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...that the first rickshaw was invented in 1869 by an American Baptist minister, the Rev. E. Jonathan Scobie, to transport his invalid wife around the streets of Yokohama?
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| Number | Title | Issue Date |
| 7439452 | Multi-chip module packaging with thermal expansion coefficiencies In a transfer-mold configuration of an automotive electronic control unit, the thermal expansion coefficient of the circuit board is made apparently equal to that of the base member to suppress excessive stresses between them. The circuit board and the base member a... | 10/21/2008 |
| 7394029 | Module, method of manufacturing module, and electronic apparatus using module A module includes a circuit board, a first terminal on a lower surface of the circuit board, a first electronic component on an upper surface of the circuit board, a first cover made of metal covering the first electronic component, a second electronic component on ... | 07/01/2008 |
| 7365438 | Semiconductor device with semiconductor components connected to one another The present invention relates to a semiconductor device which provides a shortest possible connection between two semiconductor components 10a and 10b arranged in a manner lying opposite on a substrate 2. The two semiconductor comp... | 04/29/2008 |
| 7335522 | Package structure for light emitting diode and method thereof A package structure of a light emitting diode includes a substrate structure, a connection layer, and at least one conductive passage. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The insulation layer... | 02/26/2008 |
| 7335926 | Package structure for light emitting diode and method thereof A package structure of a light emitting diode includes a substrate structure, a connection layer, and at least one conductive passage. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The insulation layer... | 02/26/2008 |
| 7326062 | System and method for increasing the surface mounting stability of a lamp In one embodiment, an LED is constructed with its entire contact structure stamped and inserted into the molded lamp as a single structure. A portion of the contact structure is imbedded in the molded lamp such that the bottom surface of the contacts do not extend b... | 02/05/2008 |
| 7253365 | Die package for connection to a substrate A die carrier for holding a die, such as a microdisplay die, may be electrically connected to a substrate by pressing the substrate against flexible, resilient leads of the die carrier. The package includes a housing and a shroud mounted to the housing. The substrat... | 08/07/2007 |
| 6670550 | Underfill coating for LOC package A LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. An underfill material is introduced between each lead finger and semiconductor die, extending from the bonding location of the die and the edge of the... | 12/30/2003 |
| 6643134 | Holding and heat dissipation structure for heat generation part In a holding and heat dissipation structure for a heat generation part for dissipating heat generated from the heat generation part having lead portions protruded from the main body thereof are soldered at a main substrate, a terminal plate is disposed at... | 11/04/2003 |
| 6632996 | Micro-ball grid array package tape including tap for testing A package tape for testing a chip assembled by a packaging method such as a micro-ball grid array (BGA) package, whereby the chip is designed to face downward. The package tape includes one or more taps, disposed on a guard area other than an area where a... | 10/14/2003 |
| 6242694 | Package for housing a photosemiconductor device A package for housing a photosemiconductor including a plurality of united-inner/outer-portions type leads each of which has an inner lead portion and an outer lead portion continuously formed into one body; a conductive frame having a side wall and an op... | 06/05/2001 |
| 6242797 | Semiconductor device having pellet mounted on radiating plate thereof A semiconductor device having a pellet mounted on a radiating plate thereof is disclosed. The radiating plate is formed in such a shape that a central portion thereof is positioned higher than both end portions thereof. A pellet is mounted on a lower face... | 06/05/2001 |
| 6195257 | Apparatus and method of adapting a rectifier module to enhance cooling A module mount for use in electrically and mechanically mounting an encapsulated power rectifier module, having a plurality of rigid leads protruding from a major mounting surface thereof, in an orientation in which the major mounting surface is substanti... | 02/27/2001 |
| 4866566 | Capacitor network A capacitor network mounted to an input-output unit of a computer for eliminating noises, which disposes on one surface of a dielectric substrate a plurality of electrodes and on the other surface of the same at least one common electrode opposite to the ... | 09/12/1989 |
| 4864470 | Mounting device for an electronic component A surface acoustic wave (SAW) device is mounteed in such a manner that its functional surface faces a base plate and a space is formed therebetween to avoid inferiority in device characteristics. Electrodes of the SAW device and bumps formed on electrodes... | 09/05/1989 |
| 4857940 | Molded article with exposed, confined leads, and process for making A molded article containing an electrical element buried therein has at least two leads, and portions of the leads are left exposed. The article is improved in that all of the leads are left confined within the confines of the article, the exposed portion... | 08/15/1989 |
| 4855869 | Chip carrier A chip carrier including a substrate having a plurality of pads formed on the upper and lower surfaces thereof and wirings to connect the pads. The chip carrier also includes an integrated circuit chip having a plurality of leads connected to correspondin... | 08/08/1989 |
| 4855868 | Preformed packaging arrangement for energy dissipating devices A packaging arrangement for energy dissipating devices includes thermal elements adjacent first and second sides of the device, and a heat-flow modifier adjacent the thermal element for regulating the flow of heat therefrom. A plurality of electrically co... | 08/08/1989 |
| 4852250 | Hermetically sealed package having an electronic component and method of making Forming a body of insulating material with a shelf and an opening therethrough with a plurality of electrical conductors extending from the shelf to the exterior of the body. A plurality of tape automated bounding leads are placed in the opening in which ... | 08/01/1989 |
| 4820658 | Method of making a packaged IC chip A lead frame for use with an integrated circuit chip comprises a plurality of lead frame segments, each segment comprising a plurality of leads the inner ends of which converge towards a pad area for the chip encircled by the segments.... | 04/11/1989 |
| 4818821 | Brazed leaded package A brazed leaded package is provided having buried brazed areas thereby eliminating the need of subsequent protective plating of the brazed areas. The package has a heat conductive support which supports a plurality of leads. The distal end of the leads te... | 04/04/1989 |
| 4816426 | Process for manufacturing plastic pin grid arrays and the product produced thereby A process for forming an integral circuit pin grid array package comprising a flexible metal tape adapted for use in tape automated bonding with a plurality of holes. Terminal pins are inserted in the holes and the tape and pins are disposed within a mold... | 03/28/1989 |
| 4804805 | Protected solder connection and method Solder in a connection is kept from melting when applying an outer protective layer of high melting point plastic by first applying an inner layer of low melting point plastic.... | 02/14/1989 |
| 4796239 | Circuit unit for timepiece and process for fabricating the same A circuit unit including a plurality of lead frames which are made of a metal sheet and one of which is used for die-bonding an integrated circuit. The die-bonding lead member is formed to have at least a generally H-shaped portion constructed of a pair o... | 01/03/1989 |
| 4796080 | Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate A semiconductor chip package configuration and a method are disclosed for facilitating testing of the chip package and mounting of the chip package on a substrate by forming one or more lead alignment bars in interconnecting relation with adjacent leads o... | 01/03/1989 |
| 4792880 | Terminal module A terminal module provides for attaching components to terminals of a terminal frame. The terminal module utilizes an integral printed circuit board having a component assembly potted within a rectangular plastic shell with the remaining portion of the pr... | 12/20/1988 |
| 4788583 | Semiconductor device and method of producing semiconductor device A semiconductor device has such a construction that free tip ends of stage bars extending from a stage do not extend to side surfaces of a resin package, and the resin package is constituted by an inner resin package portion and an outer resin package por... | 11/29/1988 |
| 4772761 | Sealed electrical components and method of making same An electrical component (20) comprises electrical circuit means (22) and housing member (50) disposed over a first portion (24) of the electrical circuit means (22). The circuit means (22) has a second portion (30) extending outwardly from the housing mem... | 09/20/1988 |
| 4769795 | Method of making an underwater electroacoustic transducer with long-lasting high leakage resistance The insulation resistance between the electroded surfaces of an underwater transducer and the water within which the transducer is immersed is greatly improved by coating the electroded surface of the transducer with a layer of air-free, high-resistance w... | 09/06/1988 |
| 4763409 | Method of manufacturing semiconductor device A method of manufacturing a semiconductor device employing a film carrier tape during process steps thereof is disclosed. Any test pad is not provided in the film carrier tape. Therefore, the semiconductor element carried in the film is cut at the leads a... | 08/16/1988 |
| 4761518 | Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs A semiconductor casing is formed of a ceramic-glass-metal composite material with a leadframe embedded in a base component. The leadframe may include holes therethrough to mechanically interlock with the composite material. Also, a process comprises formi... | 08/02/1988 |
| 4751482 | Semiconductor integrated circuit device having a multi-layered wiring board for ultra high speed connection This invention relates to an ultra high speed semiconductor integrated circuit device, and in particular to a layout and connecting structure between lead terminals of a package and signal pads on a chip. The device includes a wiring board, positioned abo... | 06/14/1988 |
| 4734818 | Decoupling capacitor for surface mounted leadless chip carriers, surface mounted leaded chip carriers and Pin Grid Array packages High frequency noise is decoupled from power supplied to Pin Grid Array (PGA), surface mounted leaded chip carrier and surface mounted leadless chip carrier packages by insertion of a decoupling capacitor between the PGA or leaded chip carrier package and... | 03/29/1988 |
| 4734819 | Decoupling capacitor for surface mounted leadless chip carrier, surface mounted leaded chip carrier and pin grid array package Several embodiments of a decoupling capacitor are described which incorporate at least one multilayer capacitive element and which utilize metallized dielectric (i.e., ceramic) substrates rather than a pair of conductors. Also, several types of multilayer... | 03/29/1988 |
| 4722137 | High frequency hermetically sealed package for solid-state components A package for discrete components is hermetically sealed, has very low parasitic inductance and capacitance, small size, 50 ohm input and output leads and is suitable for surface mount applications. The package comprises a ceramic base and a ceramic lid, ... | 02/02/1988 |
| 4716124 | Tape automated manufacture of power semiconductor devices Power semiconductor devices are manufactured using a flexible metal tape carrier to facilitate automation of the manufacturing process. Control leads are fashioned from portions of the tape carrier, with a main portion of the tape carrier serving as a mai... | 12/29/1987 |
| 4714981 | Cover for a semiconductor package A cover for a semiconductor package includes a composite layer on its upper most surface containing a passive circuit. The passive circuit may include a number of passive components to fulfill various functions such as capacitive coupling and decoupling, ... | 12/22/1987 |
| 4713634 | Semiconductor device mounted in a housing having an increased cutoff frequency A semiconductor device including a metallic container for containing a radio frequency semiconductor circuit on a bottom surface thereof; a cap for covering the container; and input and output terminals connected to the circuit and penetrating through a s... | 12/15/1987 |
| 4712160 | Power supply module Disclosed herein is a power module which is simple in assembly and which allows efficient release of heat generated by a converter transformer and power devices on primary and secondary circuits which are electrically separated from each other. The power ... | 12/08/1987 |
| 4709122 | Nickel/indium alloy for use in the manufacture of a hermetically sealed container for semiconductor and other electronic devices This invention relates to a new and improved hermetically sealed container for semiconductor and other electronic devices, to a novel sealing cover for use in fabricating the above-referenced hermetically sealed container, and to novel processes for manuf... | 11/24/1987 |
