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3M employee and church chorister Art Fry needed something to temporarily mark pages in his hymnal. He was in luck because his colleague, Spencer Silver, accidentally developed a glue that was too weak for other purposes. After initially discouraging consumer response, Post-it Notes became a hit in 1979.
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| Number | Title | Issue Date |
| 7880097 | Fire resistant and/or water resistant enclosure for operable computer digital data storage device A fire and/or water resistant enclosure is provided for housing an operable digital data storage device. The enclosure is a low cost, preferably molded gypsum enclosure having various embodiments for providing resistance to fire occurring outside said enclosure and/... | 02/01/2011 |
| 7795546 | Thermostatic apparatus and cover Provided is a cover used for a thermostatic apparatus including an inner chamber enclosed with a plurality of walls and a temperature/humidity controller for controlling temperature and humidity in the inner chamber. The cover forms a space with a wall of the plural... | 09/14/2010 |
| 7368758 | Method for hermetically housing optical components, and optical components produced according to said method A method is provided for producing a housing body for optoelectronic components that are reliable and inexpensive. The method creates a hermetic joint between a metal sleeve and a glass pane by joining together a housing element and a preferably metallic housing arr... | 05/06/2008 |
| 7358438 | Sandwich housing for an antenna amplifier An antenna amplifier has its printed circuit board clamped between upper and lower housing parts which have peripheral edges raised to engage the periphery of the circuit board between them. A recess in the housing part can clear a plug connector on the circuit boar... | 04/15/2008 |
| 7348680 | Electronic device and use thereof The electronic device (100) comprises a semiconductor element (1) (e.g. a transistor), an encapsulation (5) and an electrically conductive layer (3) with a first and a second contact pad (11,12), used as signal pads, and a third co... | 03/25/2008 |
| 7329856 | Image sensor having integrated infrared-filtering optical device and related method An image sensing device is disclosed having a die formed with an array of photosensing sites and a structure of optical material having infrared absorbing characteristics formed over the photosensing sites. An embodiment is disclosed in which the structure of optica... | 02/12/2008 |
| 7327005 | Optical semiconductor package with incorporated lens and shielding An optical semiconductor module including an optical semiconductor component that has a front face including an optical sensor. Encapsulation, defining a cavity in which the optical component is disposed, includes external electrical connections for the optical semi... | 02/05/2008 |
| 7321714 | Moisture-resistant nano-particle material and its applications Nano-particle materials including nanometer-scaled particles with a variety of sizes, chemical compositions, and properties may be used to form functional and/or protective media (layers) on a variety of materials and items. Among the items that may be coated and/or... | 01/22/2008 |
| 7279782 | FBGA and COB package structure for image sensor A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed ... | 10/09/2007 |
| 7264041 | Compliant thermal interface structure with vapor chamber A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at leas... | 09/04/2007 |
| 7259450 | Double-packaged multi-chip semiconductor module A plurality of semiconductor die is packaged into one component. The inventive design comprises devices which have been singularized, packaged and thoroughly tested for functionality and adherence to required specifications. A plurality of packaged devices is then r... | 08/21/2007 |
| 7255496 | Package for housing an optoelectronic assembly A package for housing an optoelectronic device and an integrated circuit is disclosed. The package includes an insulating base having an upper surface. The optoelectronic device and the integrated circuit are mounted to the upper surface of the insulating base. The ... | 08/14/2007 |
| 7244033 | Moistureproof optical device An optical device includes a first optical element including an incidence plane on which light from an object is incident, the incidence plane being in contact with the surrounding environment; a main body having an inside and housing the first optical element such ... | 07/17/2007 |
| 7242089 | Miniature silicon condenser microphone A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume... | 07/10/2007 |
| 7211742 | Fire resistant, forced air cooled enclosure for computer digital data storage device A fire resistant, forced air cooled enclosure for one or more computer digital data storage devices is provided. An operable digital data storage device is mounted in a fire resistant enclosure. One or more openings are formed in the enclosure. A movable fire resist... | 05/01/2007 |
| 7161094 | Modifying the electro-mechanical behavior of devices A MEMS device is packaged with a control material that is included in the package to affect an operation of a moveable element of the device. The control material may affect operational characteristics including actuation and release voltages and currents, mechanica... | 01/09/2007 |
| 7122748 | Semiconductor device having packaging structure There is provided a semiconductor device comprising a semiconductor chip whose main surface comprises first electrode pads; a wiring portion electrically connected to the electrode pad and including a bump portion that protrudes upward in a vertical direction with r... | 10/17/2006 |
| 6673400 | Hydrogen gettering system A method, system and materials for use in hydrogen gettering in conjunction with microelectronic and microwave components that are generally hermetically sealed in an enclosure typically referred to as a "package". Gettering materials that can be used inc... | 01/06/2004 |
| 6627814 | Hermetically sealed micro-device package with window A method for manufacturing a cover assembly including a transparent window portion and a frame that can be joined to a micro-device package base to form a hermetically sealed micro-device package. First, a frame is provided having a continuous sidewall de... | 09/30/2003 |
| 4843695 | Method of assembling tab bonded semiconductor chip package A package for housing fabricated semiconductor chips is disclosed. The package has ceramic base with a raised outer shelf extending around its periphery. The outer shelf defines a space in the package where the chip is seated. A lead frame with a number o... | 07/04/1989 |
| 4829403 | Packaging arrangement for energy dissipating devices A packaging arrangement for energy dissipating devices includes thermal elements adjacent first and second sides of the device, and a heat-flow modifier adjacent one of the thermal elements for regulating the flow of heat therefrom. A plurality of electri... | 05/09/1989 |
| 4818821 | Brazed leaded package A brazed leaded package is provided having buried brazed areas thereby eliminating the need of subsequent protective plating of the brazed areas. The package has a heat conductive support which supports a plurality of leads. The distal end of the leads te... | 04/04/1989 |
| 4812896 | Metal electronic package sealed with thermoplastic having a grafted metal deactivator and antioxidant A package and process of assembling a package adapted for housing an electronic component. The package includes metallic base, lid and leadframe components sealed together with a thermoplastic material. The thermoplastic has an additive consisting essenti... | 03/14/1989 |
| 4805009 | Hermetically sealed semiconductor package The present invention is directed to several embodiments of a hermetically sealed semiconductor package. One embodiment is constructed from a substrate of a first copper alloy, a cover member of a second copper alloy and a lead frame of a third copper all... | 02/14/1989 |
| 4801765 | Electronic component package using multi-level lead frames Disclosed is a semiconductor package with a high pin count. External contacts to the chip are provided by interdigitated leads formed from an upper and lower lead frame. The lower lead frame includes a paddle for mounting the chip. The upper lead frame in... | 01/31/1989 |
| 4788583 | Semiconductor device and method of producing semiconductor device A semiconductor device has such a construction that free tip ends of stage bars extending from a stage do not extend to side surfaces of a resin package, and the resin package is constituted by an inner resin package portion and an outer resin package por... | 11/29/1988 |
| 4674820 | Reusable junction box electrical terminal cap A reusable cap encapsulates an electrical terminal in a junction box which routes communication lines such as phone wires. The cap includes a tubular body having a self tearing slot which receives a phone wire radially extending from a stud of a terminal.... | 06/23/1987 |
| 4644096 | Surface mounting package A modified TO-8 package has a kovar header supporting an FET amplifier hermetically sealed by a cover welded along the seam between the cover edge and header edge. The header is formed with three circular openings in space quadrature about the package axi... | 02/17/1987 |
| 4631631 | Capacitor cover and terminal connection An internally threaded insert having intersecting faces about its axis is positioned in a keyed aperture formed in a cover for a capacitor. This provides an antitwist characteristic between the insert and the walls of the aperture to facilitate a seal bet... | 12/23/1986 |
| 4626960 | Semiconductor device having soldered bond between base and cap thereof A semiconductor device including a ceramic base having a cavity carrying a semiconductor chip, and a ceramic cap covering and sealing the ceramic base. The cap has a metallization pattern covering not only a region where it contacts the base but also the ... | 12/02/1986 |
| 4622433 | Ceramic package system using low temperature sealing glasses In accordance with the preferred embodiments of the invention, provided is a hermetic ceramic/glass enclosure for encapsulating semiconductor components which reduces the internal cavity moisture and contamination levels, has a stronger package seal and a... | 11/11/1986 |
| 4611398 | Integrated circuit package An integrated circuit package cover includes a groove with a quadrangular cross-section which contains a self-supporting sealant material of similar cross-section. During assembly, the sealant material is penetrated by the lead-ins and flows around them t... | 09/16/1986 |
| 4598307 | Integrated circuit device having package with bypass capacitor In order to protect ICs from noise it is necessary to mount a bypass capacitor as close as possible to the IC die or chip. The package must seal the die from the environment, but there are marginal spaces at the ends of a dual in line type package (DIP ty... | 07/01/1986 |
| 4594770 | Method of making semiconductor casing A casing for an electrical component comprises a metal lead frame having the electrical component connected thereto. A metal base member is bonded to one surface of the lead frame. A plastic housing member is bonded to a second surface of the lead frame. ... | 06/17/1986 |
| 4554613 | Multiple substrate circuit package A high power circuit package 2 is disclosed for power conditioning electronic circuits. In one embodiment, a plurality of separate ceramic substrates 3-8 are provided, with a common lead frame stamping 12 bonded to all of the substrates. Means are disclos... | 11/19/1985 |
| 4539622 | Hybrid integrated circuit device A hybrid integrated circuit device comprising in combination, a semiconductor integrated circuit element (1) and a film resistor pattern (7). The film resistor pattern is formed on the outer surface of a base (6) which is mounted on a multilayer ceramic p... | 09/03/1985 |
| 4525022 | Electrolytic capacitor and improved header therefor In an electrolytic capacitor, there is provided an improved header for closing the open end of a capacitor can. The header includes a rigid insulating or metal body having at least one terminal passing therethrough, and a resilient elastomeric cover havin... | 06/25/1985 |
| 4524238 | Semiconductor packages Various embodiments of a casing adapted to receive an electronic device and in particular power discrete devices are disclosed. The casings include metal or metal alloy base components with the electronic device adhered to its surface. A metal or metal al... | 06/18/1985 |
| 4514752 | Displacement compensating module A displacement compensating module is disclosed wherein a blocking article, such as a polyimide tape, is disposed between an epoxy composition and the back surface of a substrate and between the epoxy composition and the inner surface of a cap for blockin... | 04/30/1985 |
| 4514750 | Integrated circuit package having interconnected leads adjacent the package ends A package for an integrated circuit is provided with interconnected leads within accessable recesses in the enclosure of the package. The interconnections of the leads is severed to isolate each leads from all other leads.... | 04/30/1985 |
