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Pneumatic Shoe Lacing Apparatus
This invention provides a pneumatic shoe lacing apparatus for the pneumatic lacing of shoe.
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| Number | Title | Issue Date |
| 7368803 | System and method for protecting microelectromechanical systems array using back-plate with non-flat portion Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate, an interferometric modulation display array formed on the substrate, and a back-plate. The back-plate is placed over the dis... | 05/06/2008 |
| 7282265 | Composite material having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods A composite material having a high thermal conductivity and a small thermal expansion coefficient, which is obtained by impregnating a porous graphitized extrudate with a metal; the composite material having such anisotropy that the thermal conductivity and the ther... | 10/16/2007 |
| 6700068 | Adhesive-less cover on area array bonding site of circuit board An apparatus, program product and method for processing circuit boards containing area array surface treated bonding sites, such as noble metal terminal pads of a Land Grid Array (LGA) assembly. The circuit board includes a plurality of apertures patterne... | 03/02/2004 |
| 4812896 | Metal electronic package sealed with thermoplastic having a grafted metal deactivator and antioxidant A package and process of assembling a package adapted for housing an electronic component. The package includes metallic base, lid and leadframe components sealed together with a thermoplastic material. The thermoplastic has an additive consisting essenti... | 03/14/1989 |
| 4349693 | Apparatus for sealing an electrical component A method and apparatus for sealing an electrical component in a housing surrounding the component employs a system of capillary channels in the housing through which sealing resin is conducted from a dispensing point to completely close and seal any housi... | 09/14/1982 |
| 4025716 | Dual in-line package with window frame An integrated circuit package having a lead frame positioned between two lead glass layers on a ceramic base and a ceramic window frame bonded to the lead glass for accommodating a cap attached by a glass to gold to gold-tin eutectic bond. The various lay... | 05/24/1977 |
| 3981074 | Method for producing plastic base caps for split cavity type package semi-conductor units A method for producing a completed base cap for a plastic package sealing a semi-conductor therein includes the steps of forming the initial body of a plastic base cap including a centrally located hollow recess on one side thereof, placing lead frames on... | 09/21/1976 |
