U.S. patents available from 1976 to present.
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Patent No. 6060700

Microwave Oven With Removable Storage Cassette in Dashboard of Motor Vehicle

A microwave oven adapted for use within a motor vehicle dashboard area. The microwave oven has a removable storage cassette, and slidable platforms for securing and serving containers of beverages and foods.

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Class 174/554 - Sealing ring


Subclass of Class 174 - Electricity: conductors and insulators
Definition: Subject matter wherein the elongated terminals are encircled
No. of patents: 22
Last issue date: 03/06/2012


NumberTitleIssue Date
8129632Portable electronic device
In order to provide a portable electronic device improved in water tightness by a simple method, the portable electronic device includes: a housing assembled from a plurality of housing pieces via a sealing member and having a built-in electronic circuit; and a flat...
03/06/2012
8106312Sealing structure, electronic device, sealing method, gasket, and manufacturing method thereof
A sealing structure to seal housings includes a sealing member disposed between housings to be bonded to allow penetration of at least one signal line; and an adhesive material disposed between the signal lines penetrating the sealing member to bond the signal lines...
01/31/2012
7370988In-grade light fixture housing and hydrological barrier plate for use therein
A hydrological barrier plate for in-grade light fixture housings and a housing for use with light fixtures to prevent water entry into the water sensitive compartments of the light fixture. The barrier plate has a plate body with an opening in which is sealably disp...
05/13/2008
6627814Hermetically sealed micro-device package with window
A method for manufacturing a cover assembly including a transparent window portion and a frame that can be joined to a micro-device package base to form a hermetically sealed micro-device package. First, a frame is provided having a continuous sidewall de...
09/30/2003
4862323Chip carrier
A chip carrier and a process of assembling a chip carrier are disclosed. The carrier used for mounting a chip comprises a copper or copper base alloy component having a thin refractory oxide layer on a surface thereof. The surface and the oxide layer have...
08/29/1989
4855808Hermetic glass chip carrier
A hermetically sealed glass chip carrier includes an outer glass ring and an inner glass base in which leads to the inner glass base pass between the ring and the base, with the ring, base and leads being sealed together by melting the glass in the vicini...
08/08/1989
4775916Pressure contact semiconductor device
A pressure contact semiconductor device has a semiconductor substrate disposed on a metal post electrode through metal electrode plate, an insulating ring engaged with the periphery of the metal post electrode extends to the periphery of the metal electro...
10/04/1988
4750031Hermetically sealable package for hybrid solid-state electronic devices and the like
A small component package employing a ring frame 11 of a mouldable polyamide-imide thermoplastic directly moulded onto a heat conducting base plate 10 with integral moulded anchoring pins of the thermoplastic material engaging corresponding bores 21 and 2...
06/07/1988
4746583Ceramic combined cover
A combination ceramic sealing cover for a semiconductor package has a flat ceramic lid member with metallization applied as a foundation for a seal ring or frame portion. On the metallized layer is a gold-tin solder layer, in the form of either a solder r...
05/24/1988
4742182Flatpack for hermetic encapsulation of piezoelectric components
A flatpack package for hermetic encapsulation of piezoelectronic components, which flatpack is suitable for use in efficient and automated surface mounting (SMT). The flatpack package consists of a base plate, a cover plate and a mounting unit of two supp...
05/03/1988
4727410High density integrated circuit package
A multifaceted package is disclosed that permits VLSI and VHSIC integrated circuits in the form of integrated circuit die or chip carries to be mounted on the faces of the package to form a high-density circuit package. The package comprises a plurality o...
02/23/1988
4630096High density IC module assembly
An electronic module having a high density of silicon IC chips is provided by mounting the chips in tapered through-holes in a silicon substrate, filling the edge gaps between the chips and the substrate with a glass so that the chips, the filler glass, a...
12/16/1986
4609937Power semiconductor device with O-ring seal
A power semiconductor device dispensed with soldering and useful for fork lifts and etc., wherein at least one O-ring is provided between the inner wall of case housing at least one semiconductor element structure and outer periphery of a member disposed ...
09/02/1986
4490614Housing for an ionization detector array in a tomographic scanner
An improved housing construction for electrical apparatus is disclosed, the housing having particular utility as a housing suitable for an ionization detector array of a tomographic X-ray scanner. The housing comprises at least two mating sections which, ...
12/25/1984
4423467Connection array for interconnecting hermetic chip carriers to printed circuit boards using plated-up pillars
The invention comprises a connection array for establishing a plurality of electrical connections between circuit pads of a support, such as a circuit board, and contacts of an electrical housing, such as a hermetic chip carrier, wherein the contacts comp...
12/27/1983
4410874Large area hybrid microcircuit assembly
A ceramic substrate includes a multiplicity of alternately screened and fired conductor and dielectric levels, with interconnections between levels through small via holes in the dielectric layers or alternately by means of crossovers. Thick film resistor...
10/18/1983
4167413Making hybrid IC with photoresist laminate
A hybrid integrated circuit package and a method for fabricating the package. The package comprises a ceramic substrate having a blank metallization and feedthroughs screen printed thereon. A ceramic seal ring is joined to the substrate to form the side w...
09/11/1979
4117449Fluid resistant geophone and cable enclosure
A rigid, fluid resistant enclosure adapted to encase a geophone electrically connected to a cable including a housing having an open end in and inner walls defining a cavity adapted to receive a geophone encapsulated in a fluid tight membrane or boot, whi...
09/26/1978
4109818Hermetic sealing cover for a container for semiconductor devices
A hermetic sealing-cover unit for a container for semiconductor devices is fabricated by applying to the cover a solution of a thermosetting plastic material in a drying solvent to form a thin plastic coating on the cover. The solution preferably is a 10%...
08/29/1978
4008486Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring
A compression-assembled device has similar pole pieces which are electrically insulated from one another by an outer insulation ring and, in operation, press against the opposing surfaces of a semiconductor device. The base of the insulation ring is secur...
02/15/1977
3993938Electrical component hermetic enclosure
A hermetic enclosure for an electrical component, particularly for a tantalum capacitor, and a method of forming it is disclosed. A silver container is provided having an open end at which an outwardly protruding flange is formed. A quantity of sealing gl...
11/23/1976
3940787Mounting for locking disc shaped semiconductor element in a housing
An assembly composed of a disc-shaped semiconductor component mounted on a support disc and disposed in an annular ceramic housing, with the support disc resting on a first contacting disc, a second contacting disc resting on the component, and an insulat...
02/24/1976
 
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