Did You Know...
...Chester Carlson was a patent agent who tired of having to make multiple copies of patent applications using the only duplication method available at the time: carbon paper. In 1959 he came up with a new copying system and took it to IBM for evaluation. The "experts" at IBM determined potential sales to be only 5,000 units because people wouldn't want to use a bulky machine when they had carbon paper. Carlson's invention was the xerography process, the company founded on the system is Xerox.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7239008 | Semiconductor apparatus and method for fabricating the same A semiconductor apparatus includes a semiconductor pellet having electrodes thereon; a plurality of lead terminals, which electrically connect the electrodes of the semiconductor pellet to terminals formed on a substrate; and a molding member, which is filled around... | 07/03/2007 |
| 7126213 | Rectification chip terminal structure A rectification chip terminal structure for soldering a rectification chip on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circuit board. The structure includes a conducti... | 10/24/2006 |
| 4727246 | IC card An IC card comprises a core member having an integrated circuit pellet storing portion made of an insulating material and defined by an opening of a predetermined shape, a plurality of conductive metal foils each having one end at which integrated circuit... | 02/23/1988 |
| 4698660 | Resin-molded semiconductor device A resin-molded semiconductor package device includes a plurality of grooves which are spaced a predetermined distance from each other in the edge portions defined by the main surface and the side surfaces of the main body of a resin-molded package, which ... | 10/06/1987 |
| 4642419 | Four-leaded dual in-line package module for semiconductor devices A four-leaded dual in-line package is disclosed in which a rectangular insulation housing carries a semiconductor device therein which is connected to flat lead frame elements which extend out through the opposite sides of the insulation housing and defin... | 02/10/1987 |
| 4549036 | Circular integrated circuit package A circular integrated circuit package which allows a large number of internal and external connections to be made to an integrated circuit chip by arranging the pin connections as rings of concentric circles. This arrangement provides the highest possible... | 10/22/1985 |
| 4518818 | Encapsulating case able to resist high external pressures An encapsulating case or box for hybrid circuits, able to operate in highly pressurized atmosphere, the components of the hybrid circuit being not subject to the action of pressure. For this purpose, said circuit is enclosed in a case taking the plane of ... | 05/21/1985 |
| 4445271 | Ceramic chip carrier with removable lead frame support and preforated ground pad A ceramic chip carrier having a lead frame thereon with a removable lead frame support which does not bond to the ceramic during the bonding procedure and is later removed. A perforated ground pad is bonded to the substrate simultaneously with the leads o... | 05/01/1984 |
| 4396936 | Integrated circuit chip package with improved cooling means An integrated circuit package in which an integrated circuit chip having flexible beam leads, the inner lead bonding sites of which are bonded to input and output terminals on the active face of the chip, is mounted active face down on the top surface of ... | 08/02/1983 |
| 4180161 | Carrier structure integral with an electronic package and method of construction A carrier structure for electronic components which allows safe handling, testing, marking and shipment is fabricated as an integral part of the electronic component package. The carrier forms a square protective enclosure surrounding the electronic devic... | 12/25/1979 |
| 3984739 | Structure for packaging integrated circuits An integrated circuit package structure wherein electrodes of an integrated circiut chip are directly bonded to metal lead members within the package. A portion of the substrate is enclosed inside the package to support the package. Holes are provided on ... | 10/05/1976 |
| 3964009 | AC radiation choke insulator An A.C. anti-radiation choke coil for a device such as a television set is inserted in a metal can and positioned and insulated therein by a hinged container of insulating material that closely encloses the choke coil; each section of the hinged container... | 06/15/1976 |
