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...that Kleenex tissue was originally designed to be a gas mask filter? It was developed at the beginning of World War I to replace cotton, which was then in short supply as a surgical dressing.
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| Number | Title | Issue Date |
| 8158886 | Recycling printed circuit boards A method of recycling radio frequency printed circuit boards comprising track material printed on a laminate having a known dielectric constant using the steps of separating the substrate of one or more circuit boards from the track material; and processing the sepa... | 04/17/2012 |
| 8153901 | Method for fabricating multilayer circuit board, circuit plate, and method for fabricating the circuit plate A multilayer circuit board is fabricated by: preparing a film comprising a first protective film and a first interlayer adhesive; preparing a first circuit board having a first base and a conductive post protruding therefrom; stacking the first interlayer adhesive a... | 04/10/2012 |
| 8148641 | Anisotropic conductive material, connected structure, and production method thereof An anisotropic conductive material prevents conduction resistance from varying among bumps or among linear terminals when connecting an IC chip or a flexible wire to a wiring board via the anisotropic conductive material. The anisotropic conductive material is forme... | 04/03/2012 |
| 8138422 | Printed circuit board with conductive ink/paste, having plating layers, and method for manufacturing the same A Printed Circuit Board (PCB) and a method for manufacturing the same are provided. A circuit pattern is formed by printing conductive ink/paste on a substrate, and sintering a layer of the conductive ink or curing a layer of the conductive paste by applying heat. A... | 03/20/2012 |
| 8124879 | Printed board A printed wiring board includes a substrate member, terminals and wiring pattern. The terminals are formed in a specific shape on the substrate member and arranged to be aligned in a specific arrangement direction on the substrate member. The wiring pattern is forme... | 02/28/2012 |
| 8097811 | Substrate for suspension A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in th... | 01/17/2012 |
| 8076585 | Printed circuit board A printed circuit board includes a ground layer and a signal layer. The ground layer has a grid formed by grid lines. A pair of signal traces is laid on the signal layer. The pair of signal traces is symmetrical about one grid line or one central line of the grid. | 12/13/2011 |
| 8071882 | Metal base circuit board, LED, and LED light source unit To provide a thin metal base circuit board which can be not only installed on a flat portion but also closely attached to a side or bottom surface of a case or to a stepped or curved portion and which is excellent in heat dissipation performance, electrical insulati... | 12/06/2011 |
| 8071881 | Wiring board, method for manufacturing same and semiconductor device A wiring board which includes a product portion configured with at least one layer of electrically insulating base, a wiring pattern formed on the surface or inner portion of the electrically insulating base, and a wiring protection layer which is formed on the surf... | 12/06/2011 |
| 8067695 | Wiring board and method of manufacturing the same A wiring board (package) includes: a cavity formed at a position corresponding to a chip mounting area of the outermost insulating layer on one side of both surfaces of the wiring board; a pad exposed from the surface of the insulating layer in the cavity; and a pad... | 11/29/2011 |
| 8058558 | Printed circuit board and manufacturing method thereof A printed circuit board and a manufacturing method thereof are disclosed. Using a method of manufacturing a printed circuit board which includes forming a circuit pattern, which includes lands, on a first board; forming a paste bump on the land of the first board; a... | 11/15/2011 |
| 8058557 | Printed circuit board An exemplary PCB includes a first reference layer, a first signal layer, a second signal layer, and a third signal layer in that order, a first differential pair is arranged in the first signal layer in edge-coupled structure and references the first reference layer... | 11/15/2011 |
| 8053673 | Capacitor embedded printed circuit board A capacitor embedded printed circuit board (PCB) includes a multilayer polymer capacitor layer with a plurality of polymer sheets. One or more first inner electrodes and second inner electrodes, separated by one or more of the plurality of polymer sheets, are altern... | 11/08/2011 |
| 8049110 | Microelectronic device A method of manufacturing a microelectronic device including imprinting a layer on a substrate with an imprinted pattern, the imprinted pattern defining a first anchor impression within the layer that includes a first base region positioned adjacent the layer and a ... | 11/01/2011 |
| 8049111 | Printed circuit board and method of manufacturing the same A first insulating layer is formed on a suspension body. Wiring traces are formed in parallel at an interval on the first insulating layer. A second insulating layer is formed in a region on the first insulating layer on both sides of the wiring traces. A wiring tra... | 11/01/2011 |
| 8035033 | Wiring substrate with plurality of wiring and insulating layers with a solder resist layer covering a wiring layer on the outside of outer insulating layer but exposing the holes in the outer insulating layer In a wiring substrate in which plural wiring layers and insulating layers are alternately stacked and the adjacent wiring layers are electrically connected through a via hole formed in the insulating layer, plural holes constructing substrate management information ... | 10/11/2011 |
| 8022305 | Semiconductor device with a wiring board having an angled linear part A semiconductor device fabrication method includes: forming an elongated hole 5 in a wiring board plate along a perimeter line 3 of a plurality of wiring board regions defined over the wiring board plate with a connecting portion left unremoved at a co... | 09/20/2011 |
| 8017871 | Wired circuit board assembly sheet A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks.... | 09/13/2011 |
| 8013253 | Electrical connection board and assembly of such a board and a semiconductor component comprising an integrated circuit chip An electrical connection board includes electrical connection terminals on one face with a view toward connecting with a semiconductor component and electrical connection tracks connected respectively to these terminals. The terminals are arranged in a square matrix... | 09/06/2011 |
| 7989705 | Circuit card and method for increasing the resistance of a circuit card to the formation of conductive filaments The present invention relates to a circuit card (4.3; 4.4) which includes conductive patterns (1, 2, 5, 6) and a web (3) made of glass fibers, at least one non-conductive blocking element (11.1; 11.2) for blocking the growth of a conducti... | 08/02/2011 |
| 7921403 | Controlling impedance and thickness variations for multilayer electronic structures Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inher... | 04/05/2011 |
| 7888599 | Printed circuit board including embedded capacitor and method of fabricating same Disclosed is a PCB including an embedded capacitor and a method of fabricating the same. The long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible. ... | 02/15/2011 |
| 7847195 | Adhesive closing device provided with a switching circuit A closing device (1, 101, 201, 301) includes a plurality of adhesive closing elements (2) in the form of a hook, mushroom head or clasp, and a flat support (3, 103, 203, 303). The adhesive closing elements (2) protruded from at least one ... | 12/07/2010 |
| 7834273 | Multilayer printed wiring board A multilayer printed wiring board comprises a plurality of insulating layers which is about 100 μm or less in thickness and a plurality of conductor circuits formed on the insulating layers. Each of a plurality of viaholes electrically connecting conductor circuits... | 11/16/2010 |
| 7816608 | CTS and inspecting method thereof A substrate for inspecting a thickness of contacts at least includes a dielectric layer, a first metal layer, and a second metal layer. The first metal layer which includes a circuit region and a testing region is formed on an upper surface of the dielectric layer, ... | 10/19/2010 |
| 7790985 | Device for repair of a contact pad of a printed circuit board Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surfa... | 09/07/2010 |
| 7709744 | Gas venting component mounting pad Venting for component mounting pads of surface mount circuit boards allows the escape of gases from the junction between an electrical component and its associated mounting pad during soldering and facilitates a more complete and effective solder joint between the c... | 05/04/2010 |
| 7692101 | Reduction of jitter in a semiconductor device by controlling printed circuit board and package substrate stackup A model and method are provided for lowering device jitter by controlling the stackup of PCB planes so as to minimize inductance between a FPGA and PCB voltage planes for critical core voltages within the FPGA. Furthermore, a model and method are provided for loweri... | 04/06/2010 |
| 7645940 | Substrate with via and pad structures This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surroundi... | 01/12/2010 |
| 7635814 | Printed circuit board A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween and a first differential pair and a second differential pair each having a positive differential trace and a negative differential trace. The positive d... | 12/22/2009 |
| 7615704 | Multiple digital printing techniques for fabricating printed circuits Methods of fabricating a printed circuit and printed circuits, including a method comprising: (a) depositing a conductive material to form a first conductive pathway upon a substrate; (b) depositing a dielectric material directly over at least a first portion of the... | 11/10/2009 |
| 7595452 | Circuit board and method for its production The invention relates to a circuit board and a method for its production. The highly flexible circuit board includes electrically non-conductive threads and electrically conductive threads. These threads form a fabric with a regular mesh structure. In the latter at ... | 09/29/2009 |
| 7592551 | Wired circuit board assembly sheet A wired circuit board assembly sheet having a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing mar... | 09/22/2009 |
| 7576287 | Lot traceable printed circuit board A lot traceable printed circuit board (PCB) includes a substrate having thereon a patterned circuit layer and a working zone carrying production information related to the PCB itself. The working zone includes a plurality of code boxes, wherein each of the code boxe... | 08/18/2009 |
| 7550678 | Plasma display module In a plasma display module, a flexible substrate is strengthened and a mounting structure for alleviating stresses is provided, thereby preventing the metal fatigue of wirings. In a PDP (Plasma Display Panel) module, a metal plate and a flexible substrate constituti... | 06/23/2009 |
| 7531751 | Method and system for an improved package substrate for use with a semiconductor package Systems and methods for a structure for a package substrate for use in a semiconductor package are disclosed. Package substrates formed according to the systems and methods of the present invention may exhibit improved signal integrity and quality. In order to achie... | 05/12/2009 |
| 7504589 | Method and apparatus for manufacturing and probing printed circuit board test access point structures A test access point structure for accessing test points of a printed circuit board and method of fabrication thereof is presented. Each test access point structure is conductively connected to a trace at a test access point and above an exposed surface of the printe... | 03/17/2009 |
| 7498520 | Semiconductor multilayer wiring board and method of forming the same A silica-based interlayer insulating layer having a low dielectric constant is formed with SOG material on a substrate, in which a wiring-layer forming space is then formed. If necessary, a UV ray irradiation is performed under an oxidizing atmosphere. A Si—OH bon... | 03/03/2009 |
| 7476811 | Semiconductor device and manufacturing method therefor A semiconductor device includes: a semiconductor element; a circuit substrate having a cavity at a center thereof; a heat radiating member having the semiconductor element bonded at a central portion thereof; and a sealing resin configured to seal the semiconductor ... | 01/13/2009 |
| 7442091 | Back-to-back PCB double-sided USB connector A double-sided USB connector may include a first PCB that may provide a first set of electrical contacts on its first side and solder pads on its second side. The first PCB may further include a components side, solder pads, and signal traces. The double-sided USB c... | 10/28/2008 |
