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...that Kleenex tissue was originally designed to be a gas mask filter? It was developed at the beginning of World War I to replace cotton, which was then in short supply as a surgical dressing.
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| Number | Title | Issue Date |
| 8057644 | Process and apparatus for plating articles A process and apparatus utilizing at least one conformable anode (40) in a plating process to apply a plating to an article (10). A wire or other material suitable for an anode is shaped to conform to the approximate shape of a region of the article to... | 11/15/2011 |
| 7811422 | Electro-chemical processor with wafer retainer A wafer plating apparatus has a rotor in a head including wafer retainers which properly hold a wafer on the rotor in position. A seal on the head seals plating bath liquid away from the edges of the wafer. After plating is completed and the wafer is moved away from... | 10/12/2010 |
| 7776189 | Method and apparatus for electropolishing metallic stents An apparatus and method are provided for simultaneously electropolishing a plurality of metallic stents. A plurality of elongated members on the apparatus are movably engaged with a plate such that movement of the plate relative to the elongated members causes each ... | 08/17/2010 |
| 7520966 | Electropolishing apparatus and method for implantable medical devices An electropolishing device for polishing a cylindrical medical device such as a stent includes anodes in the form of rollers arranged to contact an exterior surface of the device. A drive mechanism rotates the anodes periodically during the electropolishing process ... | 04/21/2009 |
| 7341649 | Apparatus for electroprocessing a workpiece surface The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electr... | 03/11/2008 |
| 7285191 | Phosphate film processing method and phosphate film processing device A phosphate coating apparatus for depositing a phosphate coating on a metal material by electrolyzing the metal material in a predetermined electrolysis solution includes a positive electrode and a negative electrode, of which one electrode being disposed in contact... | 10/23/2007 |
| 7282190 | Silicon layer production method and solar cell production method A solar cell is produced by dipping a multicrystalline silicon substrate 28 in a solution 24 containing silicon, growing a silicon layer on the substrate 28 while decreasing with time the temperature drop rate of the solution during the dipping ... | 10/16/2007 |
| 7211174 | Method and system to provide electrical contacts for electrotreating processes Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented. ... | 05/01/2007 |
| 7208076 | Substrate processing apparatus and method A substrate processing apparatus can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate, or process a peripheral... | 04/24/2007 |
| 7204926 | Tandem blisk electrochemical machining A tandem blisk is mounted in a multiaxis electrochemical machine. A first row of blades is electrochemically machined in sequence. A second row of blades is then electrochemically machined in sequence while the blisk is still mounted in the machine. The machine is i... | 04/17/2007 |
| 7201828 | Planar plating apparatus An apparatus for performing an electrochemical process on a surface of a workpiece comprises a platen assembly comprising a support platen, an electrolyte distribution plate, and a first conductive layer intermediate the support platen and distribution plate and con... | 04/10/2007 |
| 7169269 | Plating apparatus, plating cup and cathode ring A plating apparatus (10) provided with: a plating vessel (61a to 61d) having a cylindrical side wall (361) for containing a plating liquid; a substrate holding mechanism (74a to 74d) for generally... | 01/30/2007 |
| 7166204 | Plating apparatus and method A plating apparatus and method which smoothly perform contact of a plating liquid with a surface of the substrate and which can prevent air bubbles from remaining on the surface to be plated. The plating apparatus includes a plating bath containing a plating liquid ... | 01/23/2007 |
| 7141146 | Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface An electrochemical mechanical process for electroplating or electropolishing a conductive surface of a wafer is provided. The conductive surface of the wafer is touched by a polishing surface of a compressible pad while a process solution flows through the pad and a... | 11/28/2006 |
| 7138040 | Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode An electrolytic copper plating method characterized in employing phosphorous copper as the anode upon performing electrolytic copper plating, and performing electrolytic copper plating upon making the crystal grain size of the phosphorous copper anode 10 to 1500 μm... | 11/21/2006 |
| 7090750 | Plating An apparatus and method for treating a substrate to deposit, clean or etch material on a substrate using a first horizontal chuck to which a plurality of substrates is attached and electrically charged. Spaced closely to the first horizontal chuck is a coextensive h... | 08/15/2006 |
| 7045043 | Method of reducing a band mark of an electroplating steel sheet The present invention relates to a method of reducing a band mark on an electroplating steel sheet, which can also reduce plating defects and damages to the materials caused by the differences in the physical characteristics of composition materials of a conductor r... | 05/16/2006 |
| 7033468 | Elastic contact element For manufacturing printed circuit boards and films 7 with little variations in the layer thickness of the circuit structures without damaging the surfaces of the boards and films, a rotatory element 9, 10, more specifically a contact roll, is used for ... | 04/25/2006 |
| 7025862 | Plating uniformity control by contact ring shaping An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating surface adapted to recei... | 04/11/2006 |
| 7014036 | Cathode linear conveyer assembly The present invention provides a linear conveyer assembly for cathode plates comprising a continuous timing belt provided with cathode plate conveying assemblies attached thereto and having cam rollers running in a pair of channels running along either side of and p... | 03/21/2006 |
| 6949177 | System and method for processing semiconductor wafers using different wafer processes A system and method for processing semiconductor wafers using different wafer processes utilizes multiple processing assemblies to efficiently perform these wafer processes. The wafer processes performed by the processing assemblies may vary with respect to operatin... | 09/27/2005 |
| 6942765 | Submicron and nano size particle encapsulation by electrochemical process and apparatus An apparatus and method for coating or treating powdered material, particularly ultra-fine powders in the nanometer or submicron range of mean diameters, by electrolytic processes. A platen is mounted for rotation upon a fixed shaft, and a rotary flow-through electr... | 09/13/2005 |
| 6926812 | Electric feeding method and apparatus for a continuous plating apparatus To avoid the formation of undesirable plating on electric supply rollers, there is provided a continuous plating apparatus in which a planar article to be plated is vertically clamped on both sides by electric supply rollers and the article to be plated is moved hor... | 08/09/2005 |
| 6919010 | Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction A substantially uniform layer of a metal is electroplated onto a work piece having a seed layer thereon. The current of a plating cell is provided from an azimuthally asymmetric anode, which is rotated with respect to the work piece (i.e., either or both of the work... | 07/19/2005 |
| 6855235 | Anode impedance control through electrolyte flow control Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to s... | 02/15/2005 |
| 6843897 | Anode slime reduction method while maintaining low current Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to s... | 01/18/2005 |
| 6818104 | Anodizing apparatus In a process for producing a semiconductor member, and a solar cell, making use of a thin-film crystal semiconductor layer, the process includes the steps of: (1) anodizing the surface of a first substrate to form a porous layer at least on one side of the substrate... | 11/16/2004 |
| 6752915 | Web conveying apparatus, and apparatus and method for electrodeposition using web conveying apparatus The present invention provides a web conveying apparatus for conveying a web while holding the web and applying tension to the web, wherein the conveying apparatus has a plurality of rollers with which the web contacts to be conveyed, and at least one roller of the ... | 06/22/2004 |
| 6749764 | Plasma processing comprising three rotational motions of an article being processed An article which is being processed with plasma is moved during plasma processing so that the motion of the article comprises at least a first rotational motion, a second rotational motion, and a third rotational motion which occur simultaneously. The apparatus that... | 06/15/2004 |
| 6582570 | Electroplating apparatus for wheel disk An electroplating apparatus for wheel disk comprises an electrolytic cell containing electrolytic bath, a cathode plate, an auxiliary anode, at least one anode plate and a driving mechanism. Part of the auxiliary anode is provided with an insulating shiel... | 06/24/2003 |
| 6572739 | Electrolytic apparatus for forming a support for lithographic printing plate An electrolytic apparatus, for supporting a lithographic printing plate, including a guide roller for transporting an aluminum web. The guide roller includes a skeleton section formed with a strong material, a liquid contact section on the surface of the ... | 06/03/2003 |
| 6537430 | System for galvanic treatment or finishing of pieces, and corresponding method In at least one bath of the system, tumbling barrels containing pieces to be treated are arranged with their respective longitudinal axes set parallel to or coinciding with the longitudinal axis of the bath and are free to move longitudinally along the ba... | 03/25/2003 |
| 6514392 | Conducting roller for an electroplating apparatus A conducting roller is used in an electroplating apparatus, and includes a conductive roller body, which has two diameter-reduced end portions that are journalled within two stationary conductive sleeve units. A conductive liquid is filled within two seal... | 02/04/2003 |
| 6478937 | Substrate holder system with substrate extension apparatus and associated method An apparatus and associated method that removes electrolyte solution from a substrate, the apparatus comprises a thrust plate and a substrate extension unit. The thrust plate at least partially defines a spin recess. The substrate extension unit can be di... | 11/12/2002 |
| 6478936 | Anode assembly for plating and planarizing a conductive layer A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft dispo... | 11/12/2002 |
| 6391166 | Plating apparatus and method An apparatus for plating a conductive film directly on a substrate with a barrier layer on top includes anode rod (1) placed in tube (109), and anode rings (2), and (3) placed between cylindrical walls (107) and (105), (103) and (101), respectively. Anode... | 05/21/2002 |
| 6264816 | Machine for the electrophoretic re-painting or re-varnishing of thin metal objects The present invention relates to a machine for the electrophoretic painting or varnishing of thin metal objects such as, for example, lids for food containers, comprising a tank for the electrophoretic bath, extending along a longitudinal axis, a conveyor... | 07/24/2001 |
| 6261425 | Electroplating machine An electroplating machine is disclosed as including an electrode positioning apparatus, an electrolyte delivery apparatus, an apparatus for covering a roller, an apparatus for dissolving copper oxide powder in an electrolyte passing through the apparatus,... | 07/17/2001 |
| 6183607 | Anode structure for manufacture of metallic foil An electrodeposition cell for electrodepositing metal onto a surface of a rotating drum that is partially immersed in an electrolytic solution. The cell includes an anode comprised of a main anode body portion and an anode extension portion. The main anod... | 02/06/2001 |
| 6126798 | Electroplating anode including membrane partition system and method of preventing passivation of same An anode includes an anode cup, a membrane and ion source material, the anode cup and membrane forming an enclosure in which the ion source material is located. The anode cup includes a base section having a central aperture and the membrane also has a ce... | 10/03/2000 |
