Class 174/547 - Cooled

Subclass of Class 174 - Electricity: conductors and insulators
Definition: Subject matter wherein the box or housing has structure
No. of patents: 25
Last issue date: 02/01/2011

Number	Title	Issue Date
7880098	Connecting box of a solar panel with a cooling structure The invention relates to a receptacle (1) particularly suitable for wiring one or more solar cells (81). The receptacle (1) comprises a housing (10) and a connecting shaft (60) that can be separately closed by a cover (63). ...	02/01/2011
7683270	Telecommunications cabinet Embodiments of a storage cabinet and methods for making and using such cabinet are disclosed. In one embodiment of an apparatus. a tubular sealed chamber for storing telecommunications equipment is coupled to a sealed chamber to support the sealed chamber. The tubul...	03/23/2010
7309838	Multi-layered circuit board assembly with improved thermal dissipation A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature dissipation resin, which is of insulating material and is arranged so as to d...	12/18/2007
7289332	Mirror image electrical packages and system for using same A mirror image package is disclosed along with several embodiments for using such package in connection with a normal package. Embodiments include side-by-side and top-over-bottom mounting arrangements. Embodiments also include color or graphic coding so that normal...	10/30/2007
7272001	External conductive heat dissipating device for microcomputers A conductive heat dissipating device for microcomputers includes a motherboard having an opening and a first electric connector installed adjacent to the front side of the opening, an adapter board having a second electric connector connected to the first electric c...	09/18/2007
7238881	Controlled height and flow rework nozzle An improved rework nozzle includes an open housing which when lowered onto the surface of a board forms a closed cavity. The housing includes venting means which expend air that is input to the cavity, thereby using flow through concepts to maintain a uniform temper...	07/03/2007
7135356	Semiconductor device and method of producing a high contrast identification mark A seconductor device (50) includes a semiconductor die (20) having a first surface (14) for forming electronic circuitry. A coating layer (16) formed on a second surface (15) of the semiconductor die has a color that contrasts with...	11/14/2006
6667886	Cooling body-conductor strips arrangement A cooling body-conductor strips arrangement for electrical devices has a cooling body for withdrawing heat to a surrounding area, a base plate composed of an electrically insulating material and provided with a first conductor strip unit which is embedded...	12/23/2003
6195257	Apparatus and method of adapting a rectifier module to enhance cooling A module mount for use in electrically and mechanically mounting an encapsulated power rectifier module, having a plurality of rigid leads protruding from a major mounting surface thereof, in an orientation in which the major mounting surface is substanti...	02/27/2001
5526867	Methods of forming electronic packages The present invention relates to the formation of a macrocomposite body for use as an electronic package or container. The macrocomposite body is formed by spontaneously infiltrating a permeable mass of filler material or a preform with molten matrix meta...	06/18/1996
4861943	Enclosure for thermal protector and method of assembly An electrically insulated enclosure for a thermal protector to be used in a lighting fixture includes a body having openings at both ends with a trench therein for guiding the thermal protector through the body. A resilient tab extending from the interior...	08/29/1989
4831724	Apparatus and method for aligning surface mountable electronic components on printed circuit board pads A method and apparatus are described for precisely centering the leads of surface mountable electronic components on the pads of a printed circuit board. The method includes coating the pads with solder, placing the leads of the components on the solder c...	05/23/1989
4664281	Explosion proof enclosure An explosion proof electrical enclosure has a relieved joining flange at the junction between the cover and the body of the enclosure. The relieved portion provides an area reducing the bolt load in the event the enclosure is subjected to an internal expl...	05/12/1987
4609937	Power semiconductor device with O-ring seal A power semiconductor device dispensed with soldering and useful for fork lifts and etc., wherein at least one O-ring is provided between the inner wall of case housing at least one semiconductor element structure and outer periphery of a member disposed ...	09/02/1986
4573103	Cooling device for electronic components connected to a printed circuit board by a holder A cooling device for electronic components connected to a printed circuit board (PCB) by holders comprising a heat-conductive body placed between the component and the PCB and engaging them. Heat is transferred to the PCB in this way, the PCB thus being u...	02/25/1986
4524238	Semiconductor packages Various embodiments of a casing adapted to receive an electronic device and in particular power discrete devices are disclosed. The casings include metal or metal alloy base components with the electronic device adhered to its surface. A metal or metal al...	06/18/1985
4449292	Method of clamping a circuit package to enhance heat transfer The compact circuit package (11) includes an insulating housing (12) providing a circuit retaining cavity (19) substantially surrounded by a pair of spaced side walls (15, 16) each terminating at a first rim (21, 22) and a second pair of spaced side walls...	05/22/1984
4398208	Integrated circuit chip package for logic circuits An integrated circuit (IC) chip package comprises a plurality of IC chips mounted on a multilayer substrate. A plurality of covers are provided on the substrate and are positioned so as to cover at least one of the IC chips. External pins are provided on ...	08/09/1983
4340902	Semiconductor device A semiconductor device having a semiconductor chip (102), a ceramic base (101), a ceramic frame (105) and a cover (106). The ceramic base (101) is formed with a through hole. One side of said hole is covered by a high-heat conductivity metal plate (100). ...	07/20/1982
4312116	Method of sealing an electronic module in a cap A method of packaging an electronic module in a cap is disclosed. The module, comprising one or more silicon chips mounted on a substrate and having the chips sealed onto the substrate with a silicone polymer is supported on a cap with the chips disposed ...	01/26/1982
4277737	Method of and means for utilizing rechargeable batteries in the operation of electric vehicles The engine of an automotive vehicle is powered by an assembly of electric batteries which are recharged from time to time, on standstill or during driving, from various sources including a set of solar cells on the vehicle body, braking generators driven ...	07/07/1981
4248290	Foundry molding machine and method A foundry molding machine of the horizontal stack type such as shown in Hatch U.S. Pat. No. 3,958,621 employs a programmable solid state electrical control system operating in conjunction with a closed-loop hydraulic servo-system to obtain greater flexibi...	02/03/1981
4147889	Chip carrier An improved chip carrier of thin dieletric deformed into a dish configuration provided with flexible mounting flanges on which are plated or bonded solderable conductive traces and paths together with plated or bonded heat sinks which may be referenced to...	04/03/1979
4037270	Circuit packaging and cooling A circuit board is provided with a plurality of groups of connectors, so disposed and arranged in respect to each other that each group is capable of receiving a chip carrier. A fluid conduit, carrying a coolant, extends through each group so that when th...	07/19/1977
3984861	Transcallent semiconductor device Metal plates of tungsten or molybdenum, having an optimum thickness of 1000 micrometers or less, are bonded to respective cathode and anode electrical coatings on the opposed major surfaces of a semiconductor wafer. The metal plates in turn are conductive...	10/05/1976

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Class 174/547 - Cooled