Celebrity Inventors
Mark Twain (Samuel L. Clemens) received Patent No. 121,992 for "An Improvement in Adjustable and Detachable Straps for Garments." He later received two more patents: one for a self-pasting scrapbook and one for a game to help players remember important historical dates.
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| Number | Title | Issue Date |
| 7795545 | Hot melt water-resistant structure A hot melt water-resistant structure includes: an object to be protected from water; and a resin cover for covering an outside of the object and made of hot melt resin. The object includes an exposed surface and a side surface with a sidewall. The exposed surface is... | 09/14/2010 |
| 7709754 | Current sensor An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proxim... | 05/04/2010 |
| 7476816 | Current sensor An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being... | 01/13/2009 |
| 7439452 | Multi-chip module packaging with thermal expansion coefficiencies In a transfer-mold configuration of an automotive electronic control unit, the thermal expansion coefficient of the circuit board is made apparently equal to that of the base member to suppress excessive stresses between them. The circuit board and the base member a... | 10/21/2008 |
| 7434310 | Process to reform a plastic packaged integrated circuit die A process for reforming a plastic packaged integrated circuit die (100) includes grinding away (305) a bottom side (210) of a plastic package (205) and portions of a set of leads (110) that are in the plane of the grinding until a ... | 10/14/2008 |
| 7368810 | Invertible microfeature device packages Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality of device contacts, and a conductive structure electrically connected ... | 05/06/2008 |
| 7364948 | Method for fabricating semiconductor package A semiconductor package and a fabrication method thereof are proposed. A lead frame is provided between a chip and a substrate in a window ball grid array semiconductor package, wherein an active surface of the chip is electrically connected to the lead frame via bo... | 04/29/2008 |
| 7365441 | Semiconductor device fabricating apparatus and semiconductor device fabricating method A semiconductor device fabricating method comprises a substrate forming step of forming a plurality of separate conductive pads 20 on an adhesive layer included in an adhesive sheet 50, and a semiconductor chip mounting step of bonding semiconductor ch... | 04/29/2008 |
| 7336491 | Heat sink A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the components are mounted to the outer surface to allow the transfer of heat ... | 02/26/2008 |
| 7260284 | Semiconductor integrated circuit and semiconductor integrated circuit arrangement device and process A semiconductor integrated circuit which includes an optical device for performing optical communication and which exhibits a predetermined function. This semiconductor integrated circuit includes a first electricity supply portion, which is connected to the optical... | 08/21/2007 |
| 6610924 | Semiconductor package A semiconductor package has a semiconductor chip disposed on a die pad and electrically connected to a plurality of leads arranged around the die pad. There are a plurality of tie bars connected to the die pad. Each tie bar extends from a corner of the di... | 08/26/2003 |
| 6239367 | Multi-chip chip scale package A multi-chip chip scale package. The package has a film carrier whereby two chips with different sizes can be disposed on the same film carrier. A flip chip technique is used to arrange each chip on each side of the film carrier face to face. A bump is fo... | 05/29/2001 |
| 4870224 | Integrated circuit package for surface mount technology The present invention provides for an apparatus and a method for housing an integrated circuit device. The integrated circuit device is coupled to a ceramic substrate wherein contacts of the integrated circuit device mate with contacts on the substrate su... | 09/26/1989 |
| 4868349 | Plastic molded pin-grid-array power package A molded pin-grid-array package includes a heat sink available at the face opposite to the pins. The heat sink is secured to a printed wiring board that has plated through holes therein that form the desired pin-grip-array and wires are secured in the hol... | 09/19/1989 |
| 4862323 | Chip carrier A chip carrier and a process of assembling a chip carrier are disclosed. The carrier used for mounting a chip comprises a copper or copper base alloy component having a thin refractory oxide layer on a surface thereof. The surface and the oxide layer have... | 08/29/1989 |
| 4853825 | Capacitor mounted in a plastic cup and method for manufacturing such device An electrical capacitor (1) which has at least substantially rectangular cross-section and is mounted in a plastic cup (2) and is potted with casting resin. Pairs of impressions (12, 13) are formed into the edges of the plastic cup (2), and the capacitor ... | 08/01/1989 |
| 4852250 | Hermetically sealed package having an electronic component and method of making Forming a body of insulating material with a shelf and an opening therethrough with a plurality of electrical conductors extending from the shelf to the exterior of the body. A plurality of tape automated bounding leads are placed in the opening in which ... | 08/01/1989 |
| 4841608 | Method of forming electrical termination on capacitor tops Capacitor bodies are usually carried in open ended containers. The open ends are then closed with a cover or capacitor top after the capacitor body is inserted in the container. Electrical leads are then attached to terminals carried by the capacitor top.... | 06/27/1989 |
| 4829403 | Packaging arrangement for energy dissipating devices A packaging arrangement for energy dissipating devices includes thermal elements adjacent first and second sides of the device, and a heat-flow modifier adjacent one of the thermal elements for regulating the flow of heat therefrom. A plurality of electri... | 05/09/1989 |
| 4812896 | Metal electronic package sealed with thermoplastic having a grafted metal deactivator and antioxidant A package and process of assembling a package adapted for housing an electronic component. The package includes metallic base, lid and leadframe components sealed together with a thermoplastic material. The thermoplastic has an additive consisting essenti... | 03/14/1989 |
| 4806409 | Process for providing an improved electroplated tape automated bonding tape and the product produced thereby A flexible tape having a desired metal foil circuit pattern and a process for manufacturing such a tape. The starting tape comprises a non-metallic flexible substrate having a metal foil layer adhered thereto. The foil layer is patterned to form a desired... | 02/21/1989 |
| 4777520 | Heat-resistant plastic semiconductor device A heat-resistant plastic-packaged semiconductor device comprises an IC chip having contacts on its first surface, an island on which the IC chip is mounted with its second surface facing a first surface of the island, a low-adhesion layer which is formed ... | 10/11/1988 |
| 4777562 | Wire wrap single in-line package A thick film passive network on an alumina substrate, the passive elements being terminated by conducting metal leads. The network, substrate and a small portion of each lead is encapsulated in a material with high insulation characteristics. The geometry... | 10/11/1988 |
| 4739125 | Electric component part having lead terminals An electric component part has its lead terminals bent in thickness directions in a middle section thereof at least two positions so that a step section virtually in parallel to the bottom of a circuit substrate is formed with the intention of absorbing t... | 04/19/1988 |
| 4720741 | Antistatic and antitack coating for circuit devices In an electronic device assembly comprising at least one circuit element an encapsulant therefor, wherein the encapsulant comprises a silicone resin characterized in that subsequent to the curing of said encapsulant, the resin is coated with a fine inor... | 01/19/1988 |
| 4706811 | Surface mount package for encapsulated tape automated bonding integrated circuit modules A surface mount package formed by nesting an encapsulated tape automated bonding integrated circuit module in between two plastic rings snapped together.... | 11/17/1987 |
| 4642419 | Four-leaded dual in-line package module for semiconductor devices A four-leaded dual in-line package is disclosed in which a rectangular insulation housing carries a semiconductor device therein which is connected to flat lead frame elements which extend out through the opposite sides of the insulation housing and defin... | 02/10/1987 |
| 4641114 | Thick film delay line comprising a plurality of stacked delay assemblies formed by a printing process The thick film delay line of the present invention comprises a substrate having a plurality of conductive pads mounted along the edge thereof. A plurality of delay circuit assemblies are stacked on the upper surface of the substrate. Each delay circuit co... | 02/03/1987 |
| 4629824 | IC package sealing technique An IC package with an improved seal includes a sealant penetrator in the form of a projection on each lead for penetrating the provided seal. In a preferred embodiment the penetrator is a semi-circular projection formed on the lead which penetrates the se... | 12/16/1986 |
| 4611141 | Lead structure for a piezoelectric array-type ultrasonic probe An array-type ultrasonic probe for an ultrasonic transducer has a basic structure comprising a substrate on which are successively disposed a plurality of parallel stripe form back electrodes, a polymer piezoelectric film and a front electrode. One end of... | 09/09/1986 |
| 4600969 | Protective apparatus for encapsulating electrical circuits An encapsulating apparatus for protecting an electrical circuit, the electrical circuit comprising a plurality of discrete electrical components supported on a circuit board and connected electrically to each other and to external electrical lead lines. T... | 07/15/1986 |
| 4568795 | Insulation filled carrier of conductive components An insulated conductor such as an encapsulated electrical circuit is made by locating the circuit components in a preformed carrier with opposed flexible walls with an external, outwardly facing abutment in the shape of a conical opening through each wall... | 02/04/1986 |
| 4549247 | Carrier element for IC-modules A carrier element for IC modules, whereby several leads are arranged on a carrier film, which leads are each connected at one end with a terminal of the module and run into a contact surface at the other end. Whereas the contact surfaces are arranged on t... | 10/22/1985 |
| 4542260 | Encapsulated assemblies An encapsulated assembly of electric components (12) on a board (11) wherein the board and components are encapsulated in a mass of silicone rubber (17) which rubber mass is in turn encapsulated in a mass of rigid epoxy resin compound (21) which is partia... | 09/17/1985 |
| 4542259 | High density packages Several embodiments of high density packages which form an enclosure adapted to receive electronic devices are disclosed. Each package includes a metal lead frame having staggered leads which extend external to the package. A seal ring construction is pro... | 09/17/1985 |
| 4521828 | Component module for piggyback mounting on a circuit package having dual-in-line leads A component module (15, 70), adapted for piggyback mounting on an IC Dip (51,81), preferably incorporates a decoupling capacitor (18, 44, 74), with opposite end electrodes (23, 24), encapsulated within a molded housing (21, 72) of preferably parallelepipe... | 06/04/1985 |
| 4518818 | Encapsulating case able to resist high external pressures An encapsulating case or box for hybrid circuits, able to operate in highly pressurized atmosphere, the components of the hybrid circuit being not subject to the action of pressure. For this purpose, said circuit is enclosed in a case taking the plane of ... | 05/21/1985 |
| 4499333 | Electronic component cap and seal A cap and seal including a central cap (20) to be positioned over an electronic component such as an integrated circuit chip (12), has a spaced upstanding wall or dam (22) which may be staked to the circuit board in assembly forming with the peripheral si... | 02/12/1985 |
| 4481380 | High voltage insulator for electrical components having telescoping insulative sleeves A high voltage electrical component can be insulated by placing such component into a first sleeve of preformed insulative material dimensioned to receive and telescope over the component. An internal abutment in the first sleeve positions the component f... | 11/06/1984 |
| 4480243 | Electromagnetic relay Electromagnetic relay with a housing consisting of two parts (1, 2) which are bonded to one another, with a circumferential groove (5) being provided for in one bottom part (1), which is filled with an adhesive (6) in which the cap-shaped housing member (... | 10/30/1984 |
