Quotables
"It is my heart-warmed and world-embracing Christmas hope and aspiration that all of us, the high, the low, the rich, the poor, the admired, the despised, the loved, the hated, the civilized, the savage (every man and brother of us all throughout the whole earth), may eventually be gathered together in a heaven of everlasting rest and peace and bliss, except the inventor of the telephone. "
Mark Twain ; Christmas greetings, 1890
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| Number | Title | Issue Date |
| 7364949 | Semiconductor device package A semiconductor package that includes two circuit boards and at least one semiconductor device which is disposed between the two circuit boards and connected to external connectors disposed on at least one of the circuit boards. ... | 04/29/2008 |
| 7321165 | Semiconductor device and its manufacturing method In a semiconductor device in which a plurality of substrates each mounting a semiconductor chip are stacked, one ends of the leads formed on the substrates are connected to the semiconductor chip and the other ends thereof are connected to connection terminals of th... | 01/22/2008 |
| 7312529 | Structure and method for producing multiple size interconnections An electrical structure and method comprising a first substrate electrically and mechanically connected to a second substrate. The first substrate comprises a first electrically conductive pad and a second electrically conductive pad. The second substrate comprises ... | 12/25/2007 |
| 7288729 | Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring l... | 10/30/2007 |
| 7285734 | Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring l... | 10/23/2007 |
| 7227086 | Semiconductor chip package having an adhesive tape attached on bonding wires The invention provides a semiconductor chip package, and a means of forming such a semiconductor chip package, in which one or more semiconductor chips are electrically connected to a mounting substrate by wire bonding in which an adhesive tape is provided on the ac... | 06/05/2007 |
| 6239367 | Multi-chip chip scale package A multi-chip chip scale package. The package has a film carrier whereby two chips with different sizes can be disposed on the same film carrier. A flip chip technique is used to arrange each chip on each side of the film carrier face to face. A bump is fo... | 05/29/2001 |
| 4864470 | Mounting device for an electronic component A surface acoustic wave (SAW) device is mounteed in such a manner that its functional surface faces a base plate and a space is formed therebetween to avoid inferiority in device characteristics. Electrodes of the SAW device and bumps formed on electrodes... | 09/05/1989 |
| 4814855 | Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape Automated bonding of chips to tape and formation of bonding structures on Tape Automated Bonding (TAB) packaging structures are provided with bonding balls on the ends of beams leads of the TAB tape. Also balltape bonding balls are aligned on stacked TAB ... | 03/21/1989 |
| 4756080 | Metal foil semiconductor interconnection method A single layer copper foil tape is provided having a center core and connected lead beams. Etched apertures are formed to separate adjacent lead beams and to form relatively high strength foil straps connecting edge portions of the foil tape and the cente... | 07/12/1988 |
| 4684975 | Molded semiconductor package having improved heat dissipation An improved metal tape for tape automated bonding provides for enhanced heat dissipation from the packaged semiconductor device. The invention includes two aspects. In the first aspect, individual metal tape leads are extended inward beyond the peripheral... | 08/04/1987 |
| 4630096 | High density IC module assembly An electronic module having a high density of silicon IC chips is provided by mounting the chips in tapered through-holes in a silicon substrate, filling the edge gaps between the chips and the substrate with a glass so that the chips, the filler glass, a... | 12/16/1986 |
| 4552267 | Ceramic semiconductor package chip prevention structure and method A hermetic ceramic semiconductor package is provided with impact absorbing bumpers by applying a composition of sealing glass loaded with malleable metal particles to the ceramic package. The bumpers are applied to the ceramic parts when they are being co... | 11/12/1985 |
| 4486945 | Method of manufacturing semiconductor device with plated bump This invention relates to a method for manufacturing a resin molded semiconductor device. According to the manufacturing method of this invention, at first an insulation film with openings at bump formed positions is applied on a semiconductor wafer havin... | 12/11/1984 |
| 4143508 | Electronic circuit block An electronic circuit block for use in a timepiece comprising a circuit substrate with component-receiving portions, circuit components mounted on the component-receiving portions with terminals at the same level with the upper surfaces of the circuit com... | 03/13/1979 |
| 4056681 | Self-aligning package for integrated circuits A self-aligning integrated circuit package includes an integrated circuit die having raised contact pads mounted to an interconnecting die in flip chip fashion. The interconnecting die is formed of anodizable material and has raised anodized portions that... | 11/01/1977 |
| 4007479 | Fixture for an integrated circuit chip A fixture for a segment of a film strip having a flexible beam lead frame mounted on the segment and an integrated circuit chip bonded to inner portions of the leads of the lead frame. The fixture is provided with an aperture so that when a segment is hel... | 02/08/1977 |
