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...that several people are credited with the invention of the flush toilet? Most people have heard of Thomas Crapper (1837-1910), the sanitary engineer who invented the valve-and-siphon arrangement that made the modern toilet possible. Another claimant to "the throne" was British inventor Alexander Cumming who patented a toilet in 1775. Then there's a nameless Minoan (a native of ancient Crete) who lived 4,000 years ago who supposedly was ahead of his time and created the first flush toilet!

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Class 174/550 - Keys


Subclass of Class 174 - Electricity: conductors and insulators
Definition: Subject matter wherein the external terminals are control
No. of patents: 5
Last issue date: 09/20/1988


NumberTitleIssue Date
4772761Sealed electrical components and method of making same
An electrical component (20) comprises electrical circuit means (22) and housing member (50) disposed over a first portion (24) of the electrical circuit means (22). The circuit means (22) has a second portion (30) extending outwardly from the housing mem...
09/20/1988
4635354Low cost electronic apparatus construction method
The present invention is a low cost electronic apparatus construction method which may be employed for hand held calculators, electronic learning aids and electronic games. This technique involves a simplification in the construction of the apparatus incl...
01/13/1987
4471408Piggyback code switch device
A piggyback code switch which provides a unique digital code for various types of circuits, for example, garage door openers, load management control receivers, etc., is used with dual-in-line packaging diodes or resistor arrays in such a manner as to ena...
09/11/1984
4224637Leaded mounting and connector unit for an electronic device
A leaded mounting and connector unit for an electronic device wherein the unit includes a structure having two parallel sides and a plurality of metallized areas which connect with spaced metallized areas provided at the parallel sides to which terminal l...
09/23/1980
3984861Transcallent semiconductor device
Metal plates of tungsten or molybdenum, having an optimum thickness of 1000 micrometers or less, are bonded to respective cathode and anode electrical coatings on the opposed major surfaces of a semiconductor wafer. The metal plates in turn are conductive...
10/05/1976
 
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