Did You Know...
...that to encourage use of his new invention, the shopping cart, market owner Sylvan Goldman hired fake shoppers to push the carts around his store in Oklahoma City? Seems his customers were reluctant to give up their hand-carried baskets.
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| Number | Title | Issue Date |
| 7435353 | Patterning by energetically-stimulated local removal of solid-condensed-gas layers and solid state chemical reactions produced with such layers The invention provides a method for forming a patterned material layer on a structure, by condensing a vapor to a solid condensate layer on a surface of the structure and then localized removal of selected regions of the condensate layer by directing a beam of energ... | 10/14/2008 |
| 7368779 | Hemi-spherical structure and method for fabricating the same Hemi-spherical structure and method for fabricating the same. A device includes discrete pillar regions on a substrate, and a pattern layer on the discrete support structures and the substrate. The pattern layer has hemi-spherical film regions on the discrete suppor... | 05/06/2008 |
| 7351986 | Method and apparatus for reducing cross contamination of species during ion implantation A wafer support for an ion implanter includes a wafer holder and a support arm for the holder in the implant chamber. A portion of the support arm adjacent the wafer holder is at least intermittently exposed to the ion beam during implantation, as a result of the re... | 04/01/2008 |
| 7313854 | Method of manufacturing a tactile sensor A method of manufacturing a tactile sensor, which is capable of implementing a wide range of senses, including sensing contact pressure (vertical force and horizontal force) with an external object and heat caused by the contact pressure, comprises forming a side bl... | 01/01/2008 |
| 7294517 | Light emitting device and method of fabricating the same It is characteristic of an organic material suited to an interlayer insulating film to transmit vapor therethrough and to be liable to absorb moisture, and the material has a disadvantage that it is extremely susceptible to oxygen and moisture to be readily deterior... | 11/13/2007 |
| 7294404 | Graded photocatalytic coatings The invention provides graded photocatalytic coatings. In one aspect, the invention provides a substrate carrying a photocatalytic coating that includes a first graded film region and a second graded film region. The first graded film region has a substantially cont... | 11/13/2007 |
| 7273817 | Conditioning of a reaction chamber A method is provided for forming polymer on an interior surface of a reaction chamber. A polymer-forming gas is introduced into the chamber during the etching of a photoresist layer of a semiconductor wafer within the reaction chamber and the environment is regulate... | 09/25/2007 |
| 7270729 | System for, and method of, etching a surface on a wafer First and second electrodes and magnets between the electrodes define an enclosure. The first electrode is biased at a high voltage to produce a high intensity electrical field. The second electrode is biased at a low negative voltage by a low alternating voltage to... | 09/18/2007 |
| 7251878 | Method and apparatus for defining leading edge taper of a write pole tip A method and apparatus for defining leading edge taper of a write pole tip is disclosed. The fabrication process uses reactive ion etching to fabricate LET with tight control of the placement of LET's edge and to achieve higher angle for providing a higher effective... | 08/07/2007 |
| 7213322 | Method for manufacturing surface acoustic wave device A piezoelectric substrate is provided with interdigital transducer electrodes including a first electrode layer, a second electrode layer, and a third electrode layer that is principally made of aluminum. The piezoelectric substrate has a stepped structure on the su... | 05/08/2007 |
| 7195716 | Etching process and patterning process An etching process is described. A material layer having a bottom anti-reflection coating (BARC) and a patterned photoresist layer thereon is provided. An etching step is performed to the BARC using the patterned photoresist layer as a mask. A cleaning step is perfo... | 03/27/2007 |
| 7153441 | Method for manufacturing thin-film magnetic recording medium A thin-film magnetic recording medium is produced by forming a laminate for magnetic data recording on a nonmagnetic substrate through a dry process, forming a protection layer on the laminate also through a dry process, plasma-etching the protection layer, and form... | 12/26/2006 |
| 7152305 | Method for fabricating a magnetoresistive (MR) read head A magnetoresistive (MR) read head is disclosed including a shield layer with a recessed portion and a protruding portion defined by the recessed portion. Also included is an MR sensor located in vertical alignment with the protruding portion of the shield layer. Fur... | 12/26/2006 |
| 7150811 | Ion beam for target recovery A charged particle beam apparatus and method for locally removing material from a predetermined location on a workpiece, such as the removal of a metallization layer covering an alignment mark on a wafer. The invention is particularly suited for high-volume mass pro... | 12/19/2006 |
| 7144547 | Target for cathode discharging arc ion plating and method of manufacturing the same In a target for cathode discharging arc ion plating containing Al and Cr as an essential ingredient according to the invention, the thickness of the Al and Cr compound layer formed between Cr particles and Al contained in a target is 30 μm or less. Alternatively, t... | 12/05/2006 |
| 7141508 | Magnetoresistive effect thin-film magnetic head and manufacturing method of magnetoresistive effect thin-film magnetic head A manufacturing method of an MR thin-film magnetic head with an MR film and lead conductors overlapping each other, includes a step of depositing a conductor layer on at least the magnetoresistive effect film, a step of forming a cap layer patterned on the deposited... | 11/28/2006 |
| 7135396 | Method of making a semiconductor structure Methods of making a semiconductor structure are disclosed. A refractory metal layer containing W, TiW, Ta, or TaN and semiconductor layer are formed on a substrate that contains copper in, for example, a via therein. A portion of the refractory metal layer and semic... | 11/14/2006 |
| 7134941 | Methods for residue removal and corrosion prevention in a post-metal etch process A method of plasma assisted CO2 cleaning for dry removal of residual photoresist and sidewall polymer with an etch gas mixture comprising fluorine containing gas, oxygen and hydrogen in N2 or H2O. The process removes polymer residues... | 11/14/2006 |
| 7104217 | Plasma processing apparatus The present invention provides a plasma processing apparatus having an electrode plate arranging therein, an upper electrode to which a dielectric member or a cavity portion is provided, a dimension or a dielectric constant of which is determined in such a manner th... | 09/12/2006 |
| 7101260 | Methods for resist stripping and other processes for cleaning surfaces substantially free of contaminants A method for manufacturing an article where the article has polymeric residue that is to be removed during the manufacture of the article. The article is introduced into a controlled environment of a processing tool that has at least first and second processing cham... | 09/05/2006 |
| 7077971 | Methods for detecting the endpoint of a photoresist stripping process Methods for detecting the endpoint of a photoresist stripping process provide O for reaction with the photoresist for a wafer to be stripped of photoresist. NO is also supplied for reaction with O not reacted with the photoresist. After substantially all the photore... | 07/18/2006 |
| 7071113 | Process for removal of photoresist mask used for making vias in low K carbon-doped silicon oxide dielectric material, and for removal of etch residues from formation of vias and removal of photoresist mask A process for removal of a photoresist mask used to etch openings in low k carbon-doped silicon oxide dielectric material of an integrated circuit structure, and for removing etch residues remaining from either the etching of the openings or removal of the resist ma... | 07/04/2006 |
| 7066789 | Methods for resist stripping and other processes for cleaning surfaces substantially free of contaminants A method for manufacturing an article having polymeric residue that is to be removed during the manufacture of the article is disclosed. The article is introduced into a controlled environment of a processing tool having one or more processing chambers. Free radical... | 06/27/2006 |
| RE39143 | Method for making a wafer-pair having sealed chambers A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be perfo... | 06/27/2006 |
| 7037832 | Method of forming a conductive pattern by removing a compound with heat in a substantially inert atmosphere A method for forming a conductive or magnetic pattern for a semiconductor or other electronic device includes patterning a mask layer outwardly from a conductive layer of the semiconductor device. The patterning defines portions of the conductive layer where vias th... | 05/02/2006 |
| 7033516 | Inexpensive fabrication of large-area pixel arrays for displays and sensors A method and system for fabricating an array of electronic devices, typically a display or sensor is described. In the method, a droplet source ejects droplets of a masking material for deposit on a thin film or substrate surface to mask an element of the array of e... | 04/25/2006 |
| 7022620 | Conditioning of a reaction chamber A method is provided for forming polymer on an interior surface of a reaction chamber. A polymer-forming gas is introduced into the chamber and the environment is regulated to form the polymer on the interior surface of the chamber. Methods for the manufacture of in... | 04/04/2006 |
| 7015168 | Low dielectric constant fluorine and carbon-containing silicon oxide dielectric material characterized by improved resistance to oxidation The invention provides a process for forming a low k fluorine and carbon-containing silicon oxide dielectric material by reacting with an oxidizing agent one or more silanes containing one or more organofluoro silanes having the formula SiR1R2R... | 03/21/2006 |
| 7007374 | Method of making a magnetic head A narrow track width read sensor having a high magnetoresistive sensitivity is made using a self-aligned process which requires the use of only a single resist mask. A plurality of sensor layers is deposited over a substrate. After forming a resist mask in the centr... | 03/07/2006 |
| 6972265 | Metal etch process selective to metallic insulating materials A method is provided which includes patterning one or more metal layers arranged above a metal insulating layer and terminating the patterning process upon exposure of the metal insulating layer. In particular, the method may be adapted to be more selective to the m... | 12/06/2005 |
| 6946053 | Plasma reactor This invention is a hardware modification which permits greater uniformity of etching to be achieved in a high-density-source plasma reactor (i.e., one which uses a remote source to generate a plasma, and which also uses high-frequency bias power on the wafer chuck)... | 09/20/2005 |
| 6939446 | Soil-resistant coating for glass surfaces A glass article which has a water-sheeting coating and a method of applying coatings to opposed sides of a substrate are described. In one embodiment, a water-sheeting coating 20 comprising silica is sputtered directly onto an exterior surface of the glass. T... | 09/06/2005 |
| 6935618 | Valve component with multiple surface layers A sliding component, particularly a disk valve plate. The sliding component includes a multi-layer surface structure comprising a strengthening layer harder than the substrate material, and an amorphous diamond top layer. ... | 08/30/2005 |
| 6930056 | Plasma treatment of low dielectric constant dielectric material to form structures useful in formation of metal interconnects and/or filled vias for integrated circuit structure A process for forming an integrated circuit structure comprises forming a layer of low k dielectric material over a previously formed integrated circuit structure, and treating the upper surface of the layer of low k dielectric material with a plasma to form a layer... | 08/16/2005 |
| 6908562 | Method of forming electrode for saw device A method of forming an electrode for a surface acoustic wave (SAW) device comprises the steps of forming an alloy film (32) made of aluminum (Al) and magnesium (Mg) on a substrate (31) and selectively etching the alloy film (32) by using a gaseo... | 06/21/2005 |
| 6868856 | Enhanced remote plasma cleaning Methods and apparatus for cleaning semiconductor processing equipment. The apparatus include both local and remote gas dissociators coupled to a semiconductor processing chamber to be cleaned. The methods include introducing a precursor gas into the remote dissociat... | 03/22/2005 |
| 6863787 | Dummy copper deprocessing A method of improving focused ion beam milling particularly suitable for uniformly removing multiple layers of conductor and dielectric, such as the removal of multiple layers consisting of dummy copper pads and SiO2 on a semiconductor device. Variable Pi... | 03/08/2005 |
| 6854175 | Method of manufacturing a thin film magnetic head A method of manufacturing a thin film magnetic head capable of improving a yield while making a pole width extremely minute with high precision is provided. A write gap layer and a bottom pole are selectively etched in a region other than a portion corresponding to ... | 02/15/2005 |
| 6846391 | Process for depositing F-doped silica glass in high aspect ratio structures A process for filling high aspect ratio gaps on substrates uses conventional high density plasma deposition processes to deposit fluorine-doped films, with an efficient sputtering inert gas, such as Ar, replaced or reduced with an inefficient sputtering inert gas su... | 01/25/2005 |
| 6824655 | Process for charged particle beam micro-machining of copper A micro-machining process that includes etching a substrate having copper overlying a dielectric layer to a charged particle beam in the presence of an etch assisting agent. The etch assisting agent is selected from the group consisting of ammonia, acetic acid, thio... | 11/30/2004 |
