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"During my service in the United States Congress, I took the initiative in creating the Internet."
Al Gore ; The basis for the later misquote by US Republicans that Gore had "invented" the Internet. Gore was the leading political champion of the modern-day Internet.
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| Number | Title | Issue Date |
| 8183469 | Wiring board and method of manufacturing the same A wiring board includes an external connection terminal of a cylindrical shape, in which an electrode terminal of the electronic component to be mounted is fitted. In one configuration, a portion of the external connection terminal is electrically connected to a pad... | 05/22/2012 |
| 8119932 | Wiring board and method of manufacturing the same First, a structure is fabricated by directly bonding a first base material and a second base material. The first base material has a recessed portion formed in a desired patterning layout on one surface thereof, and the bonding is performed in such a manner that the... | 02/21/2012 |
| 8110754 | Multi-layer wiring board and method of manufacturing the same A multi-layer wiring board without a core substrate includes: a multi-layer laminated structure; first terminals provided on a front surface of the multi-layer laminated structure; second terminals provided on a rear surface of the multi-layer laminated structure; t... | 02/07/2012 |
| 8017876 | Terminal portion of flexible print circuit board or flexible flat cable In a terminal portion having a copper or a copper alloy wiring according to one embodiment, the terminal portion being of a flexible print circuit board or a flexible flat cable and for connecter-fitting to a connector by being pressed by a connector pin, the copper... | 09/13/2011 |
| 7847198 | Wiring board and method for manufacturing the same, and semiconductor device A wiring board includes an insulating base; an adhesive layer formed on the surface of the insulating base; a conductor wiring formed on the surface of the adhesive layer; and a bump formed crossing the longitudinal direction of the conductor wiring over regions on ... | 12/07/2010 |
| 7732713 | Method to build robust mechanical structures on substrate surfaces A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated f... | 06/08/2010 |
| 7723620 | Lead pin for mounting semiconductor and printed wiring board A semiconductor loading lead pin that does not tilt at a time of reflow. A void is sometimes left in solder between an electrode pad and the flange of a semiconductor loading lead pin. When reflow is carried out to load an IC chip, the solder for connection is melte... | 05/25/2010 |
| 7714235 | Lithographically defined microelectronic contact structures Microelectronic contact structures (260, 360, 460) are lithographically defined and fabricated by applying a masking layer (220, 320, 420) on a surface of a substrate (202, 302, 402) such as an electronic component, creating an opening (222, ... | 05/11/2010 |
| 7696443 | Electronic device with a warped spring connector An electronic device comprises a substrate and at least a warped spring connector. The substrate has a signal bonding pad and a ground plane. The warped spring connector is disposed on the substrate and is connected to the bonding pad. The warped spring connector in... | 04/13/2010 |
| 7667144 | Circuit board and method of fabricating the same A circuit board including a dielectric layer, a circuit layer, at least one conductive joint column, and a solder mask layer is provided. The circuit layer having at least one pad is in contact with the dielectric layer. The conductive joint column is disposed on th... | 02/23/2010 |
| 7511229 | Sensor module, system, and method for sensors in proximity to circuit breakers The present disclosure provides a method and system for mounting a current transformer in proximity to a circuit breaker of an electrical system. Generally, a plurality of current transformers (CTs) are provided to measure a plurality of branches from a main power s... | 03/31/2009 |
| 7488899 | Compliant contact pin assembly and card system A compliant contact pin assembly and a contactor card system are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling str... | 02/10/2009 |
| 7399930 | Method and device for repair of a contact pad of a printed circuit board Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surfa... | 07/15/2008 |
| 7388296 | Wiring substrate and bonding pad composition A wiring substrate comprised of a substrate main body made of glass-ceramic, a pad formed on a surface of the substrate main body and a conductor pin provided in an upright position on the pad. The pad is comprised of a ceramic that is the same as the ceramic consti... | 06/17/2008 |
| 7363688 | Land grid array structures and methods for engineering change A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to... | 04/29/2008 |
| 7361983 | Semiconductor device and semiconductor assembly module with a gap-controlling lead structure In a semiconductor device (1), semiconductor elements (2) and (3) are mounted on a lead frame (5) having leads (4). The semiconductor elements (2) and (3) are connected with the leads (4) by metallic wires (... | 04/22/2008 |
| 7358116 | Substrate conductive post formation A substrate with at least one conductive post formed prior to the formation of an inter-layer dielectric (ILD) coating on the substrate. The conductive post may be formed from a metal layer of the substrate. Additionally, the conductive post may be built up on the s... | 04/15/2008 |
| 7351918 | Surface-mount base for electronic element A surface-mount base for an electronic element includes: an insulative supporting member having a through hole; a plurality of lead terminals each having an element connecting terminal, a lead portion and a mounting terminal, the lead terminals being mounted to the ... | 04/01/2008 |
| 7345247 | Circuit board threadplate A circuit board threadplate for connection of a component to a circuit board is provided wherein such threadplate may be mechanically mounted to a circuit board without the use of manual labor. Specifically, the threadplate is compatible with present Surface Mount T... | 03/18/2008 |
| 7342182 | Printed board A printed board suitable for having a LSI surface-mounted thereto and improves high-speed transfer characteristic while maintaining the circumference of a pad formed on the printed board. The pad is a connector pad consisting of a conductor pattern, and the area of ... | 03/11/2008 |
| 7337535 | Hole plugging method for printed circuit boards, and hole plugging device A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via hole, a through hole and a surface pattern of the printed circuit board ... | 03/04/2008 |
| 7319265 | Semiconductor chip assembly with precision-formed metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal ... | 01/15/2008 |
| 7304249 | Bonding pads for a printed circuit board Bonding pad(s) for a printed circuit board with circuit patterns are provided. The bonding pad(s) include a plurality of copper patterns formed on the PCB and electrically connected to the circuit patterns, a filler filled between the copper patterns such that an up... | 12/04/2007 |
| 7297563 | Method of making contact pin card system A compliant contact pin contactor card method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structur... | 11/20/2007 |
| 7291791 | Resin substrate A substrate is made of resin or a composite material. Pins with Au plating on their surface are soldered, with a soldering material made of Sn and Sb, to a substrate body having a first main surface, and formed into substantially a rectangular shape to project over ... | 11/06/2007 |
| 7287326 | Methods of forming a contact pin assembly A compliant contact pin assembly method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The... | 10/30/2007 |
| 7271347 | Wired circuit board A wired circuit board is provided having excellent heat radiation characteristics, including when the semiconductor device is mounted on the wired circuit board by the flip chip mounting method. An insulating base layer defines a base opening portion in a mounting r... | 09/18/2007 |
| 7268421 | Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip a... | 09/11/2007 |
| 7263769 | Multi-layered flexible print circuit board and manufacturing method thereof A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electri... | 09/04/2007 |
| 7264991 | Method of connecting a conductive trace to a semiconductor chip using conductive adhesive A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace, then disposing a conductive adhesive between the conductive trace and the chip, thereby mechanical... | 09/04/2007 |
| 7262975 | Multilayer printed wiring board A multilayer printed wiring board 10 includes: a build-up layer 30 that is formed on a core substrate 20 and has a conductor pattern 32 disposed on an upper surface; a low elastic modulus layer 40 that is formed on the build-up lay... | 08/28/2007 |
| 7262368 | Connection structures for microelectronic devices and methods for forming such structures Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive p... | 08/28/2007 |
| 7262082 | Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar... | 08/28/2007 |
| 7247951 | Chip carrier with oxidation protection layer A chip carrier comprising a laminated layer and an oxidation protection layer is provided. The oxidation protection layer is a non-electrolytic metallic coating or an organic oxidation protection film on the surface of bonding finger pads or other contacts formed by... | 07/24/2007 |
| 7244367 | Metal alloy elements in micromachined devices A micromechanical device is provided, which includes at least one flexible member formed from an alloy, where the alloy is made up of one or more noble metals and one or more alloying elements, wherein each of the alloying elements has an equilibrium solid solubilit... | 07/17/2007 |
| 7238890 | PTFE stud for ultrahigh-value resistor and method therefor A PTFE stud for an ultrahigh-value resistor includes a first portion to be mounted on a substrate and a second portion attached to the first portion so as to not be in contact with the surface of the substrate. The first portion is formed of insulating material and ... | 07/03/2007 |
| 7232706 | Method of making a semiconductor chip assembly with a precision-formed metal pillar A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7232707 | Method of making a semiconductor chip assembly with an interlocked contact terminal A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7226322 | Current supply point for a power and control unit of a battery-operated industrial truck A current supply point for a power and control unit of a battery-operated industrial truck wherein the power and control unit has a printed-circuit board inside a casing, the current supply point has a first component connectable to the printed-circuit board and a p... | 06/05/2007 |
| 7222776 | Printed wiring board and manufacturing method therefor A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating te... | 05/29/2007 |
