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| Number | Title | Issue Date |
| 8168896 | Electronic housing An electronic housing, which includes at least two housing parts, has at least one housing base, a housing cover, and at least one electronic connection in the form of a printed circuit board between electronic substrates disposed in the housing interior and compone... | 05/01/2012 |
| 7999197 | Dual sided electronic module A method for making a dual sided electronic module. A substrate has a first surface that is substantially parallel to a second surface. The second surface forms a cavity extending into an interior portion of the substrate. The substrate has at least one through hole... | 08/16/2011 |
| 7365992 | Electronic circuit package An electronic circuit package includes a first electronic module, a second electronic module, and an electric shielding layer. The first electronic module and the second electronic module are bonded in such a way that integrated devices are opposite to each other. T... | 04/29/2008 |
| 7336500 | Method and apparatus for encapsulating a printed circuit board A demonstration tool for a programmable logic device is provided. The demonstration tool includes a circuit board partially disposed within a transparent block. A collar having an opening defined therein is disposed between the transparent clock and a base of the de... | 02/26/2008 |
| 7317247 | Semiconductor package having heat spreader and package stack using the same A semiconductor package which can be stacked to form a package stack that includes a semiconductor chip with bonding pads, a board having contact pads on its upper surface and bump pads on its lower surface, a heat spreader attached to the rear side of the semicondu... | 01/08/2008 |
| 7285856 | Package for semiconductor devices To prevent the occurrence of stress in the junction portion between the semiconductor element and the semiconductor package mounting the semiconductor element, so that cracks will not occur even when there is mounted a semiconductor element having a small strength. ... | 10/23/2007 |
| 7261596 | Shielded semiconductor device A semiconductor device is disclosed that comprises a board, a ground terminal disposed on the board, a connection terminal disposed on the board, a semiconductor chip mounted on the board, and a shield member electrically connected to the ground terminal. The semico... | 08/28/2007 |
| 7245003 | Stacked package electronic device An electrical component includes a substrate, a first integrated circuit attached to the substrate, a metal portion coupled to the first integrated circuit, and a second integrated circuit attached to the first integrated circuit. The metal portion is sandwiched bet... | 07/17/2007 |
| 7208943 | Electrical device enclosure A robust, low cost, compact and highly accurate rotary position sensor is disclosed for measuring the relative angular position (within a range ≦180°) of a housing or stator and a rotor. The housing carries a galvanomagnetic sensing element and is adapted for fix... | 04/24/2007 |
| 7209360 | Leak-tight system for boxes containing electrical and electronic components The system consists of fixing the printed circuit board (3) to the bottom (1) of the body of the box with the cooperation of a perimetral and spacing flap (6) which creates a chamber (7) under the board (3), in which the components... | 04/24/2007 |
| 7190066 | Heat spreader and package structure utilizing the same A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest ... | 03/13/2007 |
| 7178235 | Method of manufacturing an optoelectronic package A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enab... | 02/20/2007 |
| 7166919 | Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package A leadless type resin-sealed semiconductor package includes a resin enveloper having a mounting face to be applied to a wiring board, and at least one side face associated with the mounting face to produce an angled side edge. A semiconductor chip is encapsulated an... | 01/23/2007 |
| 7164520 | Packaging for an interferometric modulator A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modul... | 01/16/2007 |
| 7161092 | Apparatus and method for protecting an electronic circuit The present invention provides in one embodiment, a system for encapsulating a substrate on a vehicle structure. The system includes the substrate, the vehicle structure and a package substrate. The substrate has a top portion and a bottom portion. The vehicle struc... | 01/09/2007 |
| 7109410 | EMI shielding for electronic component packaging The present invention provides methods and devices for shielding an electronic component package. In one embodiment, an EMI shield is integrally formed within the package adjacent the die and grounded. The EMI shield may be a metallized shaped polymer layer and may ... | 09/19/2006 |
| 6956284 | Integrated circuit stacking system and method The present invention stacks integrated circuits (ICs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules... | 10/18/2005 |
| 6914324 | Memory expansion and chip scale stacking system and method The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with th... | 07/05/2005 |
| 6245995 | Methods and apparatus for removing moisture from an enclosure A control board enclosure includes an opening extending through a side wall to permit moisture to drain from the enclosure and a potting compound to protect the control board. A plug is sized to fit in sealable contact with the opening. The potting materi... | 06/12/2001 |
| 4855807 | Semiconductor device This invention provides a semiconductor device comprising a die-pad supported by tie-bars, a semiconductor element mounted on the die-pad with the die-pad, tie-bars and semiconductor element being encapsulated in a moulding compound, means for defining an... | 08/08/1989 |
| 4847557 | Hermetically sealed magnetic sensor A hermetically sealed magnetic sensor for detecting variations in a magnetic field has a sensor element with an output terminal for detecting variations in the magnetic field and generating a signal. An output wire is connected with one end to the termina... | 07/11/1989 |
| 4810831 | Housing for an electrical component, and method for sealing same A housing suitable for an electrical or electronic component such as a relay, including a wall having apertures (5, 6) and gaps (7) wherein distribution ribs running on the outside form with the housing surface a sharp inner edge (10). Due to these sharp ... | 03/07/1989 |
| 4777520 | Heat-resistant plastic semiconductor device A heat-resistant plastic-packaged semiconductor device comprises an IC chip having contacts on its first surface, an island on which the IC chip is mounted with its second surface facing a first surface of the island, a low-adhesion layer which is formed ... | 10/11/1988 |
| 4748294 | Housing for an electromechanical device A relay housing comprising a cover plate which is inserted in a step-shaped recess of a housing rim. The rim portion of the plate has a reduced thickness so that there is formed a rim channel between the plate and the housing rim. The channel is in commun... | 05/31/1988 |
| 4600969 | Protective apparatus for encapsulating electrical circuits An encapsulating apparatus for protecting an electrical circuit, the electrical circuit comprising a plurality of discrete electrical components supported on a circuit board and connected electrically to each other and to external electrical lead lines. T... | 07/15/1986 |
| 4594644 | Electrical component encapsulation package An electrical component encapsulation package including a cover; a base including a peripheral frame with a large central hole; and support means for mounting the electrical component above and spaced from the frame for providing an open space between the... | 06/10/1986 |
| 4556896 | Lead frame structure A novel lead frame structure is provided which contains an integral arrangement of leads for connection to a semiconductor device and a molded housing is then molded around the semiconductor device and the lead frame. The lead elements of the frame are th... | 12/03/1985 |
| 4366345 | Electromechanical component sealing system A channel system is provided in the base plate of an electromechanical component. Casting resin is conveyed from relatively wide feed channels to connecting pins of the component via narrower capillary channels in order to dependably seal the apertures fo... | 12/28/1982 |
| 4355463 | Process for hermetically encapsulating semiconductor devices A tape assembly process attaches semiconductor chips to a tape via thermocompression gang bonding and the tape is wound onto a reel. The tape is fabricated during its manufacture to have a plurality of spaced finger array patterns. The inner finger ends a... | 10/26/1982 |
| 4229403 | Method of assembling a fault limiter by molding a rigid housing about a non-rigid subassembly A helical fusible element is supported by an element support member which is disposed between two terminal assemblies, which terminal assemblies are of larger diameter than the diameter of the combination of the fusible element and the element support mem... | 10/21/1980 |
| 4195201 | Inductive coil module A plurality of inductive coils (FIG. 4; 10--10) are mounted in a coil module (30) which is comprised of an elongated housing (31) having a substantially oval cross section. A potting compound (44) encapsulates the mounted coils (10--10) and a layer of epo... | 03/25/1980 |
| 4172272 | Solid state relay having U-shaped conductive heat sink frame A novel solid state relay package has a U-shaped metallic frame which defines three surfaces of the general rectangular relay package. The open end of the U receives a circuit board containing most of the relay components. The interior of the frame is the... | 10/23/1979 |
| 4049903 | Circuit film strip and manufacturing method Circuit film strip comprises a continuous strip of plastic film having a repetitive pattern of conductors thereon and indexing holes along its side edges. The indexing holes comprise a layer of metal on the film which extends over a punched hole in the fi... | 09/20/1977 |
| 4004199 | Electrical component seal A three membered capacitor sealing structure is disclosed including a lower vinyl thermoplastic layer, a layer of natural or synthetic rubber, and an upper layer for rigidity. The layers may contain vents, openings, and/or piercings.... | 01/18/1977 |
| 3986083 | Capacitor case cover disc seal and venting means An electrolytic capacitor comprising an open ended casing, said casing having an inner wall with means defining a tapered surface channel; and a resilient seal member compressibly supported by the tapered surface in the channel to form a hermetic seal for... | 10/12/1976 |
