Did You Know...
...that a workman who left the soap mixing machine on too long was responsible for making Ivory Soap? He was so embarrassed by his mistake that he threw the mess in a stream. Imagine his dismay when the evidence of his error floated to the surface! Result: Ivory soap, the soap that floats.
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| Number | Title | Issue Date |
| 7994437 | Semiconductor device capable of switching operation modes A semiconductor device includes a substrate, a first internal terminal, a second internal terminal, a third internal terminal, and a fourth internal terminal which are placed along perimeter of the substrate, a circuit formed above the substrate and coupled to the f... | 08/09/2011 |
| 7960657 | Electrical device An electrical device has a housing and a housing surface, at least one electrical conductor accommodated in said housing and interrupting said housing surface in sections so that said housing surface is interrupted, a conductive body which covers said conductor on s... | 06/14/2011 |
| 7842889 | Substrate for mounting electronic part and electronic part The present invention is characterized by a structure having a substrate 1, and metallization layers 2 formed on the substrate 1, on which a Sn solder film 3 and an Ag film 4 are formed. The Ag film 4 is a metal free from ox... | 11/30/2010 |
| 7763811 | Housing for an electronic circuit and method for sealing the housing A housing for an electronic circuit is provided with a single-part seal for sealing a clearance space between a floor plate and a cover, through which exposed electrical conductors are led, which connect the circuit on the inside of the housing to the surroundings. ... | 07/27/2010 |
| 7763812 | Semiconductor device capable of switching operation modes A semiconductor device according to the present invention includes first through fourth internal terminals placed along the perimeter of a substrate, a circuit coupled to the first internal terminal, a first external terminal coupled to the second internal terminal,... | 07/27/2010 |
| 7365420 | Semiconductor packages and methods for making and using same A semiconductor package is provided which includes a substrate having a plurality of semiconductor dice mounted thereon. The substrate is divided into segments by grooves formed in the bottom surface of the substrate. Each semiconductor die is electrically connected... | 04/29/2008 |
| 7325715 | Unitary vacuum tube incorporating high voltage isolation A housing for microelectronic devices requiring an internal vacuum for operation, e.g., an image detector, is formed by tape casting and incorporates leads between interior and exterior of said housing where said leads are disposed on a facing surface of green tape ... | 02/05/2008 |
| 7310216 | EMI filter terminal assembly with wire bond pads for human implant applications An electro-magnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical devi... | 12/18/2007 |
| 7301224 | Surface acoustic wave device and manufacturing method of the same A surface acoustic wave device has a SAW device element 10 and a package 20 housing the SAW device element. The package includes a resin substrate 20 having metal patterns 21 and 22 formed on both surfaces thereof, and a resin cap ... | 11/27/2007 |
| 7292448 | Circuit substrate A circuit substrate includes a first rigid substrate having a plurality of land portions located at a predetermined interval on one surface, a second rigid substrate having a plurality of second land portions located at a predetermined interval on one surface and a ... | 11/06/2007 |
| 7273804 | Internally reinforced bond pads Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so ... | 09/25/2007 |
| 7274129 | Surface acoustic wave device and method of fabricating the same A surface acoustic wave device includes, a first substrate, a surface acoustic wave chip attached to the first substrate, and a second substrate that hermetically seals the surface acoustic wave chip. At least one of the first and second substrates includes. The fir... | 09/25/2007 |
| 7263891 | Pressure detecting apparatus Pressure detecting apparatus includes: a housing; a pipe extending from one end of the housing and having an elongated shape; and a pressure sensitive element for detecting pressure and outputting a signal corresponding to the pressure. The pipe includes a top end c... | 09/04/2007 |
| 7230515 | Package for parts for LAN and pulse transformer module for LAN A resin-made base body 1 has first recessed portions 11 and 12 for respectively accommodating a plurality of pulse transformers as well as second recessed portions 13 and 14 for accommodating common mode choke coils which are respe... | 06/12/2007 |
| 7209360 | Leak-tight system for boxes containing electrical and electronic components The system consists of fixing the printed circuit board (3) to the bottom (1) of the body of the box with the cooperation of a perimetral and spacing flap (6) which creates a chamber (7) under the board (3), in which the components... | 04/24/2007 |
| 7154053 | Optoelectronic package with wire-protection lid An optoelectronic package with a wire-protection lid is provided. An active surface of a silicon die includes a light working area. The silicon die is disposed on a substrate and electrically connected to the substrate through a plurality of bonding wires. A glass i... | 12/26/2006 |
| 6670718 | Wiring board utilizing a conductive member having a reduced thickness In a wiring board wherein an opening is defined at a predetermined position of a film-like insulating substrate, an electric wiring provided with a connection terminal covering the opening is disposed on a principal plane of the insulating substrate, and ... | 12/30/2003 |
| 6664624 | Semiconductor device and manufacturing method thereof A source electrode, a gate electrode, and a drain electrode formed on a front face active region of a semiconductor substrate in a shape of teeth of a comb are covered with an insulating film such as polyimede etc., as well as all of the upper surface and... | 12/16/2003 |
| 6639150 | Hermetic package for surface acoustic wave device having exposed device substrate contacts and method of manufacturing the same A hermetic package for an electronic device, such as a surface acoustic wave (SAW) device and a method of manufacturing the same. In one embodiment, the package includes: (1) a device substrate having: (a) an active region containing an electrically condu... | 10/28/2003 |
| 6621155 | Integrated circuit device having stacked dies and impedance balanced transmission lines A multi-chip device which includes a plurality of integrated circuit die disposed one over another. Each integrated circuit die includes one or a plurality of bond pads. One or a plurality of conductors are disposed to electrically couple the bond pads of... | 09/16/2003 |
| 6617524 | Packaged integrated circuit and method therefor To mitigate mold encapsulant bleeding and solder mask cracking in plastic semiconductor packages, a damming structure constructed from metal traces is formed in-line with the encapsulant perimeter. In one embodiment, each damming trace is connected to onl... | 09/09/2003 |
| 6239366 | Face-to-face multi-chip package A face-to-face multi-chip package comprises a lead frame comprising at least a die pad and a plurality of leads, wherein the leads further comprise a plurality of inner leads and a plurality of outer leads. The package further comprises at least three chi... | 05/29/2001 |
| 4868634 | IC-packaged device An IC-packaged device comprises a lower plate which has wiring patterns at least on an upper surface; an upper plate which has upper surface wiring patterns and at least an opening hole and are superimposed on the lower plate when used; and a plurality of... | 09/19/1989 |
| 4829403 | Packaging arrangement for energy dissipating devices A packaging arrangement for energy dissipating devices includes thermal elements adjacent first and second sides of the device, and a heat-flow modifier adjacent one of the thermal elements for regulating the flow of heat therefrom. A plurality of electri... | 05/09/1989 |
| 4801765 | Electronic component package using multi-level lead frames Disclosed is a semiconductor package with a high pin count. External contacts to the chip are provided by interdigitated leads formed from an upper and lower lead frame. The lower lead frame includes a paddle for mounting the chip. The upper lead frame in... | 01/31/1989 |
| 4796239 | Circuit unit for timepiece and process for fabricating the same A circuit unit including a plurality of lead frames which are made of a metal sheet and one of which is used for die-bonding an integrated circuit. The die-bonding lead member is formed to have at least a generally H-shaped portion constructed of a pair o... | 01/03/1989 |
| 4796078 | Peripheral/area wire bonding technique An electronic assembly having a semiconductor device back bonded to a first lead frame. An adhesive insulative tape is placed on the first lead frame and the device. A second lead frame is mounted on the adhesive tape. Electrical contacts by wire bonds ar... | 01/03/1989 |
| 4788626 | Power semiconductor module A power semiconductor module includes a plastic housing having an interior. A substrate in the form of a ceramic plate with upper and lower surfaces is inserted in the housing as a housing bottom. Metallizations are disposed on the upper and lower surface... | 11/29/1988 |
| 4783719 | Test connector for electrical devices An improved test apparatus is disclosed for testing leadless IC chip carriers or IC dies. The apparatus employs a flexible film on which is imprinted a conductor line pattern terminated in a plurality of raised conductive pads. The line pattern is readily... | 11/08/1988 |
| 4781775 | Coplanar die to substrate bond method A coplanar die to substrate bond method wherein a plurality of die are aligned on a silicon wafer substrate in a predetermined relationship and a slurry of glass is applied to bond them together. This occurs while either on a flat or a grooved plate. When... | 11/01/1988 |
| 4780795 | Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture A dual cavity semiconductor package containing a high voltage (greater than 1500 volts) isolation amplifier includes a ceramic substrate with tungsten metalization thereon defining die bonding and wire bonding sites and interconnections in the two cavitie... | 10/25/1988 |
| 4777520 | Heat-resistant plastic semiconductor device A heat-resistant plastic-packaged semiconductor device comprises an IC chip having contacts on its first surface, an island on which the IC chip is mounted with its second surface facing a first surface of the island, a low-adhesion layer which is formed ... | 10/11/1988 |
| 4774635 | Semiconductor package with high density I/O lead connection Disclosed is a semiconductor package which permits coupling of semiconductor bond pads to I/O leads where a high density of connections is needed. Conductive fingers backed by an insulating tape are bonded to the ends of the fingers on a lead frame. The t... | 09/27/1988 |
| 4769272 | Ceramic lid hermetic seal package structure A sidebrazed ceramic package is provided with a closure seal that employs a high alumina ceramic lid that matches the composition of the package body. The lid is provided with a recess in the sealing face and the sealing face is provided with metallizatio... | 09/06/1988 |
| 4763407 | Method of manufacturing a semiconductor device A semiconductor device mounted on a printed circuit board is disclosed. The semiconductor device is surrounded by a frame having a stopper portion on the inner wall thereof at a level higher than tops of bonding wires as well as a semiconductor element ho... | 08/16/1988 |
| 4761518 | Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs A semiconductor casing is formed of a ceramic-glass-metal composite material with a leadframe embedded in a base component. The leadframe may include holes therethrough to mechanically interlock with the composite material. Also, a process comprises formi... | 08/02/1988 |
| 4751482 | Semiconductor integrated circuit device having a multi-layered wiring board for ultra high speed connection This invention relates to an ultra high speed semiconductor integrated circuit device, and in particular to a layout and connecting structure between lead terminals of a package and signal pads on a chip. The device includes a wiring board, positioned abo... | 06/14/1988 |
| 4742431 | Flexible circuit board A printed wiring board comprising a main printed wiring board provided with a first wiring pattern, and an auxiliary flexible printed wiring board, provided with a second wiring pattern for modifying the first wiring pattern and bonded to the main printed... | 05/03/1988 |
| 4740868 | Rail bonded multi-chip leadframe, method and package A leadframe including a plurality of rails connected directly to input leads and output leads. A plurality of chips can be mounted directly to the plurality of rails forming a rail bonded multi-chip device. Wire bonding can occur directly from the chips t... | 04/26/1988 |
| 4727410 | High density integrated circuit package A multifaceted package is disclosed that permits VLSI and VHSIC integrated circuits in the form of integrated circuit die or chip carries to be mounted on the faces of the package to form a high-density circuit package. The package comprises a plurality o... | 02/23/1988 |
