Did You Know...
...that several people are credited with the invention of the flush toilet? Most people have heard of Thomas Crapper (1837-1910), the sanitary engineer who invented the valve-and-siphon arrangement that made the modern toilet possible. Another claimant to "the throne" was British inventor Alexander Cumming who patented a toilet in 1775. Then there's a nameless Minoan (a native of ancient Crete) who lived 4,000 years ago who supposedly was ahead of his time and created the first flush toilet!
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| Number | Title | Issue Date |
| 7863528 | Housing with thermal bridge A hermetically sealed and/or ignition protection housing is provided with heat bridges at discreet points. The heat bridges form mounting faces in the interior space of the housing and also on the outer side. Heat from the interior of the housing generated by an ite... | 01/04/2011 |
| 7750252 | Apparatus and method for limiting noise and smoke emissions due to failure of electronic devices or assemblies An apparatus and method are provided for limiting failure noise and smoke emissions produced as a result of electrical failure conditions and/or failed electronic devices or assemblies of electronic equipment, such as IT and telecommunications equipment. In one aspe... | 07/06/2010 |
| 7417198 | Radiofrequency power semiconductor module with cavity housing, and method for producing it The invention relates to a radiofrequency power semiconductor module having a cavity housing constructed from three modules, a 1st module, which has an upwardly and downwardly open housing frame with horizontally arranged flat conductors, a 2nd module, which has the... | 08/26/2008 |
| 7394029 | Module, method of manufacturing module, and electronic apparatus using module A module includes a circuit board, a first terminal on a lower surface of the circuit board, a first electronic component on an upper surface of the circuit board, a first cover made of metal covering the first electronic component, a second electronic component on ... | 07/01/2008 |
| 7371965 | Modular cage with heat sink for use with pluggable module A heat sink and module cage assembly for receiving a pluggable electronics component, such as an opto-electronic transceiver module. The heat sink is attached to the module cage and includes a bottom surface forming one of four sidewalls of a chamber that receives t... | 05/13/2008 |
| 7365273 | Thermal management of surface-mount circuit devices A circuit board assembly having a laminate construction of multiple layers, such as a LTCC ceramic substrate, with conductor lines between adjacent pairs of layers. A heat sink is bonded to a first surface of the substrate, and a cavity is defined by and between the... | 04/29/2008 |
| 7339266 | Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads... | 03/04/2008 |
| 7329945 | Flip-chip adaptor package for bare die A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board in... | 02/12/2008 |
| 7292447 | Back plate assembly for a board A back plate assembly (100) for a board (200) comprises a back plate (110) abutting against a side of the board and a plurality of posts (120). Each post comprises at least one latching portion (1206) formed thereon. After the latc... | 11/06/2007 |
| 7272015 | Electronic unit with EMC shielding To improve EMC shielding for an electronic unit containing at least one electronic power device operated at high frequency and a metal housing thermally coupled to the device to provide heat dissipation, the power device with a device terminal is thermally and elect... | 09/18/2007 |
| 7239517 | Integrated heat spreader and method for using Integrated heat spreader and die coupled with solder. The heat spreader may have solder reservoirs. Additionally, the heat spreader and die may be coupled during a reflow process where the gaseous pressure surrounding the integrated heat spreader and the die is vari... | 07/03/2007 |
| 7170165 | Circuit board assembly with a brace surrounding a ball-grid array device An assembly includes a circuit board with a ball grid array device attached to a first side of the circuit board. A brace surrounding the ball grid array device has a series of mounting holes and a series of members extending between the mounting holes. The brace is... | 01/30/2007 |
| 6680849 | Extruded heatsink and EMC enclosure An enclosed electronic component is provided by extruding first and second heatsink members having a plurality of cooling structures disposed on first surfaces thereof and an electronic component board between the first and second heatsinks, with a pair o... | 01/20/2004 |
| 6664463 | Apparatus and method for shielding electromagnetic radiation An apparatus is provided for dissipating heat from an electronic component, such as a processor, that is mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component. The apparatus includes a heat sin... | 12/16/2003 |
| 6643134 | Holding and heat dissipation structure for heat generation part In a holding and heat dissipation structure for a heat generation part for dissipating heat generated from the heat generation part having lead portions protruded from the main body thereof are soldered at a main substrate, a terminal plate is disposed at... | 11/04/2003 |
| 6639800 | Heat sink subassembly A heat sink subassembly may include a retainer comprising several attachment points, a heat sink coupled to the retainer, and a force-generating device. The heat sink includes several fins, one of which is shorter than the other fins. The force-generating... | 10/28/2003 |
| 6625025 | Component cooling in electronic devices A device for dissipating heat produced by circuitry such as the circuitry associated with an optical transponder includes a plurality of heat dissipating regions. Each heat dissipating region includes a heat sink that is thermally coupled with at least on... | 09/23/2003 |
| 6625028 | Heat sink apparatus that provides electrical isolation for integrally shielded circuit In one embodiment, a heat sink apparatus that provides electrical isolation for an integrally shielded, electronic circuit. The heat sink apparatus comprises a substrate having a first hole extending between a first and second sides of the substrate, a co... | 09/23/2003 |
| 6242797 | Semiconductor device having pellet mounted on radiating plate thereof A semiconductor device having a pellet mounted on a radiating plate thereof is disclosed. The radiating plate is formed in such a shape that a central portion thereof is positioned higher than both end portions thereof. A pellet is mounted on a lower face... | 06/05/2001 |
| 4855868 | Preformed packaging arrangement for energy dissipating devices A packaging arrangement for energy dissipating devices includes thermal elements adjacent first and second sides of the device, and a heat-flow modifier adjacent the thermal element for regulating the flow of heat therefrom. A plurality of electrically co... | 08/08/1989 |
| 4843188 | Integrated circuit chip mounting and packaging assembly An integrated circuit chip mounting and packaging assembly is described. The assembly comprises a spreader having one or more chips centrally mounted thereon. A plurality of leads are disposed outward of the integrated circuit chip on the same side of the... | 06/27/1989 |
| 4829403 | Packaging arrangement for energy dissipating devices A packaging arrangement for energy dissipating devices includes thermal elements adjacent first and second sides of the device, and a heat-flow modifier adjacent one of the thermal elements for regulating the flow of heat therefrom. A plurality of electri... | 05/09/1989 |
| 4823234 | Semiconductor device and its manufacture A semiconductor device of the kind wherein one or more semiconductor chips are housed in a plug-in type package. The package is being molded with a printed wiring substrate, head portions of terminals, and a heat sink for semiconductor chip attachment as ... | 04/18/1989 |
| 4816426 | Process for manufacturing plastic pin grid arrays and the product produced thereby A process for forming an integral circuit pin grid array package comprising a flexible metal tape adapted for use in tape automated bonding with a plurality of holes. Terminal pins are inserted in the holes and the tape and pins are disposed within a mold... | 03/28/1989 |
| 4788765 | Method of making circuit assembly with hardened direct bond lead frame In an electric circuit assembly (2) having conductive lead frames (8-10) directly bonded to an insulating substrate (6) by a eutectic, the lead frames are further subjected to a work hardening step (32, 34) to stiffen the lead frames and enable push-on fa... | 12/06/1988 |
| 4774635 | Semiconductor package with high density I/O lead connection Disclosed is a semiconductor package which permits coupling of semiconductor bond pads to I/O leads where a high density of connections is needed. Conductive fingers backed by an insulating tape are bonded to the ends of the fingers on a lead frame. The t... | 09/27/1988 |
| 4751611 | Semiconductor package structure A semiconductor package comprising a pair of flat moldings made from a thermoplastic resin, one of the flat moldings having in the cavity a projection which is welded to a rear side of a tab of lead frame mounting a semiconductor thereon by melt heating, ... | 06/14/1988 |
| 4750031 | Hermetically sealable package for hybrid solid-state electronic devices and the like A small component package employing a ring frame 11 of a mouldable polyamide-imide thermoplastic directly moulded onto a heat conducting base plate 10 with integral moulded anchoring pins of the thermoplastic material engaging corresponding bores 21 and 2... | 06/07/1988 |
| 4742024 | Semiconductor device and method of producing semiconductor device A semiconductor device comprises a substrate, a semiconductor element mounted on the substrate, a cap having an opening smaller than the external size of the semiconductor element for covering the semiconductor element to provide a hermetic seal, and a he... | 05/03/1988 |
| 4707763 | Molded electronic circuit device A molded electronic circuit device including a printed circuit board having an electronic circuit in a synthetic resin, the electronic circuit including heat-radiating electronic elements such as a power transistor and contained within a case holding the ... | 11/17/1987 |
| 4705917 | Microelectronic package A microelectronic package for the protection, housing, cooling and interconnection of a microelectronic chip. The package is made of a plurality of ceramic layers, each of which carries a particular electrically conductive pattern and which have interior ... | 11/10/1987 |
| 4706106 | Semiconductor light receiving device A semiconductor light receiving device, including; a photo diode having a polyimide film as a surface protection film, and a hermetically sealed package including the photo diode in an ambient gas including oxygen.... | 11/10/1987 |
| 4701573 | Semiconductor chip housing A semiconductor chip housing provides hermetic sealing and appropriate electrical characteristics for use at high frequencies. The housing comprises a substrate in which the chip is mounted and a cylindrical tube having a top cover and extending above the... | 10/20/1987 |
| 4698663 | Heatsink package for flip-chip IC A semiconductor device comprises a substrate, a semiconductor element mounted on the substrate, a cap having an opening smaller than the external size of the semiconductor element for covering the semiconductor element to provide a hermetic seal, and a he... | 10/06/1987 |
| 4684975 | Molded semiconductor package having improved heat dissipation An improved metal tape for tape automated bonding provides for enhanced heat dissipation from the packaged semiconductor device. The invention includes two aspects. In the first aspect, individual metal tape leads are extended inward beyond the peripheral... | 08/04/1987 |
| 4682270 | Integrated circuit chip carrier A chip carrier includes a body (1) having a central region and sidewalls (31) connected to the central region by an elastically deformable region (33), in order to reduce thermal strains. Also for the same reason a heat sink (41) may be attached underneath the... | 07/21/1987 |
| 4677526 | Plastic pin grid array chip carrier A low cost injection-molded plastic pin grid array chip carrier is provided as an alternative to a ceramic pin grid array chip carrier, in which an electrically superior package is fabricated by supporting nested lead frames in the mold cavity at the cent... | 06/30/1987 |
| 4642419 | Four-leaded dual in-line package module for semiconductor devices A four-leaded dual in-line package is disclosed in which a rectangular insulation housing carries a semiconductor device therein which is connected to flat lead frame elements which extend out through the opposite sides of the insulation housing and defin... | 02/10/1987 |
| 4636580 | Static converter module with mounting lugs In this static converter module, which is equipped with thyristors, diodes or power transistors, mounting lugs (4,11) having mounting holes (5,6,12,13) are used for mounting the module on a heat sink. The housing of the module is essentially formed by a f... | 01/13/1987 |
| 4624303 | Heat sink mounting and method of making A heat sink mounting for a semi-conductor device includes a base member having a base body defining a generally cylindrical recess and a downwardly extending stem portion. The base body further defines an annular groove extending around the side surface o... | 11/25/1986 |
