Bizarre Patents
A gun that fires a missile, powered by gas "discharged by the operator of the toy."
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8110756 | Electronic device An electronic device includes a housing and a positioning portion. The housing includes a first member secured to the housing and a second member secured to the first member. The positioning portion is configured to position the second member at a predetermined posi... | 02/07/2012 |
| 8049120 | Ultrasonic bonding of discrete plastic parts to metal Electronic devices and other apparatuses that include plastic parts ultrasonically bonded to metal parts are disclosed. A first component or part includes a metallic surface region having a surface roughness with one or more surface irregularities. A second componen... | 11/01/2011 |
| 7943865 | Device for isolation of electrical components A device for creating a relatively isolated environment for protecting dangerous and/or fragile components, particularly electrical components, from the surrounding environment. The device will typically include a front member and base member which may be formed as ... | 05/17/2011 |
| 7915543 | Isolator assembly, receptacle and method of operation An isolator assembly includes an electrical receptacle housing. The housing defines an aperture extending inwardly from a first exterior wall of the housing and a longitudinal centerline of the aperture. The housing further has an internal cavity extending from the ... | 03/29/2011 |
| 7897883 | Light emitting assembly and method for assembling the same A lead-mounting seat includes a conductive seat body including a lead-mounting plate and spaced apart first and second insert legs that extend from the lead-mounting plate and that have different geometric shapes. The lead-mounting plate is formed with a plurality o... | 03/01/2011 |
| 7858886 | Mounting bracket and method The present invention is directed to a bracket for mounting housing for accommodating electrical components. The bracket comprises a base member capable of being mounted to a surface. The bracket may also comprise a sidewall extending from the base member and a syst... | 12/28/2010 |
| 7800003 | Insulator with enhanced insulating capacity When an insulator is used in a humid atmosphere, the cooling thereof causes a humidity condensation, which is deposited on the insulator surface. Drops of water formed by the humidity condensation are connected to each other that a water film substantially reducing ... | 09/21/2010 |
| 7485815 | Mounting device for a capacitor A mounting device for mounting a capacitor on a connector element includes a hollow body defining a continuous through-hole that axially penetrates the body for receiving and mounting the capacitor. The body has a lower region defining a lower through-hole portion w... | 02/03/2009 |
| 7394029 | Module, method of manufacturing module, and electronic apparatus using module A module includes a circuit board, a first terminal on a lower surface of the circuit board, a first electronic component on an upper surface of the circuit board, a first cover made of metal covering the first electronic component, a second electronic component on ... | 07/01/2008 |
| 7381908 | Circuit board stiffener Embodiments of the present invention provide improved circuit board stiffeners. In one embodiment the present invention includes a circuit board stiffener comprising a lower stiffener piece having a first lower surface for abutting an upper surface of a test system ... | 06/03/2008 |
| 7372170 | Flip chip interconnection pad layout A flip chip interconnect pad layout has the die signal pads are arranged on the die surface near the perimeter of the die, and the die power and ground pads arranged on the die surface inboard from the signal pads; and has the signal pads on the corresponding packag... | 05/13/2008 |
| 7372149 | High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus A high frequency semiconductor apparatus is provided which prevents characteristics of a high frequency semiconductor element from being deteriorated so that the high frequency semiconductor element can be made to operate stably. The high frequency semiconductor app... | 05/13/2008 |
| 7362491 | Heated glass panels and methods for making electrical contact with electro-conductive films A heated glass panel assembly according to one embodiment of the invention may include a substrate having an electro-conductive film provided thereon. A conductor is positioned in contact with the electro-conductive film. A resilient material is positioned in contac... | 04/22/2008 |
| 7362586 | Electronic component with shielding case and method of manufacturing the same Shielding cases each include a pair of opposed first surfaces with catching pieces protruding therefrom and a pair of second surfaces without catching pieces. A motherboard forms substrates each including a pair of opposed first side surfaces with catching grooves a... | 04/22/2008 |
| 7343227 | Current sensing temperature control circuit and methods for maintaining operating temperatures within information handling systems An information handling system including a system fan control for maintaining operating temperatures of electronics within the information handling system is disclosed. The information handling system can include a power trace provided in association with a power ci... | 03/11/2008 |
| 7326077 | Fixing device for an extension card A fixing device for an extension card having a bracket with a bent portion has a casing and a metal pressing member. The casing has a support portion. The metal pressing member has a longitudinal bottom plate, a pivotal structure, and a resilient latching structure.... | 02/05/2008 |
| 7324353 | Image display apparatus and shield casing thereof A shield casing of an image display apparatus including a casing which covers other than a front surface of an image display device having an electromagnetic wave emitter and shielding the electromagnetic waves, a protection panel on which a conductive film is lamin... | 01/29/2008 |
| 7323772 | Ball grid array structures and tape-based method of manufacturing same Semiconductor device packages formed in accordance with methods of packaging semiconductor dice in grid array-type semiconductor device packages using conventional lead frame or lead lock tape assembly equipment are disclosed. Circuitry-bearing segments having an el... | 01/29/2008 |
| 7314205 | System and method for mounting a breaker panel to a pole Certain exemplary embodiments can provide a system that can comprise one or more brackets adapted to be coupled to a panel. The bracket can define a collar adapted to slideably couple the panel to a pole. The bracket can be adapted to restrain rotational motion of t... | 01/01/2008 |
| 7294791 | Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing same A circuitized substrate designed to substantially eliminate impedance disruptions during passage of signals through signal lines of the substrate's circuitry. The substrate includes a first conductive layer with a plurality of conductors on which an electrical compo... | 11/13/2007 |
| 7294792 | Installation aid for vertically mounted components An apparatus and method providing for ease of installation of a component on a substantially vertical surface. The apparatus, has a back case to be secured to the substantially vertical surface, and a front case securable to the back case, the front case having a ra... | 11/13/2007 |
| 7289337 | Electronic card with braced structure The field of the invention is that of electronic computers that have to operate in a harsh mechanical environment. One of the main fields of application relates to computers for on-board fixed-wing and rotary-wing aircraft avionics systems operating in a highly vibr... | 10/30/2007 |
| 7274107 | Semiconductor device The present invention relates to semiconductor devices. According to the present invention a semiconductor device is described, comprising: a substrate for carrying a semiconductor chip on a first surface of said substrate; said semiconductor chip being punctually a... | 09/25/2007 |
| 7271480 | Constraint stiffener design A constraint stiffener for reinforcing an integrated circuit package is provided. In one embodiment, the constraint stiffener comprises a rigid, planar base element for bonding to an integrated circuit substrate. The base element has a plurality of elongated support... | 09/18/2007 |
| 7262510 | Chip package structure A process for fabricating a chip package structure with the following steps is provided. First, a chip having an active surface is provided. A plurality of solder bumps is disposed on the active surface. Then, a polymer material including flux is placed on the surfa... | 08/28/2007 |
| 7239529 | Fixing member for auxiliary circuit board A fixing member for fixing an auxiliary circuit board to a main circuit board is proposed. The fixing member includes a fixing portion for being fixed to the main circuit board; and a combining portion connected to the fixing portion. The combining portion can be el... | 07/03/2007 |
| 7232958 | Apparatus and method for fixing component of circuit substrate A component fixing device capable of improving vibration resistance by fixing a component onto a circuit substrate without inhibiting productivity and, of accurately inserting a lead of the component into the circuit substrate. The component fixing device is provide... | 06/19/2007 |
| 7233503 | Assembled structure and clamping device thereof An assembled structure. A first substrate having a base surface is connected to a second substrate by at least one metallic clamping device. The clamping device, vertically disposed on the second substrate, comprises two parts: a first half and a second half having ... | 06/19/2007 |
| 7227086 | Semiconductor chip package having an adhesive tape attached on bonding wires The invention provides a semiconductor chip package, and a means of forming such a semiconductor chip package, in which one or more semiconductor chips are electrically connected to a mounting substrate by wire bonding in which an adhesive tape is provided on the ac... | 06/05/2007 |
| 7212400 | Fixing apparatus for motherboard A fixing apparatus is for fixing a motherboard (60) in a chassis (20). The chassis includes a supporting board (30). The supporting plate includes a number of clips (36, 38), and a screw hole (391). The motherboard (60) defi... | 05/01/2007 |
| 7203072 | Heat dissipating structure and semiconductor package with the same A heat dissipating structure and a semiconductor package with the same are proposed. A substrate is used to accommodate at least one chip thereon, and the chip is electrically connected to the substrate. A heat dissipating structure having a flat portion and a suppo... | 04/10/2007 |
| 7190571 | Chip capacitor and method for the production thereof A capacitor includes a first capacitor element, a first anode contact for the first capacitor element, the first anode contact protruding from the first capacitor element, a second capacitor element, and a second anode contact for the second capacitor element, the s... | 03/13/2007 |
| 7184273 | Electronic device with protective housing having enhanced rigidity An electronic device includes a printed circuit board, a housing in which the printed circuit board is accommodated, a cover covering an end opening of the housing, and a connector disposed on the printed circuit board which has an end exposed through an aperture of... | 02/27/2007 |
| 7182487 | Housings for interchangeable optical assemblies Housings for emergency unit luminaires may be configured to receive both fixed and movable optical assemblies for mounting, allowing for the manufacture of a single housing for production of differing lighting products or lamp assemblies. Additionally, structural el... | 02/27/2007 |
| 7161093 | Aligning gear An aligning gear for an electronic device including a circuit board having at least a first fixing section and a housing having at least a second fixing section is disclosed. The aligning gear includes a first limiting member and a second limiting member, both of wh... | 01/09/2007 |
| 7158384 | Vibration reducing structure of electronic device A vibration reducing structure of an electronic device includes first and second housings, a printed circuit board, a first post and a second post. The first and second housings define a closed space therebetween. The printed circuit board is disposed within the spa... | 01/02/2007 |
| 6703560 | Stress resistant land grid array (LGA) module and method of forming the same An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion... | 03/09/2004 |
| 6696644 | Polymer-embedded solder bumps for reliable plastic package attachment A plastic package for use in semiconductor devices, which has a plurality of metallic terminals exposed on a package surface and a metallic bump attached to each of said terminals. The bumps are made of reflowable metal and have approximately uniform heig... | 02/24/2004 |
| 6693243 | Surface mounting component and mounted structure of surface mounting component On a mounting surface of a multilayered component as a surface mounting component, an isolated electrode is arranged so as to be isolated from other terminal electrodes on the mounting surface. For solder applied to the isolated electrode, the application... | 02/17/2004 |
| 6680435 | Electronic device and method of fabricating the same An electronic device has a wiring board mounted with an electronic circuit chip. A recess or through-hole is formed in a major surface of the wiring board on which the electronic circuit chip is mounted at a position corresponding to a central portion of ... | 01/20/2004 |
