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| Number | Title | Issue Date |
| 8178793 | Chassis, electronic equipment and manufacturing method for chassis A chassis includes: a flat plate portion including a first major surface and a second major surface facing the first major surface; a protruding portion provided on an outer edge of the flat plate portion and protruding in a direction crossing the first and second m... | 05/15/2012 |
| 8178794 | Sealing structure To eliminate rubber burr formation at the time of molding and to make sealing members to be surely integrated with the flexible wiring board, a sealing structure consists of housings to which the flexible wiring board is inserted, and sealing members integrally form... | 05/15/2012 |
| 8097818 | Panel box The invention concerns a panel box, for the electrical connection of a photovoltaic module for a solar installation, with a base piece (1) for mounting on the photovoltaic module and for the electrical connection of a connection line of the photovoltaic modul... | 01/17/2012 |
| 7943868 | Sealed housing, a kit of parts including at least one housing, a combination including the housing or a kit of parts and a use of a friction enhancing element A sealed housing (10) accommodates at least one electric or electronic component (12, 14), and has a portion (20) extending through the mounting surface, as well as a rotation preventor (16, 28) preventing rotation of the housing (10 | 05/17/2011 |
| 7939768 | Crystal unit A crystal unit includes a unit base in which a metal flange is welded to an outer circumference of a base main body, a crystal element held by supporters on the unit base, and a metal cover that is jointed to the metal flange to cover and hermetically encapsulate th... | 05/10/2011 |
| 7923647 | Portable device A portable device enabling a user to visually recognize tampering with internal components. The portable device is for performing wireless communication with a predetermined communication subject and includes a circuit board on which an electronic component is mount... | 04/12/2011 |
| 7915544 | Cable seal apparatus and techniques for outside plant telecommunications housings Signals entering outside plant (OSP) telecommunications enclosures typically do so through weather tight connectors, with one connector mounted to the enclosure and a mating connector connected to a cable bringing the signals to the OSP housing. Such connectors are ... | 03/29/2011 |
| 7893365 | Weather resistant variable enclosure frame A weather resistant variable enclosure frame configured to enclose at least one electronic component is provided. The weather resistant variable enclosure frame includes a top and bottom endplate each having a channel on at least one side surface, and at least one c... | 02/22/2011 |
| 7863529 | Electronic component An electronic component includes: a first substrate; a second substrate; a sealing member surrounding a sealing space formed between the first substrate and the second substrate; and a functional element at least a part of which is disposed in the sealing space. In ... | 01/04/2011 |
| 7851710 | Waterproof and dustproof structure A waterproof and dustproof structure is applied to a predetermined hole of a circuit board. A connection end of a connector could penetrate the predetermined hole. Moreover, the circuit board has a first surface and a second surface. The waterproof and dustproof str... | 12/14/2010 |
| 7842891 | Sealing board and method for producing the same There is provided a sealing board (30) for sealing a container containing an electronic component, constituted of a base which is made of a material exhibiting a low wettability to a brazing filler metal (31) and on a surface of which a metal layer exh... | 11/30/2010 |
| 7790988 | Hermetic sealing cap, electronic component accommodation package, and method for producing hermetic sealing cap A hermetic sealing cap can be provided which is capable of suppressing that a production process becomes complicated, and additionally of suppressing that a solder layer wetly spreads inward on a sealing surface. This hermetic sealing cap (1, 30) includes a b... | 09/07/2010 |
| 7745739 | Sealing a controller A housing (1) with at least one electrical connection (7) through a housing wall (4) can be manufactured especially economically and can facilitate an especially economical lacing of electronic components (2, 13) present on the interior a... | 06/29/2010 |
| 7598462 | Sealed remote keyless entry device A keyless entry device includes a rear casing having a first surface extending along a periphery of the rear casing member, an electronic circuit located in the rear casing member and including comprising a substrate and switching elements supported on the substrate... | 10/06/2009 |
| 7331238 | Pressure detection device A pressure detection device includes a case unit which has therein an accommodation space and a pressure introduction passage, and a pressure detection unit having a detection surface for detecting a pressure applied thereto. Two ends of the pressure introduction pa... | 02/19/2008 |
| 7286338 | Electrical connection box An electrical connection box includes a plurality of circuit components at least partially overlapped one above the other, being substantially parallel with each other and arranged at a predetermined space each circuit component having a switching member and an elec... | 10/23/2007 |
| 7285725 | Weatherproof and restraining apparatus for electrical plugs An apparatus having an upper half with at least one upper clasp and a lower half hingedly connected to the upper half. The upper half and the lower half has a connector cavity and a cable channel, configured to receive a cord and a cord plug. The upper half and the ... | 10/23/2007 |
| 7283366 | Electrical connection box An electrical connection box includes a plurality of circuit components at least partially overlapped one above the other and substantially arranged in parallel. Each of the circuit components includes a substrate having a switching member and an electrical power co... | 10/16/2007 |
| 7244967 | Apparatus and method for attaching an integrating circuit sensor to a substrate A method of fabricating an integrated circuit sensor package. The method comprises the steps of: 1) mounting a substrate on a first mold block, the substrate comprising a substantially planar material having a first substrate surface and a second substrate surface t... | 07/17/2007 |
| 7243833 | Electrically-isolated interconnects and seal rings in packages using a solder preform Embodiments include electronic assemblies and methods for forming electronic assemblies. One embodiment includes a method of forming a MEMS device assembly, including forming an active MEMS region on a substrate. A plurality of bonding pads electrically coupled to t... | 07/17/2007 |
| 7208685 | Hardened voyage data recorder A hardened voyage data recorder includes two subsystems: a removable non-volatile memory and a base containing electronics and firmware for communicating with data sensing systems and for accessing the memory. According to the invention, the memory is protected in a... | 04/24/2007 |
| 7182624 | Plug retention apparatus A plug retention apparatus for use in securing two plug members together to prevent undesired disengagement. The plug retention apparatus is affixed to a first plug member using a retention ring which provides a means for adjustable positioning via a threaded coupli... | 02/27/2007 |
| 7163838 | Method and apparatus for forming a DMD window frame with molded glass An improved method for fabricating a window frame/window piece assembly is disclosed in this application. A window frame having an opening in its inner portion is provided. According to one aspect, the window frame can be formed from a unitary piece of sheet metal. ... | 01/16/2007 |
| 7161094 | Modifying the electro-mechanical behavior of devices A MEMS device is packaged with a control material that is included in the package to affect an operation of a moveable element of the device. The control material may affect operational characteristics including actuation and release voltages and currents, mechanica... | 01/09/2007 |
| 7154053 | Optoelectronic package with wire-protection lid An optoelectronic package with a wire-protection lid is provided. An active surface of a silicon die includes a light working area. The silicon die is disposed on a substrate and electrically connected to the substrate through a plurality of bonding wires. A glass i... | 12/26/2006 |
| 7122748 | Semiconductor device having packaging structure There is provided a semiconductor device comprising a semiconductor chip whose main surface comprises first electrode pads; a wiring portion electrically connected to the electrode pad and including a bump portion that protrudes upward in a vertical direction with r... | 10/17/2006 |
| 5526867 | Methods of forming electronic packages The present invention relates to the formation of a macrocomposite body for use as an electronic package or container. The macrocomposite body is formed by spontaneously infiltrating a permeable mass of filler material or a preform with molten matrix meta... | 06/18/1996 |
| 4870224 | Integrated circuit package for surface mount technology The present invention provides for an apparatus and a method for housing an integrated circuit device. The integrated circuit device is coupled to a ceramic substrate wherein contacts of the integrated circuit device mate with contacts on the substrate su... | 09/26/1989 |
| 4862323 | Chip carrier A chip carrier and a process of assembling a chip carrier are disclosed. The carrier used for mounting a chip comprises a copper or copper base alloy component having a thin refractory oxide layer on a surface thereof. The surface and the oxide layer have... | 08/29/1989 |
| 4855808 | Hermetic glass chip carrier A hermetically sealed glass chip carrier includes an outer glass ring and an inner glass base in which leads to the inner glass base pass between the ring and the base, with the ring, base and leads being sealed together by melting the glass in the vicini... | 08/08/1989 |
| 4852250 | Hermetically sealed package having an electronic component and method of making Forming a body of insulating material with a shelf and an opening therethrough with a plurality of electrical conductors extending from the shelf to the exterior of the body. A plurality of tape automated bounding leads are placed in the opening in which ... | 08/01/1989 |
| 4847557 | Hermetically sealed magnetic sensor A hermetically sealed magnetic sensor for detecting variations in a magnetic field has a sensor element with an output terminal for detecting variations in the magnetic field and generating a signal. An output wire is connected with one end to the termina... | 07/11/1989 |
| 4843695 | Method of assembling tab bonded semiconductor chip package A package for housing fabricated semiconductor chips is disclosed. The package has ceramic base with a raised outer shelf extending around its periphery. The outer shelf defines a space in the package where the chip is seated. A lead frame with a number o... | 07/04/1989 |
| 4839716 | Semiconductor packaging A semiconductor package of the small outlined integrated circuit type is disclosed having an angled glass sealing surface. Another aspect of the invention relates to a shield disposed in a semiconductor package to prevent alpha radiation emitted from the ... | 06/13/1989 |
| 4833102 | Process of making a ceramic lid for use in a hermetic seal package A sidebrazed ceramic package is provided with a closure seal that employs a high alumina ceramic lid that matches the composition of the package body. The lid is provided with a recess in the sealing face and the sealing face is provided with metallizatio... | 05/23/1989 |
| 4830979 | Method of manufacturing hermetically sealed compression bonded circuit assemblies A method of manufacturing hermetically sealed circuit assemblies (10) having circuit elements (74, 76, 78 and 80) to be compression bonded, a hermetically sealed circuit assembly having circuit elements to be compression bonded and a stack containing at l... | 05/16/1989 |
| 4821151 | Hermetically sealed package A hermetically sealed package adapted to house a plurality of semiconductor devices. The package include a multi-layer circuit device formed of a plurality of ceramic substrates and conductive circuit patterns disposed therebetween. A ceramic cover having... | 04/11/1989 |
| 4814943 | Printed circuit devices using thermoplastic resin cover plate A printed circuit device including semiconductor IC chips on the surface of a printed circuit board made of insulating material. The printed circuit board includes on the surface thereof semiconductor mounting regions and conductive layers. The semiconduc... | 03/21/1989 |
| 4805009 | Hermetically sealed semiconductor package The present invention is directed to several embodiments of a hermetically sealed semiconductor package. One embodiment is constructed from a substrate of a first copper alloy, a cover member of a second copper alloy and a lead frame of a third copper all... | 02/14/1989 |
| 4801488 | Sealing glass composite The present direct invention is directed to a sealing glass composite comprising a low melting point sealing glass matrix mixed with a particulate additive to increase the effective coefficient of thermal expansion of the resulting sealing glass composite... | 01/31/1989 |
