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| Number | Title | Issue Date |
| 8134077 | Heat dissipating circuit board and method of manufacturing the same Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating fram... | 03/13/2012 |
| 8110746 | Cooling of substrate using interposer channels A structure. The structure includes an interposer adapted to be interposed between a heat source and a heat sink and to transfer heat from the heat source to the heat sink. The interposer includes an enclosure that encloses a cavity. The enclosure is made of a therm... | 02/07/2012 |
| 8106303 | Printed wiring board including a thermal land for supressing heat dissipation When soldering is performed, heat transferred from through hole 6b is caused to bypass a mesh-like copper foil region between non-copper-foil regions and thus the transfer of heat to a solid pattern region around thermal land 13b is delay... | 01/31/2012 |
| 8106302 | Circuit board of communication product and manufacturing method thereof The present invention provides a circuit board of a communication product and a manufacturing method thereof. The circuit board comprises a main body of a circuit board and an isolation cover. A surface of the main body of the circuit board has a power transistor, a... | 01/31/2012 |
| 8076586 | Heat conduction from an embedded component This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the... | 12/13/2011 |
| 8039752 | Heat dissipation structure of a print circuit board A heat dissipating structure of a print circuit board to improve heat-dissipation efficiency for mounted electronic components while retaining required soldering strength is disclosed. The heat dissipation structure of a print circuit board comprising a stack... | 10/18/2011 |
| 8022306 | Printed circuit board and method of manufacturing the same A mounting region is provided at a substantially center of one surface of an insulating layer. A metal layer is provided on the other surface of the insulating layer. A slit is formed to cross a region (an opposite region) of the metal layer that coincides with the ... | 09/20/2011 |
| 8017872 | System and method for proportional cooling with liquid metal A circuit board may include a pump and a channel. The channel may include a liquid metal and a coating. The liquid metal may be pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least porti... | 09/13/2011 |
| 8008579 | Printed circuit board providing heat dissipation A printed circuit board includes an insulated base sheet, a heat-conducting layer, and a plurality of heat-conducting blocks. The heat-conducting layer is disposed on the insulated base sheet. The heat-conducting blocks are formed on the heat-conducting layer. Each ... | 08/30/2011 |
| 7985926 | Printed circuit board and electronic component device A base material in which a base insulating layer and a metallic layer are laminated is prepared. The metallic layer is processed into a predetermined pattern to form conductor patterns including terminal parts. A hole is formed in a region under a predetermined term... | 07/26/2011 |
| 7960655 | Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module A PCB can include an insulating member, a cooling member, and a circuit pattern. The cooling member can be built into the insulating member. The cooling member can have a cooling passageway through which a cooling fluid can flow. The circuit pattern can be formed on... | 06/14/2011 |
| 7947906 | Printed circuit board and manufacturing method thereof A multi-layer printed circuit board and a method of manufacturing the multi-layer printed circuit board using a metal substrate as a core member and having an electronic component embedded in the metal substrate, the method including anodizing the metal substrate su... | 05/24/2011 |
| 7943855 | Flexible printed circuit board and electronic component assembly A flexible printed circuit (FPC) and electronic component assembly. The FPC comprises a first protective layer having a first opening, a main layer on the first protective layer, and a second protective layer having a second opening exposing the main layer. The heat... | 05/17/2011 |
| 7919714 | System and a method for controlling flow of solder An assembly including a solder wettable surface is provided. The assembly also includes a metal mask configured to restrict solder from flowing outside the solder wettable surface. ... | 04/05/2011 |
| 7906731 | Light emitting module, lighting device and display device A lighting device includes a heatsink 70, a socket 10 and an LED module 60. The LED module 60 has a light emitting unit 62 in a central part of a top side of a metal base substrate 63 composed of an insulating plate and a me... | 03/15/2011 |
| 7888600 | Circuit board and electrical connection box having the same A circuit board includes a metal core having a plate shape, an insulation section covering a surface of the metal core, and a heat radiation section in which the metal core is exposed and which is provided at a circumference of the metal core. ... | 02/15/2011 |
| 7888602 | Printed circuit board having air vent for molding and package using the same Provided is a printed circuit board having air vents and a semiconductor package that uses the printed circuit board having the air vents. The printed circuit board includes a substrate layer having a circuit pattern and a protection layer formed on the substrate la... | 02/15/2011 |
| 7888603 | Cooling of substrate using interposer channels A structure. The structure includes a substrate and an interposer. The substrate includes a heat source and N continuous substrate channels on a first side of the substrate (N≧2). The interposer includes N continuous interposer channels coupled to the N substrate ... | 02/15/2011 |
| 7888601 | Bus bar interconnection techniques One system of the present application includes an electronic assembly with a heat dissipating device, printed wiring board with electronic circuitry, bus bar, insulative grommet, and fastener. The board defines a bus with an interconnection pad and a board opening. ... | 02/15/2011 |
| 7804030 | Printed circuit board A circuit board (1) has a top face (2) for positioning an electronic component and a bottom face (4) used as a support on a heat-dissipating base. A plurality of heat transfer holes (12) provide heat transfer from the top face (2) ... | 09/28/2010 |
| 7754974 | Metal-core substrate and apparatus utilizing the same The present invention is to provide a metal-core substrate without mounting large size terminals and connectors. Hence, the metal-core substrate can be smaller and thinner. A metal-core substrate includes a metal plate, an insulating layer formed on a surface of the... | 07/13/2010 |
| 7754975 | Plastic component having heat resistant hardened resin at thermal-attachment connection points A plastic component with a metal layer applied to the surface for electrical contacting of electrical elements ensuing in a thermal attachment method, particularly in a soldering method, has a layer composed of a duroplastic synthetic or a highly heat-resistant ther... | 07/13/2010 |
| 7728231 | Light emitting module, lighting device, and display device A lighting device includes a heatsink 70, a socket 10 and an LED module 60. The LED module 60 has a light emitting unit 62 in a central part of a top side of a metal base substrate 63 composed of an insulating plate and a me... | 06/01/2010 |
| 7638714 | Structure and manufacturing method of substrate board A method for manufacturing a substrate board with high efficiency of heat conduction and electrical isolation is disclosed. The method comprises the steps of: providing a substrate layer with an arrangement surface and a heat-dissipating surface; executing an anodic... | 12/29/2009 |
| 7626124 | Wiring board A wiring board has a circuit pattern that includes metal foil attached to an insulating layer, and a built-up circuit pattern disposed on top of the metal foil circuit pattern. The built-up circuit pattern is an increased thickness laminate of cold spray processed m... | 12/01/2009 |
| 7607790 | Backlighting apparatus and manufacturing process Apparatuses for backlighting and manufacturing processes thereof are disclosed. There is provided a backlight module. The backlight module comprises a double-sided circuit board with thermal conducting material as one of the core layers; a plurality of light source ... | 10/27/2009 |
| 7554039 | Electronic device In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a motherboard is maintained. In the invention, a metal core base material of grea... | 06/30/2009 |
| 7514636 | Circuit component module, electronic circuit device, and method for manufacturing the circuit component module A circuit component module includes a heat-releasing plate, a resin film stacked on a surface of the heat-releasing plate, an electronic component embedded in the first resin film and partially in contact with the heat-releasing plate, and a wiring pattern embedded ... | 04/07/2009 |
| 7443678 | Flexible circuit board with heat sink A novel flexible circuit board with heat dissipation ability is provided. The flexible circuit board includes a heat sink and a heat spreader having at least one circuit substrate mounted thereon. The heat spreader has a first lower surface and a first upper surface... | 10/28/2008 |
| 7440278 | Water-cooling heat dissipator A water-cooling heat dissipator mounted on an electronic heat-generating element includes a water-cooling head member and at least one heat pipe. The water-cooling head member includes a first cover and a second cover connected to the first cover. Both ends of the f... | 10/21/2008 |
| 7434308 | Cooling of substrate using interposer channels A structure, and method of forming and cooling the structure. The structure may include a substrate (e.g., a semiconductor chip) having N continuous substrate channels and an interposer having N continuous interposer channels (N≧2). The N interposer channels are c... | 10/14/2008 |
| 7420126 | Circuit board and circuit apparatus using the same A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a requirement as to heat radiation capability. The circuit apparatus has th... | 09/02/2008 |
| 7400506 | Method and apparatus for cooling a memory device A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat sink is included that is separate from the first heat sink and is op... | 07/15/2008 |
| 7397664 | Heatspreader for single-device and multi-device modules A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric base coupled to the perimeter of the heatsink base. Each of the slider p... | 07/08/2008 |
| 7397666 | Wedge lock Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis. ... | 07/08/2008 |
| 7388753 | Methods and apparatuses for thermal dissipation A method and apparatus for providing thermal dissipation from a PC card is disclosed. For one embodiment of the invention, an extension portion, having a heat sink implemented thereon, is provided for a PC card. The extension portion extends beyond the PC card slot ... | 06/17/2008 |
| 7388752 | Series-connected heat dissipater coupled by heat pipe A series-connected heat dissipater coupled by heat-pipe used for the interface cards of a computer system. Wherein, a plurality of additional auxiliary dissipaters are provided onto the insertion slots adjacent to the interface cards, and are connected to the main d... | 06/17/2008 |
| 7382618 | Heat dissipating apparatus for computer add-on cards A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of fins, a fan for blowing air toward the fins and a cover for covering the... | 06/03/2008 |
| 7375963 | System and method for cooling a module Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of n... | 05/20/2008 |
| 7368825 | Power semiconductor device The present invention is directed to a power semiconductor device in which a control circuit controls a power switching element, comprising: a semiconductor substrate having a front surface and a back surface; a capacitor disposed on the front surface side of the se... | 05/06/2008 |
