...that the inventor of the electric motor was a blacksmith named Thomas Davenport? Described as "a brilliantly unsuccessful inventor", Davenport invented the first rotary electric motor. In 1836 he headed out -- on foot -- from his Vermont home to file a patent application at the Patent Office in Washington, D.C. By the time he got there, he had squandered away his money and couldn't afford the $30 filing fee so he turned around and went home. When he later mailed in his application with money he'd raised, the Patent office was destroyed in a fire. He did finally get credit for his invention on Feb. 5, 1837.
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7351921 | Assembly for a microstimulator An electrode assembly includes an electrode electrically connected to a capacitor with a wire. An assembly carrier may be used to hold and secure at least the wire and capacitor during assembly. A method of assembly for attaching a wire to a capacitor and an electro... | 04/01/2008 |
| 7265991 | Housing cage for holding built-in modules A housing cage (1) comprising walls (2) defining sides of the housing cage and having wall sections (3). A plurality of contact surfaces (4), each of which is connected to one of said wall sections, are arranged so as to support built-in ... | 09/04/2007 |
| 7230515 | Package for parts for LAN and pulse transformer module for LAN A resin-made base body 1 has first recessed portions 11 and 12 for respectively accommodating a plurality of pulse transformers as well as second recessed portions 13 and 14 for accommodating common mode choke coils which are respe... | 06/12/2007 |
| 4864079 | Electrical components and assemblies A surface-mounted electrical component has rectangular section leads that project outwardly from the edges of the component body. The leads are bent down towards the surface of the substrate and are twisted through 90 degrees about their length to make th... | 09/05/1989 |
| 4829669 | Method of manufacturing a chip carrier A method of manufacturing a chip carrier having the J-shaped leads extending from the lateral sides of the enclosure of the chip carrier with the end facing the bottom of the enclosure is disclosed. The leads first extending laterally is made to have a ci... | 05/16/1989 |
| 4698660 | Resin-molded semiconductor device A resin-molded semiconductor package device includes a plurality of grooves which are spaced a predetermined distance from each other in the edge portions defined by the main surface and the side surfaces of the main body of a resin-molded package, which ... | 10/06/1987 |
| 4698663 | Heatsink package for flip-chip IC A semiconductor device comprises a substrate, a semiconductor element mounted on the substrate, a cap having an opening smaller than the external size of the semiconductor element for covering the semiconductor element to provide a hermetic seal, and a he... | 10/06/1987 |
| 4691225 | Semiconductor device and a method of producing the same A semiconductor device comprising a package base whose material is glass epoxy or the like, a plurality of leads which are formed in a manner to extend from the front surface to the rear surface of the package base, a semiconductor element which is fasten... | 09/01/1987 |
| 4684975 | Molded semiconductor package having improved heat dissipation An improved metal tape for tape automated bonding provides for enhanced heat dissipation from the packaged semiconductor device. The invention includes two aspects. In the first aspect, individual metal tape leads are extended inward beyond the peripheral... | 08/04/1987 |
| 4656499 | Hermetically sealed semiconductor casing An improved hermetically sealed semiconductor casing and a process for producing the casing are disclosed. This casing includes a lead frame having an electrical device affixed thereto. A base member is glass bonded to a matching surface of the lead frame... | 04/07/1987 |
| 4626958 | Decoupling capacitor for Pin Grid Array package High frequency noise is decoupled from power supplied to a Pin Grid Array (PGA) package by insertion of a decoupling capacitor between the PGA package and printed circuit board. The decoupling capacitor comprises a dielectric material sandwiched between a... | 12/02/1986 |
| 4594770 | Method of making semiconductor casing A casing for an electrical component comprises a metal lead frame having the electrical component connected thereto. A metal base member is bonded to one surface of the lead frame. A plastic housing member is bonded to a second surface of the lead frame. ... | 06/17/1986 |
| 4549247 | Carrier element for IC-modules A carrier element for IC modules, whereby several leads are arranged on a carrier film, which leads are each connected at one end with a terminal of the module and run into a contact surface at the other end. Whereas the contact surfaces are arranged on t... | 10/22/1985 |
| 4495376 | Carrier for integrated circuit A carrier having a plurality of leads extending from the lateral sides thereof. The leads extending along the lateral side and over protuberances into depressions in the bottom of the carrier. Each of the depressions is separated by ribs from the other de... | 01/22/1985 |
| 4465898 | Carrier for integrated circuit A carrier having a plurality of leads extending from the lateral sides thereof. The leads extend along the lateral side and over protuberances into depressions in the bottom of the carrier. Each of the depressions is separated by ribs from the other depre... | 08/14/1984 |
| 4463217 | Plastic surface mounted high pinout integrated circuit package A surface mounted integrated (IC) device package or carrier is disclosed suitable for accommodating large terminal count IC devices in a small space. A carrier, preferably of plastic, is disclosed having notches or castillations in its sides. A first row ... | 07/31/1984 |
| 4330683 | Encapsulation for semiconductor device A semiconductor encapsulation of the chip carrier type has a collar-like protective housing member which encompasses the periphery of the chip carrier from which external lead members protrude. The protective housing member has a mating surface with a por... | 05/18/1982 |
| 4236065 | Self-regulating electric heater A self-regulating electric heater particularly useful for heating compressor lubricant and the like is disclosed in which a cylindrical body of electrically insulative ceramic is formed with an axially extending generally parallelepiped shaped slot in com... | 11/25/1980 |
| 4185163 | Housing assembly for an electromagnetic relay A housing assembly for an electromagnetic relay with open ended box-like housing members telescopable one into the other to form a six sided housing. The inner housing is sealed to the outer housing by a sealing compound positioned at, at least the periph... | 01/22/1980 |
| 4012766 | Semiconductor package and method of manufacture thereof An improved plastic package and method of manufacture thereof for use in packaging integrated circuit semiconductor devices and the like. A transfer molded package having the lead frame disposed therein is formed having an opening therethrough. The device... | 03/15/1977 |
| 3990395 | Apparatus for forming insulating material over an electrode can An apparatus for forming an electrically insulating semi-cured or cured in situ polymer containing material over a surface of an electrode can of an electrical device. The apparatus includes an applicator forming a film of curable polymer containing mater... | 11/09/1976 |
| 3964009 | AC radiation choke insulator An A.C. anti-radiation choke coil for a device such as a television set is inserted in a metal can and positioned and insulated therein by a hinged container of insulating material that closely encloses the choke coil; each section of the hinged container... | 06/15/1976 |
| 3943623 | Hollow cavity package electronic unit A method of assembling split, hollow package sections housing an electronic element, having an internal lead wire and having external lead wires extending outwardly therefrom, wherein the package sections are adhesively secured together with external lead... | 03/16/1976 |