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| Number | Title | Issue Date |
| 8157970 | Sputtering target fixture A method and apparatus for sputter deposition. The method including: providing a sputter target having a back surface and an exposed front surface; providing a source of magnetic field lines, the magnetic field lines extending through the sputter target from the bac... | 04/17/2012 |
| 8137511 | Film forming apparatus and film forming method A film forming apparatus and a film forming method includes: a vacuum chamber; a holder for a film formation object, the holder being rotatably provided in the vacuum chamber; and a sputter source capable of holding a plurality of targets, the sputter source being s... | 03/20/2012 |
| 8137510 | Coater with a large-area assembly of rotatable magnetrons This invention relates to a coater for the coating, in particular, of large-area substrates by means of cathode sputtering, the coater having a coating chamber and, provided therein, a cathode assembly (2) where the material to be sputtered is located on a ta... | 03/20/2012 |
| 8133358 | Method and apparatus for producing a metal wire coated with a layer of metal alloy A method and an apparatus for producing a steel wire for reinforcing an elastomeric material. The steel wire has a metal core and a coating layer made of a metal alloy material having a composition including at least one first metal component and at least one second... | 03/13/2012 |
| 8092658 | Method and apparatus of distributed plasma processing system for conformal ion stimulated nanoscale deposition process A deposition system and method of operating thereof is described for depositing a conformal metal or other similarly responsive coating material film in a high aspect ratio feature using a high density plasma is described. The deposition system includes a plasma sou... | 01/10/2012 |
| 8092659 | Multi-station sputtering and cleaning system A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. The system includes a sputtering chamber and a separate pre-clean chamber, where wafers ca... | 01/10/2012 |
| 8070917 | Reactive sputtering method A reactive sputtering method for application of a bias voltage to a supporting substrate in formation of a film of a metal compound on the supporting substrate according to a bias sputtering method; wherein a supporting substrate conveyor unit and a cathode that inc... | 12/06/2011 |
| 8052850 | Sputtering apparatus, method of operating the same, and method of manufacturing substrate using the same A sputtering apparatus includes a susceptor for receiving a substrate, and a first target device disposed to be opposite to a center region of a substrate and at least second and third target devices disposed to be opposite to peripheral regions of the substrate, wh... | 11/08/2011 |
| 8043481 | Sputtering method and apparatus A sputtering method deposits a film on a substrate by controlling a magnetic field parallel to a surface of a target so that the magnetic field at a part of the target, other than parts of the target which are sputtered during a deposition mode in which a deposition... | 10/25/2011 |
| 8038850 | Sputter deposition method for forming integrated circuit A sputter deposition apparatus and method, and a substrate holder for use with a sputter deposition apparatus is disclosed. According to one embodiment of the invention, a sputter deposition apparatus is provided, including at least one sputter target, a first plasm... | 10/18/2011 |
| 8034218 | Low temperature growth of oriented carbon nanotubes The invention concerns a method for growing oriented carbon nanotubes on a sample using a target of carbon or a variety of carbon in a deposition chamber where a plasma predominates. The sample (16) is arranged in contact with the target (15), in such ... | 10/11/2011 |
| 8025775 | Vacuum plasma generator A vacuum plasma generator with an output for feeding a plasma discharge for treatment of workpieces in a vacuum chamber has a connection for the junction to AC voltage mains, a rectifier connected to a converter with a control input for the setting and/or regulation... | 09/27/2011 |
| 8012314 | Manufacturing method and apparatus of phase shift mask blank There is disclosed a manufacturing method of a phase shift mask blank in which dispersions of phase angle and transmittance among blanks can be reduced as much as possible and yield is satisfactory. In the manufacturing method of the phase shift mask blank, a proces... | 09/06/2011 |
| 7998319 | Process for the formation of miniaturized getter deposits and getter deposits so obtained A process is provided for the formation of miniaturized getter deposits, comprising the steps of forming a layer of a photosensitive polymeric material on a support; selectively exposing the polymeric layer in order to cause a chemical modification in a portion of t... | 08/16/2011 |
| 7993496 | Cylindrical target with oscillating magnet for magnetron sputtering In some embodiments, the invention includes a cylindrical cathode target assembly for use in sputtering target material onto a substrate that comprises a generally cylindrical target, means for rotating the target about its axis during a sputtering operation, an elo... | 08/09/2011 |
| 7981257 | Current-based method and apparatus for detecting and classifying arcs An apparatus and technique are provided for generating a plasma using a power supply circuit and arc detection arrangement. The power supply circuit has a cathode enclosed in a chamber, and is adapted to generate a power-related parameter. The arc detection arrangem... | 07/19/2011 |
| RE42491 | Multilayer hard coating for tools A multilayer hard coating for tools for machining applications with a multilayer structure for improving the wear resistance of workpieces includes at least one (AlyCr1-y)X layer (0.2≦y≦0.7), wherein X is one of the following elements N, C,... | 06/28/2011 |
| 7955480 | Sputtering apparatus and film deposition method The present invention provides a sputtering apparatus and a film deposition method capable of forming a magnetic film with reduced variations in the direction of magnetic anisotropy. The sputtering apparatus of the present invention is provided with a rotatable cath... | 06/07/2011 |
| 7951272 | Thin film producing method The present invention is made to provide a method of producing a ZnO thin film in which the c-axis is oriented in-plane over a large area. A ZnO target 28 as the material of the thin film is sputtered by using a magnetron sputtering system, and a flow of mate... | 05/31/2011 |
| 7943016 | Magnetron sputtering apparatus The magnetron sputtering arrangement (2) comprises a target arrangement (3) comprising a target (3a1) having a sputtering surface (4) the shape of which defines a first (A1 and a second axis (A2) being mutually pe... | 05/17/2011 |
| 7927466 | Pulsed magnetron sputtering deposition with preionization The present invention relates to the deposition in a magnetron reactor (1) equipped with a magnetron cathode (MC) of at least one material on a substrate (11a), according to which process said material is vaporized by magnetron sputtering, using... | 04/19/2011 |
| 7905991 | Vacuum treatment system A vacuum treatment system (1) for treating workpieces has a treatment chamber (10) that can be evacuated and in which a low-volt arc-discharge device is placed, with at least one locking loading/unloading aperture and at least one coating source placed... | 03/15/2011 |
| 7892405 | Methods and apparatus for magnetron sputtering In one embodiment, a magnetron sputtering apparatus forms a closed plasma loop and an open plasma loop within the closed plasma loop. The open plasma loop allows for relatively uniform erosion on the face of a target by broadening the sputtered area of the target. T... | 02/22/2011 |
| 7857946 | Sputtering film forming method, electronic device manufacturing method, and sputtering system A sputtering film forming method. which positions a target 4 and 5 at an incline to a surface of a substrate 10 whereupon a film is to be formed, and forms the film upon the surface of the substrate 10 whereupon the film is to be formed i... | 12/28/2010 |
| 7850828 | Enhanced virtual anode The apparatus and method involve using a gas manifold for introducing gas into a deposition chamber. Certain embodiments involve using a binary manifold for uniform distribution of the gas with good response time. During sputtering operations, provision of an anode ... | 12/14/2010 |
| 7850829 | Sputter targets with expansion grooves for reduced separation A magnetron sputtering target having at least one expansion groove strategically located on the target surface such that, during magnetron sputtering, contamination of the target surface due to separation and de-lamination of re-deposited sputtered particles from th... | 12/14/2010 |
| 7842167 | Sputter apparatus with a pipe cathode and method for operating this sputter apparatus A sputter apparatus with a pipe cathode is arranged such that the supply of power, cooling fluid and other media to the pipe cathode takes place via flexible lines or tubes which can be wound about a receptor. If the pipe cathode completes a pendulum movement, the l... | 11/30/2010 |
| 7837836 | Method and apparatus for multi-stage sputter deposition of uniform thickness layers A method of forming a uniform thickness layer of a selected material on a surface of a substrate comprises steps of: (a) providing a multi-stage cathode sputtering apparatus comprising a group of spaced-apart cathode/target assembl... | 11/23/2010 |
| 7820016 | Sputtering apparatus and method of preventing damage thereof A sputtering apparatus includes a container; a plate for supporting the container; a first attachment for attaching the container to the plate; and a second attachment for less tightly attaching the container to the plate than through the first attachment. ... | 10/26/2010 |
| 7811421 | High deposition rate sputtering Methods and apparatus for high-deposition sputtering are described. A sputtering source includes an anode and a cathode assembly that is positioned adjacent to the anode. The cathode assembly includes a sputtering target. An ionization source generates a weakly-ioni... | 10/12/2010 |
| 7799179 | Sputtering cathode and device and method for coating a substrate with several layers The invention relates to a sputtering cathode (1) for coating a substrate (6), which comprises a device (5) for generating an external magnetic field with substantially parallel magnetic field lines (8) substantially in the plane of the s... | 09/21/2010 |
| 7785449 | Magnetron unit, magnetron sputtering apparatus, and method of manufacturing electronic device A magnetron unit includes a plurality of first magnet elements each including first magnets which have the same polarity and are provided on two end portions of a yoke plate made of a magnetic material and a second magnet which has a polarity different from that of ... | 08/31/2010 |
| 7767064 | Position controlled dual magnetron A dual magnetron for plasma sputtering including a source magnetron and an auxiliary magnetron, each of which rotate about the center of the target at respective radii. The positions of the magnetron can be moved in complementary radial directions between sputter de... | 08/03/2010 |
| 7744730 | Rotating pallet in sputtering system A processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. Multiple targets, of the same or different materials, may concurrently deposit material on the wafers as... | 06/29/2010 |
| 7736473 | Magnetron having continuously variable radial position A continuously variable multi-position magnetron that is rotated about a central axis in back of a sputtering target at a freely selected radius. The position is dynamically controlled from the outside, for example, through a hydraulic actuator connected between a p... | 06/15/2010 |
| 7718042 | Method for manufacturing sputter-coated substrates, magnetron source and sputtering chamber with such source A magnetron source, a magnetron treatment chamber, and a method of manufacturing substrates with a vacuum plasma treated surface, generate and exploit on asymmetrically unbalanced long-range magnetron magnetic field pattern which is swept along the substrate surface... | 05/18/2010 |
| 7718043 | Multilayer hard coating for tools A multilayer hard coating for tools for machining applications with a multilayer structure for improving the wear resistance of workpieces includes at least one (AlyCr1-y)X layer (0.2≦y≦0.7), wherein X is one of the following elements N, C,... | 05/18/2010 |
| 7708866 | Sputtering apparatus A sputtering apparatus comprises a substrate unit that includes a substrate on which a target material is deposited in a chamber and a target unit on which a plurality of target sections formed of the target material are arranged. The sputtering apparatus further co... | 05/04/2010 |
| 7678240 | Method for controlling plasma density or the distribution thereof Magnetron source has a target configuration with a sputter surface, a magnet configuration generating above the sputter surface a magnetic field which forms, in top view onto the sputter surface, at least one magnet field loop. Viewed in a cross-sectional direction ... | 03/16/2010 |
| 7678239 | Sliding anode magnetron sputtering source A magnetron sputtering source includes a plurality of electrodes and a switching circuit. The switching circuit sequentially connects each of the plurality of electrodes to a ground reference, making it anodic, while connecting the remaining of the plurality of elec... | 03/16/2010 |
