Celebrity Inventors
Mark Twain (Samuel L. Clemens) received Patent No. 121,992 for "An Improvement in Adjustable and Detachable Straps for Garments." He later received two more patents: one for a self-pasting scrapbook and one for a game to help players remember important historical dates.
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| Number | Title | Issue Date |
| 7351921 | Assembly for a microstimulator An electrode assembly includes an electrode electrically connected to a capacitor with a wire. An assembly carrier may be used to hold and secure at least the wire and capacitor during assembly. A method of assembly for attaching a wire to a capacitor and an electro... | 04/01/2008 |
| 4866566 | Capacitor network A capacitor network mounted to an input-output unit of a computer for eliminating noises, which disposes on one surface of a dielectric substrate a plurality of electrodes and on the other surface of the same at least one common electrode opposite to the ... | 09/12/1989 |
| 4851611 | Device for the external connection of electrical cables of a container body A device for the external connection of electrical cables electrically connected to component elements disposed within a container body comprising ordered housing means through which pass these cables which extend out of the container body.... | 07/25/1989 |
| 4809054 | Semiconductor lead frame A semiconductor lead frame suitable for making electronic components from semiconductor chips. The lead frame is of one-piece construction and is provided with a pair of spaced outer side strips and a plurality of spaced cross strips integral with and spa... | 02/28/1989 |
| 4797787 | Lead frame and electronic device A lead frame and an electronic device incorporating the lead frame wherein the lead frame includes a chip support and a plurality of leads arranged around the chip support with each of the plurality of leads having one end disposed proximate to the chip s... | 01/10/1989 |
| 4780572 | Device for mounting semiconductors A device containing a semiconductor element having a substrate a cap over the substrate with a glass layer formed between the cap and the substrate providing a seal therebetween. Electrically conducting terminal members extend through the glass layer and ... | 10/25/1988 |
| 4764848 | Surface mounted array strain relief device An electrical assembly having an integrated circuit package which has a plurality of electrical conductors fixed thereto. The electrical conductors form mechanical and electrical connections. Each of the electrical conductors has a root at one end and a t... | 08/16/1988 |
| 4763223 | Non-soldered lead apparatus An apparatus including terminals for electronic devices such as display units or the like. The terminals are hermetically sealed into the structure of the electronic device during the assembly thereof. The terminal includes a bent, resilient end portion a... | 08/09/1988 |
| 4737884 | Semiconductor device module A semiconductor device module includes a package and a holder, the package includes, for example, a central processing unit, and the holder accommodates a removable leadless chip carrier. The holder comprising contact leads connected to electrode pads of ... | 04/12/1988 |
| 4722914 | Method of making a high density IC module assembly An electronic module having a high density of silicon IC chips is provided by mounting the chips in tapered through-holes in a silicon substrate, filling the edge gaps between the chips and the substrate with a glass so that the chips, the filler glass, a... | 02/02/1988 |
| 4722027 | Hybrid circuit device In a hybrid circuit device comprising a base plate on which a circuit including coils is provided, and a flat package of integrated circuit having a smaller flat area than that of the base plate, the flat package and base plate are superimposed upon each ... | 01/26/1988 |
| 4703393 | Mounting structure of flat-lead package-type electronic component A mounting structure of a flat-lead package-type electronic component wherein ends of lead terminals drawn out from a surface of a package are bent to be horizontal with respect to the plane of the package and other portions of said lead terminal are tilt... | 10/27/1987 |
| 4688150 | High pin count chip carrier package A semiconductor chip carrier system has a printed circuit board supporting a plurality of ceramic carrier packages in rows and columns; each package has a plurality of flexible electrical conductive connection pads. A plurality of pressure exerting retain... | 08/18/1987 |
| 4673967 | Surface mounted system for leaded semiconductor devices An improved surface mounted system for leaded semiconductor devices has J-shaped device leads soldered to respective portions of circuit pads on a printed circuit board, each lead having inner and outer surfaces of the J-shape covered with solder dewettin... | 06/16/1987 |
| 4656442 | Hybrid circuit device A hybrid circuit device comprising a flat package incorporating an integrated circuit therein, and a delay line circuit constituted by a plurality of coils and a plurality of capacitors. A base plate supporting the delay line circuit is disposed on the fl... | 04/07/1987 |
| 4460825 | Carrier element for an IC module A carrier element for an IC module (integrated circuit) comprising leads which are connected at one end with the corresponding terminals of the module and at the other end have a contact surface. The ends of the leads running into the contact surfaces ext... | 07/17/1984 |
| 4408218 | Ceramic chip carrier with lead frame having removable rim A ceramic chip carrier having a copper lead frame bonded directly to a ceramic substrate has a common rim connecting the tip portions of the leads. The rim is provided with extended portions which permit bending the rim away from the substrate without alt... | 10/04/1983 |
| 4363076 | Integrated circuit package An Integrated Circuit Package in which integrated circuit (I.C.) chips having flexible beam leads, the inner lead bond sites of which are bonded to input/output (I/O) terminals on the active faces of the chips, are mounted active face down on a surface of... | 12/07/1982 |
| 4330683 | Encapsulation for semiconductor device A semiconductor encapsulation of the chip carrier type has a collar-like protective housing member which encompasses the periphery of the chip carrier from which external lead members protrude. The protective housing member has a mating surface with a por... | 05/18/1982 |
| 4258411 | Electronic device packaging arrangement The subject electronic device packaging arrangement is designed to enhance heat transfer from an electronic device to the printed circuit board to which it is attached. This is accomplished by employing a thermally conductive base having a depression in t... | 03/24/1981 |
| 4249196 | Integrated circuit module with integral capacitor The disclosure is of an integrated circuit assembly comprising a base which carries an integrated circuit chip and a cover which protects the chip. The cover has embedded therein a capacitor which has its two leads connected to, or in contact with, two le... | 02/03/1981 |
| 4012835 | Method of forming a dual in-line package A lead frame assembly of indefinite length having a pair of spaced parallel carrier strips, collapsible rungs extending between the strips at regular intervals along the length of the assembly and a number of leads extending inwardly from the opposed edge... | 03/22/1977 |
| 3941915 | Switch receptacle A receptacle for wired push-button switches used to actuate appliances adapted for inclusion in walls under construction, having an elongated tubular body; a removable plug disposed in one end of the body, the plug having an aperture adapted to accept wir... | 03/02/1976 |
