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"What, sir, would you make a ship sail against the wind and currents by lighting a bonfire under her deck? I pray you, excuse me, I have not the time to listen to such nonsense."
Napoleon Bonaparte ; When told of the Robert Fulton steamboat
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| Number | Title | Issue Date |
| 7427716 | Microvia structure and fabrication A system may include a first microvia pad, a second microvia pad having a projection extending in a direction toward the first microvia pad, and a microvia electrically coupled to the first microvia pad and to the second microvia pad. ... | 09/23/2008 |
| 7352019 | Capacitance reduction by tunnel formation for use with a semiconductor device A method used during the manufacture of a semiconductor device comprises providing at least first, second, and third spaced conductive structures, where the second conductive structure is interposed between the first and third conductive structures. A first dielectr... | 04/01/2008 |
| 7348494 | Signal layer interconnects Inner layer traces on a multilayer printed wiring board are exposed to enable direct interconnection with another device such as a printed wiring board. The traces may be exposed by removing at least some of the dielectric substrate material around the traces, or by... | 03/25/2008 |
| 7339796 | Electrical circuit having a multilayer printed circuit board An electrical circuit includes a multilayer printed circuit board and a housing which shields against electromagnetic interference. A portion of at least one outer layer of the printed circuit board are in the form of contact areas which are connected to a respectiv... | 03/04/2008 |
| 7323762 | Semiconductor package substrate with embedded resistors and method for fabricating the same A semiconductor package substrate with embedded resistors and a method for fabricating the same are proposed. Firstly, an inner circuit board having a first circuit layer thereon is provided, and a plurality of resistor electrodes are formed in the fist circuit laye... | 01/29/2008 |
| 7324350 | MEMS RF switch module including a vertical via An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap section. The vertical via passes through the cap section to electricall... | 01/29/2008 |
| 7317233 | Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to... | 01/08/2008 |
| 7312553 | Micromechanical component and method for producing same A micromechanical component and a method for producing the component are provided. The micromechanical component includes a substrate and a micromechanical functional layer of a first material provided over the substrate. The functional layer has a first and second ... | 12/25/2007 |
| 7301097 | Printed-circuit board and electronic device A printed-circuit board includes a shield pattern layer that is stacked on a surface layer with respect to at least one wiring pattern layer that includes a wide-pattern area having a wiring width of more than 1 millimeter. Moreover, the shield pattern layer include... | 11/27/2007 |
| 7239024 | Semiconductor package with recess for die A semiconductor package is disclosed with a recess (51) for an integrated circuit die (52). The recess is made by bending or deforming all layers of a package substrate, and therefore the recess contains circuitry to connect to the integrated circuit d... | 07/03/2007 |
| 7239487 | Micro-electro-mechanical actuator for positioning a device such as a read/write head in a disk drive A micro-electro-mechanical device formed by a body of semiconductor material having a thickness and defining a mobile part and a fixed part. The mobile part is formed by a mobile platform, supporting arms extending from the mobile platform to the fixed part, and by ... | 07/03/2007 |
| 7235493 | Low-k dielectric process for multilevel interconnection using mircocavity engineering during electric circuit manufacture One embodiment of a method for forming a low-k dielectric for a semiconductor device assembly comprises forming a silicon dioxide layer, then forming a patterned masking layer such as silicon nitride on the silicon dioxide. Using the patterned nitride layer as a pat... | 06/26/2007 |
| 7199452 | Semiconductor device and manufacturing method for same A semiconductor device in which semiconductor chip(s) is or are mounted onto substrate(s) incorporating patterned wiring and the entirety or entireties has or have been sealed with resin(s), wherein by forming electrically conductive pattern(s) for shielding at end ... | 04/03/2007 |
| 7190157 | Method and apparatus for layout independent test point placement on a printed circuit board A layout independent test access point structure for accessing test points of a printed circuit board and method of fabrication thereof is presented. Each test access point structure is conductively connected to various locations along a trace at a test access point... | 03/13/2007 |
| 7149095 | Stacked microelectronic assemblies A stacked microelectronic assembly includes a plurality of microelectronic subassemblies. Each subassembly includes a substrate having at least one site, a plurality of first contacts and a plurality of second contacts. Each subassembly also has at least one microel... | 12/12/2006 |
| 7135377 | Semiconductor package substrate with embedded resistors and method for fabricating same A semiconductor package substrate with embedded resistors and a method for fabricating the same are proposed. Firstly, an inner circuit board having a first circuit layer thereon is provided, and a plurality of resistor electrodes are formed in the fist circuit laye... | 11/14/2006 |
| 7115975 | Semiconductor device, process of producing semiconductor device, and ink jet recording head When bonding inner leads of a flexible film wiring board to electrode pads of a semiconductor element substrate, by absorbing a stress generated due to a difference in thermal expansion coefficient between the flexible film wiring board and the semiconductor element... | 10/03/2006 |
| 7098571 | Electrostatic actuator for microelectromechanical systems and methods of fabrication A method and apparatus are described that may be used to provide decoupled rotation of structures about different pivot points. The apparatus may include one or more fixed blades mounted to a frame or substrate, one or more movable blades mounted to each structure t... | 08/29/2006 |
| 7098078 | Microelectronic component and assembly having leads with offset portions A microelectronic component comprising a dielectric layer having an opening and leads extending across the opening is disclosed. The leads have an offset portion. A method of making a microelectronic assembly comprises connecting each of the leads to a contact on a ... | 08/29/2006 |
| 7084354 | PCB method and apparatus for producing landless interconnects An electronic assembly is disclosed. The electronic assembly includes a lower portion and a first elongate trace formed on an upper surface of the lower portion. The trace is covered by an upper portion, and an opening formed through an upper surface of the upper po... | 08/01/2006 |
| 7083997 | Bonded wafer optical MEMS process A microelectromechanical system is fabricated from a substrate having a handle layer, a silicon sacrificial layer and a device layer. A micromechanical structure is etched in the device layer and the underlying silicon sacrificial layer is etched away to release the... | 08/01/2006 |
| 7079301 | MEMS device and method of forming MEMS device A method of forming a MEMS device includes providing a substructure including a base material and at least one conductive layer formed on a side of the base material, forming a dielectric layer over the at least one conductive layer of the substructure, defining an ... | 07/18/2006 |
| 7071424 | Multilayer printed wiring board having filled-via structure The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The m... | 07/04/2006 |
| 7057116 | Selective reference plane bridge(s) on folded package An apparatus including a substrate having dimensions suitable as a support circuit for at least one integrated circuit, the substrate comprising a laterally extending plication region defining first and second longitudinal portions; a plurality of conductive traces ... | 06/06/2006 |
| 7049526 | Microvia structure and fabrication A system may include a first microvia pad, a second microvia pad having a projection extending in a direction toward the first microvia pad, and a microvia electrically coupled to the first microvia pad and to the second microvia pad. ... | 05/23/2006 |
| 7037745 | Method of making electrical connections to hermetically sealed MEMS devices In the manufacture of a MEMS device having a semiconductor-on-insulator substrate with a first portion closed by a lid to provide a hermetically sealed region and an second portion external to said hermetically sealed region, a method of providing electrical connect... | 05/02/2006 |
| 7034231 | Method for the manufacture of printed circuit boards with plated resistors A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as... | 04/25/2006 |
| 7023065 | Capacitive resonators and methods of fabrication A micro-electro-mechanical system (MEMS) capacitive resonator and methods for manufacturing the same are invented and disclosed. In one embodiment, a method comprises forming trenches in a substrate, conformally coating the substrate with an oxide, filling the coate... | 04/04/2006 |
| 6995314 | HF module and method of assembling the same The present invention relates to measures that enable simple assembly of a high-frequency (HF) module. The HF module includes a HF circuit board (1), on which at least one first antenna part (6) is located, a housing part (2), on which at least ... | 02/07/2006 |
| 6975124 | Multipoint nanoprobe A nanoprobe includes a substrate having a layer, which forms a projected portion. A plurality of conductive lines is adhered to the projected portion and the lines extend beyond an end of the projected portion by a distance to form contact points, wherein the lines ... | 12/13/2005 |
| 6972379 | Circuit board and a method for making the same A method 10 for making a multi-layer electronic circuit board 110 having electroplated apertures 18, 20 which may be selectively and electrically isolated from electrically grounded member 12 and further having selectively formed air brid... | 12/06/2005 |
| 6961995 | Method of making an electronic package An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of diele... | 11/08/2005 |
| 6956287 | Electronic component with flexible bonding pads and method of producing such a component An electronic component with an electronic circuit and electrical contacts, disposed at least on a first surface of the electronic component, for the electrical bonding of the electronic circuit includes at least one flexible elevation of an insulating material disp... | 10/18/2005 |
| 6943414 | Method for fabricating a metal resistor in an IC chip and related structure According to one exemplary embodiment, an integrated circuit chip comprises a first interconnect metal layer. The integrated circuit chip further comprises a first intermediate dielectric layer situated over the first interconnect metal layer. The integrated circuit... | 09/13/2005 |
| 6943303 | Multilayer printed wiring board having filled-via structure The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The m... | 09/13/2005 |
| 6929504 | Combined electrical connector and radiator for high current applications An electrical connector useful for both high-current and low-current applications including a first and a second conductive terminals, in which the terminals are interconnected by a plurality of substantially rigid and elongated conductive strips and apertures or ga... | 08/16/2005 |
| 6927346 | Surface mount technology to via-in-pad interconnections Apparatus and methods for interconnecting a SMT component interconnect to a via-in-pad (VIP) interconnect. A first reflowable material is deposited on the VIP bond pad. A sphere having a higher melt temperature than the reflow temperature of the first interconnect m... | 08/09/2005 |
| 6914709 | MEMS device and method of forming MEMS device A method of forming a MEMS device includes providing a substructure including a base material and at least one conductive layer formed on a side of the base material, forming a dielectric layer over the at least one conductive layer of the substructure, defining an ... | 07/05/2005 |
| 6909128 | Capacitance reduction by tunnel formation for use with a semiconductor device A method used during the manufacture of a semiconductor device comprises providing at least first, second, and third spaced conductive structures, where the second conductive structure is interposed between the first and third conductive structures. A first dielectr... | 06/21/2005 |
| 6909221 | Piezoelectric on semiconductor-on-insulator microelectromechanical resonators A piezoelectric resonator is disclosed. In one embodiment the piezoelectric resonator includes a resonating member having a bi-directionally adjustable resonance frequency, the resonating member including a semiconductor material of a semiconductor-on-insulator wafe... | 06/21/2005 |
