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| Number | Title | Issue Date |
| 8097817 | Electronic component An electronic component includes: a first substrate having a through-hole; a second substrate opposite the first substrate; a sealing member surrounding a sealing space formed between the first substrate and the second substrate; a functional element having at least... | 01/17/2012 |
| 7868259 | Device and method for producing a device A device has a housing (1) with a frame element (8) which is arranged within the housing (1). The frame element (8) accommodates at least one component and has at least one bending arm (12). The bending arm (12) is designed ... | 01/11/2011 |
| 7829799 | Method for manufacturing a miniaturized three-dimensional electric component Manufacturing of miniaturised three-dimensional electric components are presented, as well as components manufactured by the methods. The manufacturing methods comprise micro-replication of at least one master structure, e.g. via a mould structure, in at least one p... | 11/09/2010 |
| 7820921 | Housing for accommodating an electronic component and electronic component arrangement A housing can accommodate an electronic component. An outer wall of the housing forms a flat contact wall in which contact areas for connecting the housing to an interconnect device are arranged. ... | 10/26/2010 |
| 7679008 | Portable storage device with multiple data interfaces The present invention relates to a portable storage device with multiple data interfaces coupled to an electronic device for performing data access. The portable storage device has a casing, a circuit board, a first data interface and a second data interface. The ca... | 03/16/2010 |
| 7563991 | All weather housing assembly for electronic components An all weather housing assembly for protection of electrical components includes a first housing having an open end and defining a first compartment for receipt therein of electronic components; a cover attached to the first housing for enclosing the first compartme... | 07/21/2009 |
| 7414204 | Display device and heat dissipating means therefor A display device including a display panel, a chassis base connected to the plasma display panel, the chassis base supporting the plasma display panel, and a flexible printed circuit having a driver integrated circuit thereon installed on the chassis base while bein... | 08/19/2008 |
| 7399201 | Electronic device charging platform and portable electrical outlet enclosure An electronic device charging platform and portable electrical outlet enclosure providing a secure, accessible location for the placement and charging of an electronic device on the exterior of the enclosure, while having an interior space to house, use, and conceal... | 07/15/2008 |
| 7394029 | Module, method of manufacturing module, and electronic apparatus using module A module includes a circuit board, a first terminal on a lower surface of the circuit board, a first electronic component on an upper surface of the circuit board, a first cover made of metal covering the first electronic component, a second electronic component on ... | 07/01/2008 |
| 7348499 | Electrical enclosure removable backplate An electrical enclosure that includes a sidewall, a back and a top, defining an interior. The top of the enclosure is adapted to open and provide access to the interior. The enclosure includes a backplane mounted to the interior of the enclosure. The backplane has a... | 03/25/2008 |
| 7269895 | Clamping case Method and systems for clamping at least one circuit card within a case are provided. The method includes compressing axially at least one resilient element between a head of a shaft and a nut disposed on the shaft so that the at least one resilient element bulges g... | 09/18/2007 |
| 7156677 | Electrical connection box with drainage channel An electrical connection box includes a fuse box having a bottom wall, the fuse box detachably and attachably accommodating a fuse element; a circuit casing being disposed below the fuse box, the circuit casing having a supporting section on an upper surface therof;... | 01/02/2007 |
| 7154053 | Optoelectronic package with wire-protection lid An optoelectronic package with a wire-protection lid is provided. An active surface of a silicon die includes a light working area. The silicon die is disposed on a substrate and electrically connected to the substrate through a plurality of bonding wires. A glass i... | 12/26/2006 |
| 6628008 | Device with a transponder, in particular an actuating element for a motor vehicle A device for communicating a signal with respect to an authorization system for actuating a motor vehicle, and the device is relatively portable with respect to the motor vehicle. The device includes a first housing part, a cavity extending into the first... | 09/30/2003 |
| 4871884 | Electrical connecting box An electrical connecting box having improved water discharging properties. The connecting box includes a box body and a bus bar circuit board. The bus bar circuit board is sloped to defined a sloped surface having a predefined angle of inclination from a ... | 10/03/1989 |
| 4855872 | Leadless ceramic chip carrier printed wiring board adapter A leadless ceramic chip carrier (LCCC) is attached to an organic printed wiring board (PWB) via a Kapton.RTM. landing interface member. The LCCC terminals are soldered to conductors on the interface member whose conductors are also soldered to mating cond... | 08/08/1989 |
| 4845447 | Video filter assembly A trap filter assembly of the type employed with a video cable system to block a particular band of video frequencies has a housing formed as a generally rectangular block of square cross-section, made of cast aluminum or other suitable material. A cavity... | 07/04/1989 |
| 4831212 | Package for packing semiconductor devices and process for producing the same In a package comprising a chip mounting base and a cap to be fitted on the base, the base comprises a metal substrate, an electrically insulating ceramic layer formed on the metal substrate, a patterned metal layer formed on the ceramic layer in a selecte... | 05/16/1989 |
| 4831495 | Unitized packaging arrangement for an energy dissipating device A unitized packaging arrangement for an energy dissipating device comprises a thermoplastic housing, base, and cap which are joined together to form the package for the device. The thermoplastic housing is formed to mountably receive the energy dissipatin... | 05/16/1989 |
| 4827082 | Ceramic package A ceramic package includes a high thermal conductive ceramic substrate (AlN or SiC sintered substrate) on which a semiconductor element is mounted, and a mullite sintered frame having metal conductive paths therein and joined to the substrate.... | 05/02/1989 |
| 4793058 | Method of making an electrical connector A socket can be programmed to adapt the pin out configuration of an integrated circuit for convenient plug-in use or substitution in an environment, such as a socket, ordinarily intended for a similar integrated circuit with a different pin-out configurat... | 12/27/1988 |
| 4791717 | Interdigital filter apparatus and method for construction An integrated down converter and interdigital filter apparatus having a down converter and the interdigital filter mounted on the same printed circuit board and installed in the watertight housing. The housing of the interdigital filter is cut from sheet ... | 12/20/1988 |
| 4788626 | Power semiconductor module A power semiconductor module includes a plastic housing having an interior. A substrate in the form of a ceramic plate with upper and lower surfaces is inserted in the housing as a housing bottom. Metallizations are disposed on the upper and lower surface... | 11/29/1988 |
| 4780572 | Device for mounting semiconductors A device containing a semiconductor element having a substrate a cap over the substrate with a glass layer formed between the cap and the substrate providing a seal therebetween. Electrically conducting terminal members extend through the glass layer and ... | 10/25/1988 |
| 4761518 | Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs A semiconductor casing is formed of a ceramic-glass-metal composite material with a leadframe embedded in a base component. The leadframe may include holes therethrough to mechanically interlock with the composite material. Also, a process comprises formi... | 08/02/1988 |
| 4754243 | Microwave component mounting A method of making a microwave semiconductor component and concurrently forming therewith a mounting membrane adapted for positioning the semiconductor component in an RF transmission medium such as a waveguide. Substantially concurrently with the deposit... | 06/28/1988 |
| 4734819 | Decoupling capacitor for surface mounted leadless chip carrier, surface mounted leaded chip carrier and pin grid array package Several embodiments of a decoupling capacitor are described which incorporate at least one multilayer capacitive element and which utilize metallized dielectric (i.e., ceramic) substrates rather than a pair of conductors. Also, several types of multilayer... | 03/29/1988 |
| 4727246 | IC card An IC card comprises a core member having an integrated circuit pellet storing portion made of an insulating material and defined by an opening of a predetermined shape, a plurality of conductive metal foils each having one end at which integrated circuit... | 02/23/1988 |
| 4709122 | Nickel/indium alloy for use in the manufacture of a hermetically sealed container for semiconductor and other electronic devices This invention relates to a new and improved hermetically sealed container for semiconductor and other electronic devices, to a novel sealing cover for use in fabricating the above-referenced hermetically sealed container, and to novel processes for manuf... | 11/24/1987 |
| 4682207 | Semiconductor device including leadless packages and a base plate for mounting the leadless packages A semiconductor device includes a plurality of leadless packages and a base plate for mounting the leadless packages. The leadless packages include a semiconductor chip housed therein and a plurality of electrodes formed on the surface thereof. The base p... | 07/21/1987 |
| 4661653 | Package assembly for semiconductor device Disclosed herein is a package assembly for a semiconductor device or devices. The package assembly has a ceramic package body and at least one ceramic cover plate. The package body has a circular outer periphery provided with a plurality of projections to... | 04/28/1987 |
| 4656385 | Housing having grooves therein for mounting a piezoelectric ladder filter A filter of the ladder type has an elongated hollow casing with an aperture at one axial end face and at least two grooves on the inner surface at at least two different positions around the inner periphery thereof and which extend parallel to the longitu... | 04/07/1987 |
| 4639759 | Power transistor module A power transistor module includes a housing having a frame forming a housing wall and a ceramic plate fastened to the frame forming a housing bottom, structured metallizations disposed on the ceramic plate forming conductor runs and terminal pads, compon... | 01/27/1987 |
| 4636580 | Static converter module with mounting lugs In this static converter module, which is equipped with thyristors, diodes or power transistors, mounting lugs (4,11) having mounting holes (5,6,12,13) are used for mounting the module on a heat sink. The housing of the module is essentially formed by a f... | 01/13/1987 |
| 4629824 | IC package sealing technique An IC package with an improved seal includes a sealant penetrator in the form of a projection on each lead for penetrating the provided seal. In a preferred embodiment the penetrator is a semi-circular projection formed on the lead which penetrates the se... | 12/16/1986 |
| 4622433 | Ceramic package system using low temperature sealing glasses In accordance with the preferred embodiments of the invention, provided is a hermetic ceramic/glass enclosure for encapsulating semiconductor components which reduces the internal cavity moisture and contamination levels, has a stronger package seal and a... | 11/11/1986 |
| 4577056 | Hermetically sealed metal package The present invention is directed to a hermetically sealed package adapted to form an enclosure for a semiconductor device. The package comprises a substrate with a refractory oxide layer on one surface and a metallized band on the refractory oxide layer.... | 03/18/1986 |
| 4560827 | Electric fencer utilizing a sealed plastic housing The electric fencer includes two plastic components having an interfitting groove and rib, as well as integral pins on one component which are pressed into recesses in the other component. The two components are sonically welded together to form a complet... | 12/24/1985 |
| 4560826 | Hermetically sealed chip carrier A device for producing a hermetically sealed chip carrier is taught. Briefly stated, a sealing or perimeter ring is formed on a substrate with an appropriate lead pattern and IC chip contained within this ring. Vias or ducts are disposed in the substrate ... | 12/24/1985 |
| 4558171 | Hermetic enclosure for electronic components with an optionally transparent cover and a method of making the same The present invention deals with an improved hermetic enclosure impervious to moisture, suitable for single or multiple chips. The enclosure is sealable at a low temperature safe for the enclosed electronic components. In particular, the enclosure employs... | 12/10/1985 |
