandrels. (The substrates are held in a mutually paralle... | 07/20/2010 |
| 7520967 | Fluid applying apparatus A meniscus of applying fluid is controlled by applying a voltage to a discharge-nozzle side electrode and a counter electrode placed downstream of the discharge nozzle and by increasing or decreasing fluid pressure inside a pump chamber with use of a mechanism for r... | 04/21/2009 |
| 7438795 | Electrochemical-mechanical polishing system Provided is a polishing apparatus and polishing pad, intended for polishing a substrate, and designed for improved flow and distribution of a polishing composition to the area of interaction between the pad and substrate. In one aspect, a polishing pad is provided h... | 10/21/2008 |
| 7399390 | Barrel plating device A barrel plating device is disclosed, wherein hollow support shafts placed to be approximately level with each other are mounted in a piercing form to support members combined together to face each other at a prescribed interval, the opposite ends of a barrel having... | 07/15/2008 |
| 7378004 | Pad designs and structures for a versatile materials processing apparatus An apparatus capable of assisting in controlling an electrolyte flow and an electric field distribution used for processing a substrate is provided. It includes a rigid member having a top surface of a predetermined shape and a bottom surface. The rigid member conta... | 05/27/2008 |
| 7361257 | Electrochemical screening system Devices and methods for evaluating an electrochemical reaction are disclosed. A device includes an electrochemical cell having a cavity for containing a liquidus electrolyte, a first working electrode having at least one electrolytic surface at least partially withi... | 04/22/2008 |
| 7341649 | Apparatus for electroprocessing a workpiece surface The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electr... | 03/11/2008 |
| 7329335 | Device providing electrical contact to the surface of a semiconductor workpiece during processing Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second ... | 02/12/2008 |
| 7316772 | Defect reduction in electrodeposited copper for semiconductor applications A method for electroplating a copper deposit onto a semiconductor integrated circuit device substrate having submicron-sized features, and a concentrate for forming a corresponding electroplating bath. A substrate is immersed into an electroplating bath formed from ... | 01/08/2008 |
| 7309413 | Providing electrical contact to the surface of a semiconductor workpiece during processing Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second ... | 12/18/2007 |
| 7292427 | Pin lift chuck assembly for warped substrates A vacuum chuck apparatus may include chuck plate having a substantially flat chucking surface, one or more lift pins, and a lifting mechanism. The lift pins are configured to clamp a substrate at three or more locations. The lifting mechanism lifts the heads of the ... | 11/06/2007 |
| 7288172 | Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing A method and apparatus for transmitting electrical signals and fluids to and/or from a microelectronic workpiece. An apparatus in accordance with one embodiment of the invention includes a shaft rotatable about a shaft axis and having a first end with a first electr... | 10/30/2007 |
| 7285202 | Method for electroplating a cylindrical inside surface of a work-piece-extending substantially over a semi-circle A method is described for electroplating a cylindrical inside surface (4) of a work-piece (3) extending substantially over a semi-circle, with an electrolyte being conveyed from a bath (8) in a circulation through a gap (9) between the in... | 10/23/2007 |
| 7273540 | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film An electrolytic plating method, including: preparing a plating solution including water which is a primary medium, a sulfonic acid, and tin, copper, and silver ions, and a complexing agent, concentrations of the sulfonic acid, and tin, copper, and silver ions being ... | 09/25/2007 |
| 7267749 | Workpiece processor having processing chamber with improved processing fluid flow A processing container (610) for providing a flow of a processing fluid during immersion processing of at least one surface of a microelectronic workpiece is set forth. The processing container comprises a principal fluid flow chamber (505) providing a... | 09/11/2007 |
| 7261128 | Wire wrapping hand tool A hand tool capable of wrapping and unwrapping wires on terminals is provided with a an electrically-insulating drive housing or adaptor and coupling which insulate the bit, and sleeve if present, and driver from the housing and the gear train thereby protecting the... | 08/28/2007 |
| 7252746 | Electropolishing apparatus and method for medical implants An electropolishing apparatus and method are provided for polishing stents and other medical implants. The apparatus includes a motor that rotates a roller. The roller continuously rotates the medical implant to be electropolished. One of the advantages of the appar... | 08/07/2007 |
| 7247563 | Filling high aspect ratio openings by enhanced electrochemical deposition (ECD) One embodiment of the invention is a method for void-free filling with a metal or an alloy inside openings by electrochemical deposition (ECD), said method including steps of: (a) providing a substrate with at least one opening and a field surrounding the at least o... | 07/24/2007 |
| 7247222 | Electrochemical processing cell Embodiments of the invention may generally provide a small volume electrochemical plating cell. The plating cell generally includes a fluid basin configured to contain a plating solution therein, the fluid basin having a substantially horizontal weir. The cell furth... | 07/24/2007 |
| 7244347 | Method and system to provide electrical contacts for electrotreating processes Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented. ... | 07/17/2007 |
| 7239747 | Method and system for locating position in printed texts and delivering multimedia information Apparatus and methods are disclosed for processing printed material to provide an index of locations within the printed material that can be associated with external actions such as displaying a graphical image, providing an audio or video output, or providing a mul... | 07/03/2007 |
| 7214297 | Substrate support element for an electrochemical plating cell A contact ring for an electrochemical plating system is provided. The contact ring includes an annular substrate supporting member, a plurality of radially positioned conductive substrate contact pins extending from the substrate supporting member, an annular conduc... | 05/08/2007 |
| 7211174 | Method and system to provide electrical contacts for electrotreating processes Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented. ... | 05/01/2007 |
| 7211175 | Method and apparatus for potential controlled electroplating of fine patterns on semiconductor wafers Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are provided to mitigate corrosion of a metal seed layer on recessed features du... | 05/01/2007 |
| 7204918 | High efficiency plating apparatus and method An improved apparatus for treating plate-like workpieces with a designated chemical solution, including printed circuit boards, includes: (1) a tray for holding the chemical solution, with the tray having an open top which is configured to receive a horizontally-ori... | 04/17/2007 |
| 7189313 | Substrate support with fluid retention band An apparatus and method for supporting a substrate is provided. In one embodiment, an apparatus for supporting a substrate includes a body having a band extending therefrom. The band is adapted to retain a fluid on the body thereby forming a shallow processing bath ... | 03/13/2007 |
| 7169269 | Plating apparatus, plating cup and cathode ring A plating apparatus (10) provided with: a plating vessel (61a to 61d) having a cylindrical side wall (361) for containing a plating liquid; a substrate holding mechanism (74a to 74d) for generally... | 01/30/2007 |
| 7166204 | Plating apparatus and method A plating apparatus and method which smoothly perform contact of a plating liquid with a surface of the substrate and which can prevent air bubbles from remaining on the surface to be plated. The plating apparatus includes a plating bath containing a plating liquid ... | 01/23/2007 |
| 7160421 | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a mathematical model of the processing ... | 01/09/2007 |
| 7153410 | Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces. One embodiment of an electrochemical processing apparatus in accordance with the invention comprises a workpiece holder configured to receive a microelectronic workpiece... | 12/26/2006 |
| 7151347 | Passivated niobium cavities A niobium cavity exhibiting high quality factors at high gradients is provided by treating a niobium cavity through a process comprising: 1) removing surface oxides by plasma etching or a similar process; 2) removing hydrogen or other gases absorbed in the bulk niob... | 12/19/2006 |
| 7138039 | Liquid isolation of contact rings Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending fro... | 11/21/2006 |
| 7122105 | Use of siderophores to increase the current efficiency of iron plating solutions A method of electroplating iron or an iron alloy with a solution containing an iron-chelating agent to catalytically cycle the undesirable Fe(III) species back to Fe(II) for electroplating. The iron-chelating agents may be siderophores, specifically, for example, de... | 10/17/2006 |
| 7118658 | Electroplating reactor A reactor for electroplating a workpiece includes a vessel having a ring contact arranged to support a workpiece in a horizontal orientation. In an embodiment of the invention, an electrode is arranged below the ring contact, and a pressing member is arranged above ... | 10/10/2006 |
| 7108776 | Plating apparatus and plating method In the invention, there is provided a plating treatment technique which permits uniform plating treatment and easy replacement of articles to be plated without the effect of bubbles in a plating solution by improving wet plating apparatuses of the contact type to th... | 09/19/2006 |
| 7097410 | Methods and apparatus for controlled-angle wafer positioning The orientation of a wafer with respect to the surface of an electrolyte is controlled during an electroplating process. The wafer is delivered to an electrolyte bath along a trajectory normal to the surface of the electrolyte. Along this trajectory, the wafer is an... | 08/29/2006 |
| 7090751 | Apparatus and methods for electrochemical processing of microelectronic workpieces A processing chamber comprising a reaction vessel having an electro-reaction cell including a virtual electrode unit, an electrode assembly disposed relative to the electro-reaction cell to be in fluid communication with the virtual electrode unit, and an electrode ... | 08/15/2006 |
| 7090750 | Plating An apparatus and method for treating a substrate to deposit, clean or etch material on a substrate using a first horizontal chuck to which a plurality of substrates is attached and electrically charged. Spaced closely to the first horizontal chuck is a coextensive h... | 08/15/2006 |
| 7087144 | Contact ring with embedded flexible contacts A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an an... | 08/08/2006 |
