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A method of swing on a swing is disclosed, in which a user positioned on a standard swing suspended by two chains from a substantially horizontal tree branch induces side to side motion by pulling alternately on one chain and then the other.
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| Number | Title | Issue Date |
| 8172989 | Prevention of substrate edge plating in a fountain plating process A plating apparatus and method for plating a surface of a substrate are described. Generally, the apparatus includes a double wall plating vessel having an inner cup and an outer cup peripherally surrounding and spaced apart from the inner cup. The inner cup has an ... | 05/08/2012 |
| 8123914 | Electrode plate transportation apparatus An electrode plate transportation apparatus moves up and down electrode plates moved to a position above an electrolytic bath, and places and draw the electrode plates in and from the electrolytic bath. The apparatus includes a stationary frame that is suspended fro... | 02/28/2012 |
| 7959770 | Electrocoating plant In order to provide an electrocoating plant for coating workpieces, in particular vehicle bodies, comprising at least one immersion bath, in which at least one electrode is disposed, a conveying device, which brings the workpieces into the immersion bath and out of ... | 06/14/2011 |
| 7947156 | Substrate processing apparatus and substrate processing method A substrate processing apparatus can carry out removal of a passive layer (ruthenium oxide) present on a surface of a ruthenium film and electroplating successively, and can reduce the terminal effect at the time of the removal of the passive layer (ruthenium oxide)... | 05/24/2011 |
| 7943018 | Apparatus for treating flat brittle substrates An apparatus for treating flat, brittle substrates is described, in which apparatus the substrates are acted upon in a treatment chamber by a treatment liquid. For this purpose they are guided by a transport device so as to pass horizontally through the treatment ch... | 05/17/2011 |
| 7938937 | Solid-electrolyte capacitor manufacturing device and manufacturing method The invention provides an apparatus for producing solid electrolytic capacitors having uniform properties with excellent ESR value efficiently at low costs and a production process using the apparatus. The production process using the apparatus is characterized in t... | 05/10/2011 |
| 7807027 | Substrate holder, plating apparatus, and plating method A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for ... | 10/05/2010 |
| 7704352 | High-aspect ratio anode and apparatus for high-speed electroplating on a solar cell substrate Embodiments of the invention contemplate the formation of a low cost solar cell using a novel high speed electroplating method and apparatus to form a metal contact structure having selectively formed metal lines using an electrochemical plating process. The apparat... | 04/27/2010 |
| 7622024 | High resistance ionic current source A substantially uniform layer of a metal is electroplated onto a work piece having a seed layer thereon. This is accomplished by employing a “high resistance ionic current source,” which solves the terminal problem by placing a highly resistive membrane (e.g., a... | 11/24/2009 |
| 7531069 | Device for the transport of flexible planar material, in particular circuit boards A transport system for circuit boards (12) in treatment devices (11) which runs the circuit boards (12) between pairs of rollers (20, 21). The pairs of rollers are arranged in roller tracks (17, 18) running parallel to the edge of ... | 05/12/2009 |
| 7449089 | Conveyorized plating line and method for electrolytically metal plating a workpiece To avoid voids in the metal layer in holes of printed circuit boards, a conveyorized plating line and a method for electrolytically metal plated printed circuit boards are proposed which provide measures for reducing an electric voltage that builds up between adjace... | 11/11/2008 |
| 7425250 | Electrochemical mechanical processing apparatus A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer to polish the conductive surface. Application of a potential differe... | 09/16/2008 |
| 7402227 | Plating apparatus and method An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps (protruding electrodes) on the surface of a semiconductor wafer. The app... | 07/22/2008 |
| 7371306 | Integrated tool with interchangeable wet processing components for processing microfeature workpieces An integrated tool that enables wet chemical processing chambers, lift-rotate units and other hardware to be quickly interchanged without having to recalibrate the transport system or other components to the replacement items. These tools are expected to reduce the ... | 05/13/2008 |
| 7323058 | Apparatus for electroless deposition of metals onto semiconductor substrates An electroless deposition system is provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station inclu... | 01/29/2008 |
| 7311808 | Device and method for increasing mass transport at liquid-solid diffusion boundary layer A device and method for increasing the mass transport rate of a chemical or electrochemical process at the solid and fluid interface in a fluid cell. The device includes a membrane in close contact with surface of the work piece, to separate the process cell into tw... | 12/25/2007 |
| 7303462 | Edge bead removal by an electro polishing process A method and apparatus for the removal of a deposited conductive layer along an edge of a substrate using an electrode configured to electro polish a substrate edge are disclosed. The electro polishing of the substrate edge may occur simultaneously during electroche... | 12/04/2007 |
| 7303064 | Feeder belt for strip-shaped parts A feeder belt for strip-shaped parts used to feed the strip-shaped parts in various processes such as plating, deflashing, or other processes for manufacturing semiconductors or other articles at industrial scale. By improving the structure of a finger for a feeder ... | 12/04/2007 |
| 7294244 | Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with another independent aspect of the present invention, the workpiece processing station is adapted for adjusting the level of the processing... | 11/13/2007 |
| 7290551 | Washing device and its work conveying method The present invention resides in a washing device constructed by a conveyer of a carrying-in side arranged in a frame, a reservoir lower portion having plural rails for holding the work and an ultrasonic generator arranged in this frame, each reservoir upper portion... | 11/06/2007 |
| 7285201 | Process for electrocoating metal blanks and coiled metal substrates Processes for forming a coating on electroconductive flat blanks having two major surfaces and sheared edges are provided. Also provided is a process for forming a multi-composite coating on a pre-sheared, electroconductive, flat blank having two major surfaces and ... | 10/23/2007 |
| 7285200 | Process for electrocoating metal blanks and coiled metal substrates Processes for forming a coating on electroconductive flat blanks having two major surfaces and sheared edges are provided. Also provided is a process for forming a multi- composite coating on a pre-sheared, electroconductive, flat blank having two major surfaces and... | 10/23/2007 |
| 7282124 | Device providing electrical contact to the surface of a semiconductor workpiece during processing Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second ... | 10/16/2007 |
| 7279079 | Plating apparatus, cartridge and copper dissolution tank for use in the plating apparatus, and plating method A plating apparatus provided with: three copper dissolution tanks connected to a plating liquid circulation path for supplying copper ions to a plating liquid; a buffer container for supplying a replacement liquid into some of the copper dissolution tanks not in use... | 10/09/2007 |
| 7252714 | Apparatus and method for thermally controlled processing of microelectronic workpieces Apparatus and method for thermally controlled processing of microelectronic workpieces with liquids. An apparatus in accordance with and embodiment of the invention includes a process vessel configured to carry a processing liquid, such as an electroless processing ... | 08/07/2007 |
| 7241366 | Continuous coating process A system for coating variable and/or unlimited length parts is provided. The system comprises a process tank, a coating material supply, and an open-ended process tank conveyor is provided. The process tank comprises an entry port, an exit port opposite the entry po... | 07/10/2007 |
| 7239747 | Method and system for locating position in printed texts and delivering multimedia information Apparatus and methods are disclosed for processing printed material to provide an index of locations within the printed material that can be associated with external actions such as displaying a graphical image, providing an audio or video output, or providing a mul... | 07/03/2007 |
| 7238264 | Galvanizing device A galvanizing device has at least one jet cell with a contact zone located after the jet cell in the direction of transportation of a work piece through the jet cell. At least one partition separates the jet cell from the contact zone. A seal surrounds the workpiece... | 07/03/2007 |
| 7238265 | Electroplating apparatus with functions of voltage detection and flow rectification The present invention provides a fountain-type electroplating apparatus with functions of voltage detection and flow rectification, comprising: an electroplating tank, a rectification device, and an overflow tank, wherein the electroplating tank is positioned inside... | 07/03/2007 |
| 7226860 | Method and apparatus for fabricating metal layer A method of electrochemical deposition (ECD) provides a barrier and a seed layer on a substrate. The surfaces of the substrate are pre-treated before a metal layer is electrochemically deposited thereon in an electrochemical plating cell with a physical or a chemica... | 06/05/2007 |
| 7211174 | Method and system to provide electrical contacts for electrotreating processes Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented. ... | 05/01/2007 |
| 7208074 | Substrate processing apparatus and substrate plating apparatus A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a s... | 04/24/2007 |
| 7204743 | Integrated circuit interconnect fabrication systems A system for processing a conductive surface on a front surface of a wafer to form a metallic interconnect structure is disclosed. The system for processing comprises an electrochemical mechanical processing (ECMPR) module configured to form a substantially planariz... | 04/17/2007 |
| 7205153 | Analytical reagent for acid copper sulfate solutions Embodiments of the invention provide an analytical method and analytical reagent solutions for determining the concentration of electrolyte components, such as copper, acid and chloride constituents in an acid or basic metal plating bath using a chemical analyzer. C... | 04/17/2007 |
| 7204918 | High efficiency plating apparatus and method An improved apparatus for treating plate-like workpieces with a designated chemical solution, including printed circuit boards, includes: (1) a tray for holding the chemical solution, with the tray having an open top which is configured to receive a horizontally-ori... | 04/17/2007 |
| 7201828 | Planar plating apparatus An apparatus for performing an electrochemical process on a surface of a workpiece comprises a platen assembly comprising a support platen, an electrolyte distribution plate, and a first conductive layer intermediate the support platen and distribution plate and con... | 04/10/2007 |
| 7203565 | Temperature abnormality detection method and semiconductor manufacturing apparatus A semiconductor manufacturing apparatus includes: a hot plate that heats an article to be processed; a temperature control section that controls temperature of the hot plate; a main body control section that controls the entirety of the apparatus based on a process ... | 04/10/2007 |
| 7201647 | Subpad having robust, sealed edges Provided are encapsulated belts and encapsulated pads for use in a variety of polishing application, including the chemical-mechanical polishing and planarization of semiconductor wafers and other workpieces. The encapsulated belts and pads are characterized by a ro... | 04/10/2007 |
| 7192494 | Method and apparatus for annealing copper films A method and apparatus for annealing copper. The method comprises forming a copper layer by electroplating on a substrate in an integrated processing system and annealing the copper layer in a chamber inside the integrated processing system. ... | 03/20/2007 |
| 7189313 | Substrate support with fluid retention band An apparatus and method for supporting a substrate is provided. In one embodiment, an apparatus for supporting a substrate includes a body having a band extending therefrom. The band is adapted to retain a fluid on the body thereby forming a shallow processing bath ... | 03/13/2007 |
