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| Number | Title | Issue Date |
| 7686925 | Silicon alloy coating of insulated wire Method and apparatus for sputter coating an insulated wire with a silicon and metal alloy, to provide the wire with sufficient surface conductivity to protect against build-up of electrostatic charge. A sputtering target of silicon has a metal plate positioned close... | 03/30/2010 |
| 7556719 | Method of producing wired circuit board A method of producing a wired circuit board that can prevent the electrostatic damage of the components mounted on the wired circuit board effectively, while preventing operation errors of the device caused by the static electricity. After a thin metal film is forme... | 07/07/2009 |
| 7556720 | Electrostatic charge-free container and method of manufacturing such a container Container for the storage and/or transportation of liquids or powders, in particular inflammables, suitable for preventing the formation of electrostatic charge, comprising a tank supported by a pallet, housed in a metallic cage and having an outer surface in contac... | 07/07/2009 |
| 7455753 | Thin film stent A method for fabricating a stent or other medical device by creating a free standing thin film of metal. ... | 11/25/2008 |
| 7399386 | Magnetic recording medium, method of manufacturing the same and magnetic recording apparatus A magnetic recording medium using a plastic substrate as a non-magnetic substrate includes an adhesive layer that prevents film expansion even under severe conditions. The adhesive layer has a chemical affinity to the plastic substrate and is formed on the surface o... | 07/15/2008 |
| 7332213 | Hardcoat film, antireflection film and equipment for display A hardcoat film comprises a substrate film, and a hardcoat layer laminated on at least one side of the substrate film, wherein a reflectance of the hardcoat layer at a wavelength within 400 to 600 nm has a mean ripple amplitude of 1% or less. The hardcoat film has d... | 02/19/2008 |
| 7314573 | Plating process A process for making an electronic device which comprises applying a non-aqueous plate-resistant ink by ink jet printing to selected areas of a dielectric substrate, optionally laminated with an electrically conductive metal(s), exposing the plate resistant ink to a... | 01/01/2008 |
| 7301190 | Structures and methods to enhance copper metallization Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary structure includes an inhibiting layer between an insulator and a meta... | 11/27/2007 |
| 7285196 | Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals In recent years, copper wiring has emerged as a promising substitute for the aluminum wiring in integrated circuits, because copper offers lower electrical resistance and better reliability at smaller dimensions than aluminum. However, use of copper typically requir... | 10/23/2007 |
| 7275305 | Method of manufacturing a thin-film magnetic head A method of manufacturing a thin-film magnetic head, the thin-film magnetic head including a magnetoresistive element, first and second shield layers for shielding the magnetoresistive element, a first shield gap film provided between the magnetoresistive element an... | 10/02/2007 |
| 7262505 | Selective electroless-plated copper metallization Structures and methods are provided which include a selective electroless copper metallization. The present invention includes a novel methodology for forming copper vias on a substrate, including depositing a thin film seed layer of Palladium (Pd) or Copper (Cu) on... | 08/28/2007 |
| 7262130 | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals Integrated circuits, the key components in thousands of electronic and computer products, include interconnected networks of electrical components. The components are typically wired, or interconnected, together with aluminum wires. In recent years, researchers have... | 08/28/2007 |
| 7253109 | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system We have discovered a method of providing a thin, approximately from about 2 Å to about 100 Å thick TaN seed layer, which can be used to induce the formation of alpha tantalum when tantalum is deposited over the TaN seed layer. Further, the ... | 08/07/2007 |
| 7253521 | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals Integrated circuits include networks of electrical components that are typically wired, or interconnected, together with aluminum wires. In recent years, researchers have begun using copper in combination with diffusion barriers, rather than aluminum, to form the wi... | 08/07/2007 |
| 7238412 | Thermally and electrically conducting high index contrast multi-layer mirrors and devices An optical device is provided. The optical device includes a plurality of high index layers. The optical device also includes a plurality of low index layers. The optical device is formed by creating alternating layers of the plurality of high layers and the plurali... | 07/03/2007 |
| 7236290 | Electrophoretic medium with improved stability An electrophoretic medium comprises a liquid and at least one particle disposed within the liquid and capable of moving therethrough on application of an electric field to the medium. The medium further comprises a free radical scavenger selected from the group cons... | 06/26/2007 |
| 7220665 | H plasma treatment Electronic devices are constructed by a method that includes forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, forming a core conductive layer on the first conductive layer, subjecting the core conductive l... | 05/22/2007 |
| 7211512 | Selective electroless-plated copper metallization Structures and methods are provided which include a selective electroless copper metallization. The present invention includes a novel methodology for forming copper vias on a substrate. This method includes depositing a thin film seed layer of Palladium (Pd) or Cop... | 05/01/2007 |
| 7195202 | Method and device for improving the thermal comfort in passenger airplanes The invention relates to a method for improving the thermal comfort in passenger planes by means of a heat-reflecting coating with a low thermal emission coefficient, and airplanes and airplane parts bearing this coating. According to the invention, the coating is a... | 03/27/2007 |
| 7172681 | Process for producing rubber-based composite material Disclosed is a process for producing a rubber-based composite material, including the steps of forming, by sputtering, an adhesion film on a substrate to be mated with a rubber for constituting the composite material, laminating a rubber composition on the adhesion ... | 02/06/2007 |
| 7141145 | Gas injection for uniform composition reactively sputter-deposited thin films A method of forming a thin film on a substrate/workpiece by sputtering, comprising steps of: (a) providing an apparatus comprising a vacuum chamber including at least one sputtering source and a gas supply means for injecting a gas... | 11/28/2006 |
| 7132130 | Method for providing a chrome finish on a substrate An environmentally-friendly process for applying a chrome finish on a substrate is provided. The chrome finish comprises a thin film of aluminum and chromium deposited onto the substrate by physical vapor deposition (PVD) techniques. The thin layer can consist of th... | 11/07/2006 |
| 7118656 | Thin film stent A method for fabricating a stent or other medical device by creating a free standing thin film of metal. ... | 10/10/2006 |
| 7105234 | Flame retardant corrosive resistant conductive fabric article and method Disclosed is a conductive, flame-retardant polymeric fabric composed of a woven or non-woven nylon, polyester or acrylic fabric. A surface of the fabric is provided with a flame-retardant layer applied by coating the flame-retardant directly onto the fabric surface.... | 09/12/2006 |
| 7105914 | Integrated circuit and seed layers Structures are provided which improve performance in integrated circuits. The structures include a diffusion barrier and a seed layer in an integrated circuit both formed using a low energy ion implantation followed by a selective deposition of metal lines for the i... | 09/12/2006 |
| 7091611 | Multilevel copper interconnects with low-k dielectrics and air gaps Structures and methods are provided for an improved multilevel wiring interconnect in an integrated circuit assembly. The present invention provides for a multilayer copper wiring structure by electroless, selectively deposited copper in a streamlined process which ... | 08/15/2006 |
| 7077935 | Oand HO barrier material O2 and H2O barrier materials suitable for the protection of LCDs and flexible OLEDs are fabricated on a polymer substrate using dense inorganic barrier layers. A polymer surface having a low surface roughness has an inorganic layer of aluminum ... | 07/18/2006 |
| 7067206 | Perpendicular magnetic recording medium and a method of manufacturing the same A perpendicular magnetic recording medium has a granular magnetic layer and a nonmagnetic underlayer of a metal or an alloy having a hexagonal close packed (hcp) crystal structure. A seed layer of a metal or an alloy of a face-centered cubic (fcc) crystal structure ... | 06/27/2006 |
| 7067421 | Multilevel copper interconnect with double passivation Structures and methods provide multilevel wiring interconnects in an integrated circuit assembly which alleviate problems associated with integrated circuit size and performance and include methods for forming multilevel wiring interconnects in an integrated circuit... | 06/27/2006 |
| 7056014 | Flexible wired circuit board for temperature measurement A flexible wired circuit board for temperature measurement that can provide an accurate temperature measurement even when placed in a high-temperature atmosphere and can also be provided at a reduced cost. In the flexible wired circuit board for temperature measurem... | 06/06/2006 |
| 7045208 | Synthetic resin molded material and method for its production A synthetic resin molded material characterized in that a thin film made of an oxide of at least one metal selected from the group consisting of Si, Zr, Ti, Ta, Hf, Mo, W. Nb, Sn, In, Al and Zn, is formed by a dry method on a synthetic resin substrate having hydroph... | 05/16/2006 |
| 7037595 | Thin hafnium oxide film and method for depositing same A thin layer of hafnium oxide or stacking of thin layers comprising hafnium oxide layers for producing surface treatments of optical components, or optical components, in which at least one layer of hafnium oxide is in amorphous form and has a density less than 8 gm... | 05/02/2006 |
| 6995470 | Multilevel copper interconnects with low-k dielectrics and air gaps Structures and methods are provided for an improved multilevel wiring interconnect in an integrated circuit assembly. The present invention provides for a multilayer copper wiring structure by electroless, selectively deposited copper in a streamlined process which ... | 02/07/2006 |
| 6974547 | Flexible thin film capacitor and method for producing the same According to a flexible thin film capacitor of the present invention, an adhesive film is formed on a substrate composed of at least one selected from the group consisting of an organic polymer and a metal foil, and an inorganic high dielectric film and metal electr... | 12/13/2005 |
| 6958885 | Insulation layer structure for inductive write heads and method of fabrication A computer disk drive (22) having a write head (52) which includes a coil (38), a photoresist insulation layer (66) formed on the coil (38), and an insulation shell layer (102) which is formed on the photoresist insulation l... | 10/25/2005 |
| 6936141 | Dry etching and mirror deposition processes for silicone elastomer According to the invention semiconductor processing procedures can be applied to silicone elastomeric materials. The surface tension of the elastomeric material is changed by depositing a thin layer of silicon, silicon nitride, silicon dioxide or a combination there... | 08/30/2005 |
| 6933013 | Vacuum deposition of dielectric coatings on volatile material In order to allow application of any coating under a vacuum over a volatile gelatinous layer, such as polymer dispersed liquid crystal (PDLC) on an optical glass substrate with a transparent electrode, such as indium tin oxide (ITO) on its surface, a layer of an int... | 08/23/2005 |
| 6918676 | Object which has optical layers The invention relates to a process for producing an object which has optical layers. According to the invention such a process comprises the following process steps: To a substrate of plastic material several optical layers are applied; the optical layers are applie... | 07/19/2005 |
| 6911124 | Method of depositing a TaN seed layer We have discovered a method of providing a thin approximately from about 20 Å to about 100 Å thick TaN seed layer, which can be used to induce the formation of alpha tantalum when tantalum is deposited over the TaN seed layer. Further, the ... | 06/28/2005 |
| 6811826 | Multilayer polymeric/zero valent material structure for enhanced gas or vapor barrier and UV barrier and method for making same The coated multilayer structure comprising a polymeric base layer, a zero valent material barrier layer, and a top coat on the zero valent material barrier layer, the top coat comprising a soluble compound capable of reducing the permeability of the multilayer struc... | 11/02/2004 |
